Semiconductor device package side-by-side stacking and mounting system

Claim 1

A system for mounting multiple packaged semiconductor devices on a circuit board, said system comprising: a circuit board having contact pads thereon; a plurality of discrete encapsulated vertical surface mount semiconductor device packages, each package having an exterior with front and rear side faces and top, left, fight and bottom edges, with contact leads extending out from said bottom edges; said device packages being positioned vertically and stacked horizontally in a side-by-side array with said side faces brought into adjacent superposed relationships so that a front face of one device package abuts a rear face of a neighboring device package and so that said device package top, left, right and bottom edges are respectively aligned in common planes, with the contact leads of the device packages extending out of the bottom edge common plane; said aligned top edges, end ones of said front and rear faces and aligned left and right edges of the stacked device packages respectively defining top, ends and sides of the array; a case having a box-like construction, with an open bottom and an internal cavity defined by top, end and side internal surfaces, said case placed over said side-by-side array of device packages to bring said top, ends and sides of the array into corresponding abutment with said top, end and sides surfaces of said cavity, leaving said contact leads exposed and accessible through said case open bottom; and means on said case, cooperative with said circuit board, releasably securing said case with said array onto said board, pressing said exposed contact leads respectively against said contact pads, establishing solderless electrical connection between said leads and said pads.

Claim 2

A system for mounting multiple packaged semiconductor devices on a circuit board, said system comprising: a circuit board having contact pads thereon; a plurality of discrete encapsulated vertical surface mount semiconductor device packages, each package having an exterior with front and rear side faces and top, left, fight and bottom edges, with contact leads extending out from said bottom edges; said device packages being positioned vertically and stacked horizontally in a side-by-side array with said side faces brought into adjacent superposed relationships so that a front face of one device package abuts a rear face of a neighboring device package and so that said device package top, left, right and bottom edges are respectively aligned in common planes, with the contact leads of the device packages extending out of the bottom edge common plane; said aligned top edges, end ones of said front and rear faces and aligned left and right edges of the stacked device packages respectively defining top, ends and sides of the array; a case having a box-like construction, with an open bottom and an internal cavity defined by top, end and side internal surfaces, said case placed over said side-by-side array of device packages to bring said top, ends and sides of the array into corresponding abutment with said top, end and sides surfaces of said cavity, leaving said contact leads exposed and accessible through said case open bottom; and means on said case, cooperative with said circuit board, releasably securing said case with said array onto said board, pressing said exposed contact leads respectively against said contact pads, establishing solderless electrical connection between said leads and said pads.

Claim 8

A system for mounting multiple packaged semiconductor devices on a circuit board, said system comprising: a plurality of semiconductor devices, each device comprising an integrated circuit chip encapsulated into a discrete protective package and having contact leads extending out of an edge of said package, said device packages being positioned vertically in alignment in a side-by-side array; a case having an internal cavity with an open bottom, enclosing said array of semiconductor device packages, leaving said contact leads exposed through said case open bottom; a circuit board having contact pads thereon; and means on said case, cooperative with said board, releasably securing said case and enclosed semiconductor device packages to said circuit board and pressing said leads respectively against said pad, establishing solderless electrical connection between said leads and said pads.

Claim 9

A system for mounting multiple packaged semiconductor devices on a circuit board, said system comprising: a plurality of semiconductor devices, each device comprising an integrated circuit chip encapsulated into a discrete protective package and having contact leads extending out of an edge of said package, said device packages being positioned vertically in alignment in a side-by-side array; a case having an internal cavity with an open bottom, enclosing said array of semiconductor device packages, leaving said contact leads exposed through said case open bottom; a circuit board having contact pads thereon; and means on said case, cooperative with said board, releasably securing said case and enclosed semiconductor device packages to said circuit board and pressing said leads respectively against said pad, establishing solderless electrical connection between said leads and said pads.

Claim 14

A system for mounting multiple packaged semiconductor devices on a circuit board, said system comprising: a circuit board having contact pads thereon; a plurality of discrete vertical surface mount semiconductor devices; each device comprising an integrated circuit chip encapsulated in a protective package having an exterior configuration with front and rear side faces, a bottom edge, and contact lead extending out from said bottom edge; a case having top, end and side walls with internal surfaces defining an internal cavity with an open bottom; said plurality of semiconductor device packages being stacked into adjacent superposed relationships in an array, and held together by contact of said array with said internal surfaces of said cavity, with said bottom edges aligned so that said contact leads of said respective semiconductor devices extend out from said stack through said casing open bottom; and means, located on said case, securing said casing to said circuit board, tightly clamping said contact leads respectively into solderless electrical connections with said contact pads.

Claim 15

A system for mounting multiple packaged semiconductor devices on a circuit board, said system comprising: a circuit board having contact pads thereon; a plurality of discrete vertical surface mount semiconductor devices; each device comprising an integrated circuit chip encapsulated in a protective package having an exterior configuration with front and rear side faces, a bottom edge, and contact lead extending out from said bottom edge; a case having top, end and side walls with internal surfaces defining an internal cavity with an open bottom; said plurality of semiconductor device packages being stacked into adjacent superposed relationships in an array, and held together by contact of said array with said internal surfaces of said cavity, with said bottom edges aligned so that said contact leads of said respective semiconductor devices extend out from said stack through said casing open bottom; and means, located on said case, securing said casing to said circuit board, tightly clamping said contact leads respectively into solderless electrical connections with said contact pads.

Claim 26

A system for packaging and mounting a plurality of semiconductor devices, comprising: a circuit board with contact pads; a plurality of discrete vertical surface mount semiconductor devices; each device having front and rear side faces, a bottom edge, and contact leads extending out from said bottom edge; a case having top, end and side walls with internal surfaces defining an internal cavity with an open bottom; said plurality of discrete semiconductor devices being stacked side by side within said cavity to form an array matching said internal surfaces, said front and rear faces brought into adjacent superposed relationships, with front faces of ones of said devices positioned in abutment with rear faces of neighboring ones of said devices, and said bottom edges aligned so that said contact leads of said respective semiconductor devices extend out from said stack through said case open bottom; and means, located on said case, for securing said case to said circuit board to hold said array within said cavity and clamp said contact leads into respective solderless electrical connections with said contact pads.

Claim 27

A system for packaging and mounting a plurality of semiconductor devices, comprising: a circuit board with contact pads; a plurality of discrete vertical surface mount semiconductor devices; each device having front and rear side faces, a bottom edge, and contact leads extending out from said bottom edge; a case having top, end and side walls with internal surfaces defining an internal cavity with an open bottom; said plurality of discrete semiconductor devices being stacked side by side within said cavity to form an array matching said internal surfaces, said front and rear faces brought into adjacent superposed relationships, with front faces of ones of said devices positioned in abutment with rear faces of neighboring ones of said devices, and said bottom edges aligned so that said contact leads of said respective semiconductor devices extend out from said stack through said case open bottom; and means, located on said case, for securing said case to said circuit board to hold said array within said cavity and clamp said contact leads into respective solderless electrical connections with said contact pads.