US5394298A
Expired / Lapsed
US
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Semiconductor devices
Assignee: Ibiden Co Ltd
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Filing: 1994-02-02
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Granted: 1995-02-28
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Expires: 2014-02-02
Abstract
Abstract A semiconductor device comprises a semiconductor chip carrier and a semiconductor chip packaged therein with a resin. The semiconductor chip carrier comprises a printed wiring substrate with conductor patterns, a first adhesive layer formed on at least an outer peripheral portion of the substrate, a second adhesive layer formed on the conductor pattern of the substrate, a lead frame joined to the substrate through the adhesive layers and comprised of plural leads for external connection. The conductor pattern is electrically connected to a part of inner leads of the lead frame.
Inventors
- 👤 Katsumi Sagisaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 01:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/479; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W70/464; H10W70/468; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
115 words
A semiconductor device comprising a semiconductor chip carrier and a semiconductor chip packaged in the semiconductor chip carrier with a resin; said semiconductor chip carrier comprising a printed wiring substrate provided at at least both surfaces with conductor patterns, a first layer of an adhesive formed on at least an outer peripheral portion of a front surface of the substrate, a second layer of an adhesive formed on each of said conduction patterns of the substrate, a lead frame joined to the substrate through the adhesive layers and comprised of plural leads for external connection, and said each of said conduction patterns being electrically connected to a part of inner leads of the lead frame.
Claim 2
Dependent Claim
115 words
A semiconductor device comprising a semiconductor chip carrier and a semiconductor chip packaged in the semiconductor chip carrier with a resin; said semiconductor chip carrier comprising a printed wiring substrate provided at at least both surfaces with conductor patterns, a first layer of an adhesive formed on at least an outer peripheral portion of a front surface of the substrate, a second layer of an adhesive formed on each of said conduction patterns of the substrate, a lead frame joined to the substrate through the adhesive layers and comprised of plural leads for external connection, and said each of said conduction patterns being electrically connected to a part of inner leads of the lead frame.
Claim 3
Dependent Claim
23 words
The semiconductor device according to claim 1, wherein said printed wiring substrate is provided at its rear surface side with a heat sink.
Claim 4
Dependent Claim
18 words
The semiconductor device according to claim 2, wherein said semiconductor chip is directly mounted on said heat sink.
Claim 5
Dependent Claim
24 words
The semiconductor device according to claim 1, wherein said adhesive layer is composed of a thermosetting resin and has a thickness of 5-100 μm.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-02-27 | 1998-08-29 | 1999-02-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-02-27 | 2002-08-29 | 2003-02-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-02-27 | 2006-08-29 | 2007-02-28 | $7700.00 | Window Closed / Lapsed |