US6089920A — Modular die sockets with flexible interconnects f…

Claim 1

Independent Claim 185 words

A module for insertion of a semiconductor die thereinto, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said module comprising: a plurality of plates, each plate of said plurality having first and second major sides with corresponding first and second ends, the first major side of a first plate of said plurality of plates abutted to the second major side of a second plate of said plurality of plates thereby forming a bare die socket having a die slot at said first end and a lead slot at said second end; a multi-layer interconnect lead tape comprising a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with at least one of said plurality of conductive bond pads of said semiconductor die and outer ends for at least one lead of said leads to electrically contact a substrate; and resilient apparatus for forcing said inner ends into resilient contact with said at least one conductive bond pad of said plurality of conductive bond pads of said semiconductor die.

Claim 2

Dependent Claim 185 words

A module for insertion of a semiconductor die thereinto, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said module comprising: a plurality of plates, each plate of said plurality having first and second major sides with corresponding first and second ends, the first major side of a first plate of said plurality of plates abutted to the second major side of a second plate of said plurality of plates thereby forming a bare die socket having a die slot at said first end and a lead slot at said second end; a multi-layer interconnect lead tape comprising a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with at least one of said plurality of conductive bond pads of said semiconductor die and outer ends for at least one lead of said leads to electrically contact a substrate; and resilient apparatus for forcing said inner ends into resilient contact with said at least one conductive bond pad of said plurality of conductive bond pads of said semiconductor die.

Claim 3

Dependent Claim 29 words

The module of claim 1, further comprising joining at least one additional plate thereto as a stack to form a modular socket for holding at least two semiconductor dice.

Claim 4

Dependent Claim 28 words

The module of claim 1, wherein said module is configured to hold a semiconductor die having at least one row of conductive bond pads near one edge thereof.

Claim 5

Dependent Claim 33 words

The module of claim 1, wherein said inner ends of said leads are configured for solderless pressure contact with said at least one conductive bond pad of said plurality of conductive bond pads.

Claim 6

Dependent Claim 43 words

The module of claim 1, further comprising: alignment keys near said first ends of said plates, said keys comprising posts in one of said sides of said plurality of plates and matching apertures in another of said sides of said plurality of plates.

Claim 7

Dependent Claim 69 words

The module of claim 1, further comprising: retention/alignment keys near said second ends of said plurality of plates, said retention/alignment keys comprising posts in one of said sides of said plurality of plates and matching apertures in the other of said sides of said plurality of plates, and wherein said posts are passed through matching apertures in said tape and into said matching apertures in said plurality of plates.

Claim 8

Dependent Claim 24 words

The module of claim 1, wherein said outer ends of said leads are configured for joining by solder with electrical traces on said substrate.

Claim 9

Dependent Claim 12 words

The module of claim 1, wherein said substrate is a circuit board.

Claim 10

Dependent Claim 35 words

The module of claim 1, wherein said resilient apparatus comprises said insulative film on which said conductive leads are formed, said insulative film resiliently displaced by insertion of a semiconductor die into said die slot.

Claim 11

Dependent Claim 19 words

The module of claim 1, wherein said resilient apparatus comprises a compressible elastomeric foam backing on said insulative film.

Claim 12

Dependent Claim 33 words

The module of claim 1, wherein said resilient apparatus comprises a compressible elastomeric stem between said tape and a plate, said stem compressed by insertion of a semiconductor die into said die slot.

Claim 13

Dependent Claim 49 words

The module of claim 1, wherein said resilient apparatus comprises a narrow projection of a plate of said plurality of plates, said narrow projection having a node to which said tape is joined, and configured to be forcibly bent by insertion of a semiconductor die into said die slot.

Claim 14

Dependent Claim 44 words

The module of claim 1, wherein said die slot and said lead slot are generally between said first and second plates of said plurality of plates at said first end and second end, respectively, and said lead slot is offset from said die slot.

Claim 15

Dependent Claim 71 words

The module of claim 1, wherein said semiconductor die has two rows of conductive bond pads thereon, and wherein said conductive leads are formed on both surfaces of said insulative film, conductive leads on a first surface of said insulative film configured to be connected to one of said rows and conductive leads on a second surface of said insulative film configured to be connected to the other of said rows.

Claim 16

Dependent Claim 62 words

The module of claim 14, further comprising a layer of elastomeric material fixed to said multi-layer interconnect lead tape and configured to abut an opposing wall of a plate of said first plate and second plate of said plurality of plates for maintaining contact of at least one lead of said leads with at least one bond pad of said bond pads.

Claim 17

Dependent Claim 167 words

A module for insertion of a semiconductor die thereinto, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said module comprising: a plurality of plates, each plate of said plurality of plates having first and second major sides with corresponding first and second ends, the first major side of a first plate of said plurality of plates abutting the second major side of a second plate of said plurality of plates thereby forming a bare die socket having a die slot at said first end and a lead slot at said second end; a multi-layer interconnect lead tape comprising a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with said plurality of conductive bond pads of said semiconductor die and outer ends for electrical contact with a substrate; and resilient apparatus for forcing said inner ends into resilient contact with said plurality of conductive bond pads of said semiconductor die.

Claim 18

Dependent Claim 167 words

A module for insertion of a semiconductor die thereinto, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said module comprising: a plurality of plates, each plate of said plurality of plates having first and second major sides with corresponding first and second ends, the first major side of a first plate of said plurality of plates abutting the second major side of a second plate of said plurality of plates thereby forming a bare die socket having a die slot at said first end and a lead slot at said second end; a multi-layer interconnect lead tape comprising a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with said plurality of conductive bond pads of said semiconductor die and outer ends for electrical contact with a substrate; and resilient apparatus for forcing said inner ends into resilient contact with said plurality of conductive bond pads of said semiconductor die.

Claim 19

Dependent Claim 29 words

The module of claim 16, further comprising joining a plurality of additional plates thereto as a stack to form a modular socket for holding a plurality of semiconductor dice.

Claim 20

Dependent Claim 31 words

The module of claim 16, wherein said module is configured to hold a semiconductor die having at least one row of said plurality of conductive bond pads near one edge thereof.

Claim 21

Dependent Claim 23 words

The module of claim 18, wherein said inner ends of said leads are configured for solderless pressure contact with said conductive bond pads.

Claim 22

Dependent Claim 46 words

The module of claim 16, further comprising: alignment keys near said first ends of said plurality of plates, said keys comprising posts in one of said sides of said plurality of plates and matching apertures in the other of said sides of said plurality of plates.

Claim 23

Dependent Claim 69 words

The module of claim 16, further comprising: retention/alignment keys near said second ends of said plurality of plates, said retention/alignment keys comprising posts in one of said sides of said plurality of plates and matching apertures in the other of said sides of said plurality of plates, and wherein said posts are passed through matching apertures in said tape and into said matching apertures in said plurality of plates.

Claim 24

Dependent Claim 24 words

The module of claim 16, wherein said outer ends of said leads are configured for joining by solder with electrical traces on said substrate.

Claim 25

Dependent Claim 12 words

The module of claim 16, wherein said substrate is a circuit board.

Claim 26

Dependent Claim 35 words

The module of claim 16, wherein said resilient apparatus comprises said insulative film on which said conductive leads are formed, said insulative film resiliently displaced by insertion of said semiconductor die into said die slot.

Claim 27

Dependent Claim 19 words

The module of claim 16, wherein said resilient apparatus comprises a compressible elastomeric foam backing on said insulative film.

Claim 28

Dependent Claim 33 words

The module of claim 16, wherein said resilient apparatus comprises a compressible elastomeric stem between said tape and a plate, said stem compressed by insertion of said semiconductor die into said die slot.

Claim 29

Dependent Claim 49 words

The module of claim 16, wherein said resilient apparatus comprises a narrow projection of a plate of said plurality of plates, said narrow projection having a node to which said tape is joined, and configured to be forcibly bent by insertion of said semiconductor die into said die slot.

Claim 30

Dependent Claim 47 words

The module of claim 16, wherein said die slot and said lead slot are generally between said first plate and said second plate of said plurality of plates at said first end and said second end, respectively, and said lead slot is offset from said die slot.

Claim 31

Dependent Claim 70 words

The module of claim 16, wherein said semiconductor die has two rows of conductive bond pads, and wherein said conductive leads are formed on both surfaces of said insulative film, conductive leads on a first surface of said insulative film configured to be connected to one of said rows and conductive leads on a second surface of said insulative film configured to be connected to the other of said rows.

Claim 32

Dependent Claim 39 words

The module of claim 29, further comprising a layer of elastomeric material fixed to said multi-layer interconnect lead tape and configured to abut an opposing wall of a plate for maintaining contact of said leads with said bond pads.

Claim 33

Dependent Claim 86 words

A modular bare die interconnect socket for electrical connection to traces of a substrate, said socket comprising: a plurality of interconnect lead tapes having conductive leads formed thereon; a plurality of plates stacked side by side, each plate of said plurality of plates having a bare die insertion slot at one end and a lead tape insertion slot at an opposite end; one of said lead tapes placed through each said tape insertion slot between adjacent plates of said plurality of plates stacked side by side.

Claim 34

Dependent Claim 86 words

A modular bare die interconnect socket for electrical connection to traces of a substrate, said socket comprising: a plurality of interconnect lead tapes having conductive leads formed thereon; a plurality of plates stacked side by side, each plate of said plurality of plates having a bare die insertion slot at one end and a lead tape insertion slot at an opposite end; one of said lead tapes placed through each said tape insertion slot between adjacent plates of said plurality of plates stacked side by side.

Claim 35

Dependent Claim 25 words

The socket of claim 31, wherein a plate of said plurality of plates is adhesively secured to an adjacent plate of said plurality of plates.

Claim 36

Dependent Claim 126 words

A plate adapted for abutting another adjacent plate to form an interconnect socket for a semiconductor die for connection to a substrate, said plate comprising: a generally planar member formed of an insulative material, said planar member having a first side and a second side, a first end and a second end; said second side including a recessed die slot for insertion of a bare die from said first end; said first side including a recess for holding an interconnect lead tape for resilient contact with said die and said substrate; and whereby said second side of said planar member abutted to a first side of said another adjacent plate forms a module for removable insertion of said semiconductor die for electrical interconnection to said substrate.

Claim 37

Dependent Claim 126 words

A plate adapted for abutting another adjacent plate to form an interconnect socket for a semiconductor die for connection to a substrate, said plate comprising: a generally planar member formed of an insulative material, said planar member having a first side and a second side, a first end and a second end; said second side including a recessed die slot for insertion of a bare die from said first end; said first side including a recess for holding an interconnect lead tape for resilient contact with said die and said substrate; and whereby said second side of said planar member abutted to a first side of said another adjacent plate forms a module for removable insertion of said semiconductor die for electrical interconnection to said substrate.

Claim 38

Dependent Claim 26 words

The plate according to claim 33, wherein one side of said recessed die slot comprises a wall of a second side of said another adjacent plate.

Claim 39

Dependent Claim 32 words

The plate according to claim 33, wherein an interconnect lead tape is positioned and retained between said first side of said planer member and a second side of said another adjacent plate.

Claim 40

Dependent Claim 27 words

The plate according to claim 33, further comprising: alignment posts fixed to said second side of said planar member for aligning/retaining passage through said interconnect lead tape.

Claim 41

Dependent Claim 21 words

The plate according to claim 33, wherein said plate and said another adjacent plate are aligned substantially perpendicular to said substrate.

Claim 42

Dependent Claim 93 words

A multi-layer interconnect tape for interconnecting bond pads of a semiconductor die to a substrate, said tape comprising: a first layer of insulative film having first and second surfaces; a second layer of conductive material formed on said first surface of said first layer of insulative film; wherein said second layer of conductive material is formed as a plurality of conductive leads having first ends bent to form nodes for contact with a row of bond pads on said semiconductor die and having second ends for connection to conductive traces on said substrate.

Claim 43

Dependent Claim 93 words

A multi-layer interconnect tape for interconnecting bond pads of a semiconductor die to a substrate, said tape comprising: a first layer of insulative film having first and second surfaces; a second layer of conductive material formed on said first surface of said first layer of insulative film; wherein said second layer of conductive material is formed as a plurality of conductive leads having first ends bent to form nodes for contact with a row of bond pads on said semiconductor die and having second ends for connection to conductive traces on said substrate.

Claim 44

Dependent Claim 12 words

The interconnect tape of claim 38, wherein said conductive material is metal.

Claim 45

Dependent Claim 24 words

The interconnect tape of claim 38, wherein said tape is abutted against said row of bond pads said semiconductor die by a resilient member.

Claim 46

Dependent Claim 19 words

The interconnect tape of claim 40, wherein said resilient member comprises an elastomeric member fixed to said first layer.

Claim 47

Dependent Claim 20 words

The interconnect tape of claim 40, wherein said resilient member comprises a bendable extension of an apparatus holding said tape.

Claim 48

Dependent Claim 17 words

The interconnect tape of claim 40, wherein said resilient member comprises said first layer of said tape.

Claim 49

Dependent Claim 42 words

The interconnect tape of claim 38, further comprising a third layer of conductive material formed on said second surface of said first layer and extending past said second layer for contact with a second row of bond pads on said semiconductor die.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2003-07-18	2004-01-17	2004-07-18	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2007-07-18	2008-01-17	2008-07-18	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2011-07-18	2012-01-17	2012-07-18	$7700.00	Window Closed / Lapsed

Modular die sockets with flexible interconnects for packaging bare semiconductor die

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