JPS61248451A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Package sealing structure of semiconductor device
Assignee: Hitachi Ltd
•
Filing: 1985-04-26
•
Granted: —
•
Expires: 2005-04-26
Abstract
Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Inventors
- 👤 Hiroyuki Kojima
- 👤 小嶋 弘行
- 👤 Tasuku Shimizu
- 👤 翼 清水
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-11-03 21:39
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W76/63
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.