Device for mounting and bonding semiconductor wafers

Claim 1

IN A DEVICE FOR MOUNTING AND FUSION BONDING A SEMICONDUCTOR BODY ON A PARTIALLY ASSEMBLED SEMICONDUCTOR TRANSLATING DEVICE; A FRAME; A SLIDER MOUNTED ON SAID FRAME CAPABLE OF HORIZONTAL MOTION WITH RESPECT THERETO, ADJUSTABLE LIMITS ON EACH SIDE OF SAID SLIDER FOR RESTRICTING ITS TRAVEL, MEANS FOR CAUSING SAID SLIDER TO MOVE FROM ONE LIMIT OF TRAVEL TO THE OTHER; A REGISTRATION COLUMN MOUNTED ON ONE PORTION OF SAID SLIDER INCLUDING A TRANSVERSELY AND LATERALLY POSITIONABLE SEMICONDUCTOR BODY REGISTRATION PLATE, POSITIVE SEMICONDUCTOR BODY REGISTRATION MEANS ON SAID PLATE; A HEATING COLUMN MOUNTED ON ANOTHER PORTION OF SAID SLIDER INCLUDING MEANS FOR HOLDING AND HEATING A PARTIALLY ASSEMBLED TRANSLATING DEVICE; A VACUUM NEEDLE INTERMEDIATE SAID COLUMNS CAPABLE OF RETAINING A POSITIONED SEMICONDUCTOR BODY THEREON WHEN VACUUM IS APPLIED THERETO; MEANS FOR RAISING AND LOWERING SAID NEEDLE INTO CONTACT WITH SAID PLATE AND SAID TRANSLATING DEVICE ON A FIXED VERTICAL AXIS; THE VERTICAL AXIS OF SAID NEEDLE BEING IN ALIGNMENT WITH SAID POSITIVE BODY REGISTRATION MEANS OF SAID REGISTRATION PLATE WHEN SAID SLIDER IS AT ONE LIMIT OF TRAVEL AND IN ALIGNMENT WITH A PREDETERMINED POINT ON SAID PARTIALLY ASSEMBLED TRANSLATING DEVICE WHEN SAID SLIDER IS AT THE OTHER LIMIT OF TRAVEL.