US3930295A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tool for fabricating diode array
Assignee: Signetics Corp
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Filing: 1974-03-04
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Granted: 1976-01-06
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Expires: 1994-03-04
Abstract
Abstract A method for fabricating a semiconductor diode array, utilizing an alignment tool to precisely position a plurality of diodes so that they can be bonded into a precision array. The alignment tool and a method for fabricating the tool are also disclosed.
Inventors
- 👤 Ralph E. Rose
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 21:41
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; Y; Y10; Y10S; Y10S269/00; Y10S269/903; Y10T; Y10T29/00; Y10T29/53; Y10T29/5313; Y10T29/53261
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
144 words
In an alignment tool for positioning discrete diodes of the type having diode bond pads so they can be bonded into an array, a semiconductor body having substantially parallel top and bottom planar surfaces, said top surface of the body having a plurality of spaced top recesses formed therein having walls forming alignment surfaces extending from the top surface into the body, wherein said alignment surfaces and said diode body in combination mutually co-act to position said diodes, said recesses being adapted to receive the diode body and having a predefined depth so that the diode bond pads protrude above the top surface of the body, said bottom surface of the body having a plurality of spaced bottom recesses formed therein underlying the top recesses and having walls extending from the bottom surface into the body and intersecting the walls of the top recesses.
Claim 2
Dependent Claim
144 words
In an alignment tool for positioning discrete diodes of the type having diode bond pads so they can be bonded into an array, a semiconductor body having substantially parallel top and bottom planar surfaces, said top surface of the body having a plurality of spaced top recesses formed therein having walls forming alignment surfaces extending from the top surface into the body, wherein said alignment surfaces and said diode body in combination mutually co-act to position said diodes, said recesses being adapted to receive the diode body and having a predefined depth so that the diode bond pads protrude above the top surface of the body, said bottom surface of the body having a plurality of spaced bottom recesses formed therein underlying the top recesses and having walls extending from the bottom surface into the body and intersecting the walls of the top recesses.
Claim 3
Dependent Claim
91 words
An alignment tool as in claim 1 wherein the semiconductor body is a silicon body, the outer peripheries of the top recesses in the top surface are spaced a distance of 1 mil or greater, and where the intersection of the top and bottom recesses defines a subsurface plane substantially parallel to said top and bottom surfaces, and wherein the walls of the bottom recesses intersect the subsurface plane entirely within the intersection of the walls of the top recesses and the subsurface to thereby form a shoulder within the body.
Claim 4
Dependent Claim
74 words
An alignment tool as in claim 2 wherein said top recesses are rectangular in shape in the top surface and have downward inwardly tapering walls, said bottom recesses are rectangular in shape in the bottom surface and have upward inwardly tapering walls, and wherein said tool has a relatively thin passivating layer formed as an oxide of the body on the alignment surfaces of said recesses and on the exposed surfaces of the body.
Claim 5
Dependent Claim
145 words
In an alignment tool for positioning discrete diodes of the type have diode bond pads so they can be bonded into an array, a semiconductor body having substantially parallel top and bottom planar surfaces, said top surface of the body having a plurality of spaced top recesses formed therein having walls extending from the top surface into the body and adapted to receive the diode body with the diode bond pads protruding above the top surface of the body, said bottom surface of the body having a plurality of spaced bottom recesses formed therein underlying the top recesses and having walls extending from the bottom surface into the body and intersecting the walls of the top recesses, said walls of the top recesses defining a smaller area within said body than the area defined by said walls of the top recesses at said top surfaces.
Claim 6
Dependent Claim
145 words
In an alignment tool for positioning discrete diodes of the type have diode bond pads so they can be bonded into an array, a semiconductor body having substantially parallel top and bottom planar surfaces, said top surface of the body having a plurality of spaced top recesses formed therein having walls extending from the top surface into the body and adapted to receive the diode body with the diode bond pads protruding above the top surface of the body, said bottom surface of the body having a plurality of spaced bottom recesses formed therein underlying the top recesses and having walls extending from the bottom surface into the body and intersecting the walls of the top recesses, said walls of the top recesses defining a smaller area within said body than the area defined by said walls of the top recesses at said top surfaces.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-01-05 | 1979-07-07 | 1980-01-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-01-05 | 1983-07-07 | 1984-01-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-01-05 | 1987-07-07 | 1988-01-06 | $7700.00 | Window Closed / Lapsed |