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US3604108A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for handling, testing and bonding of beam-leaded devices

Assignee: AT&T Inc
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Filing: 1969-10-07
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Granted: 1971-09-14
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Expires: 1989-10-07
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Abstract

Abstract Beam-leaded devices are handled at and after a test stage by a precision movement system requiring only a single pickup of each device from its position as received. A pickup tool is brought in contact with the beam leads of successive devices and pulseheated to melt the carrier wax and effect a tack bond of the head and leads. Without disturbing the device alignment, the head transfers the device to a prepositioned test station where full dynamic testing occurs. Thereafter, the head moves the device to a carrier, a substrate for bonding or a discard bin.

Inventors

  • 👤 Paul Mallery

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 22:53
CPC Classifications
H; H10; H10W; H10W99/00; G; G01; G01R; G01R31/00; G01R31/28; G01R31/2851; G01R31/2886; G01R31/2893; H10P; H10P72/00; H10P72/04; H10P72/0446; H10P72/06; H10P72/0611; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 133 words
Handling method for the test stage in beam-leaded device manufacture in which the devices as received are arrayed in wax on a substrate with said leads oriented in an X-Z sense, comprising the steps of: positioning successive said devices at a first fixed point in an X-Z plane by suitably orienting in an X-Z sense said substrate and then periodically indexing same, acquiring said device at said first point by pulse-heating a pickup head to effect a light tack bond to said leads and also vacuum-holding said device to said head, moving said head in an X-Y plane from said first point to a test station comprising a compliant pad disposed at a second fixed point and having X-Z oriented test leads, and after testing, moving said head to a selected further point.
Claim 2
Dependent Claim 133 words
Handling method for the test stage in beam-leaded device manufacture in which the devices as received are arrayed in wax on a substrate with said leads oriented in an X-Z sense, comprising the steps of: positioning successive said devices at a first fixed point in an X-Z plane by suitably orienting in an X-Z sense said substrate and then periodically indexing same, acquiring said device at said first point by pulse-heating a pickup head to effect a light tack bond to said leads and also vacuum-holding said device to said head, moving said head in an X-Y plane from said first point to a test station comprising a compliant pad disposed at a second fixed point and having X-Z oriented test leads, and after testing, moving said head to a selected further point.
Claim 3
Dependent Claim 33 words
Handling method as per claim 1, wherein said further point is a discard bin, and comprising the further step of applying a gas blast from said head to aid in disengaging said device.
Claim 4
Dependent Claim 48 words
Handling method as per claim 1, wherein said further point is a storage carrier indexable in an X-Z plane, and comprising the further steps of indexing said carrier to coincide a selected region thereof with said further point, and depositing said device onto said region from said head.
Claim 5
Dependent Claim 22 words
Handling method as per claim 1, wherein said further point is a bonding station for affixing said successive devices to circuit substrates.
Claim 6
Dependent Claim 35 words
Handling method as per claim 1, wherein said acquiring step is effected with a pickup head comprising a chambered block with rectilinear pickup edges and having bulk electrical conductivity with said edges being electrically insulative.
Claim 7
Dependent Claim 22 words
Handling method as per claim 5, wherein said head comprises titanium carbide with said edges comprising an exterior film of titanium dioxide.

References Cited (Backward Citations)

US3083291A Cited
US3230338A Cited
US3271555A Cited
US3333274A Cited
US3337941A Cited
US3534462A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1974-09-13 1975-03-15 1975-09-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1978-09-13 1979-03-15 1979-09-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1982-09-13 1983-03-15 1983-09-14 $7700.00 Window Closed / Lapsed

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