US6114756A — Interdigitated capacitor design for integrated ci…

Claim 1

Independent Claim 149 words

A semiconductor device assembly, comprising: a semiconductor die having a plurality of circuits formed thereon, having an active surface, having a plurality of bond pads on said active surface, at least one bond pad of said plurality of bond pads connected to at least one circuit of said plurality of circuits, and having an opposing back side; a lead frame including a plurality of inner leads extending over a first plane, at least one lead of the plurality of inner leads corresponding to a bond pad of said plurality of bond pads of said semiconductor die, a plurality of outer leads, at least one outer lead of said plurality of outer leads connected to at least one inner lead of said plurality of inner leads, and a bifurcated die mounting member including a pair of generally coplanar interdigitated sectors extending over a second plane different from said first plane.

Claim 2

Dependent Claim 149 words

A semiconductor device assembly, comprising: a semiconductor die having a plurality of circuits formed thereon, having an active surface, having a plurality of bond pads on said active surface, at least one bond pad of said plurality of bond pads connected to at least one circuit of said plurality of circuits, and having an opposing back side; a lead frame including a plurality of inner leads extending over a first plane, at least one lead of the plurality of inner leads corresponding to a bond pad of said plurality of bond pads of said semiconductor die, a plurality of outer leads, at least one outer lead of said plurality of outer leads connected to at least one inner lead of said plurality of inner leads, and a bifurcated die mounting member including a pair of generally coplanar interdigitated sectors extending over a second plane different from said first plane.

Claim 3

Dependent Claim 20 words

The semiconductor device assembly of claim 1, wherein said semiconductor die is adhesively connected to said bifurcated die mounting member.

Claim 4

Dependent Claim 26 words

The semiconductor device assembly of claim 2, wherein said semiconductor die and said bifurcated die mounting member are adhesively connected to an insulative member located therebetween.

Claim 5

Dependent Claim 40 words

The semiconductor device assembly of claim 1, further comprising: a first electrical connection from one of said pair of generally coplanar interdigitated sectors to a power supply Vss bond pad of said plurality of bond pads of said semiconductor die.

Claim 6

Dependent Claim 40 words

The semiconductor device assembly of claim 4, further comprising: a second electrical connection from the other of said pair of generally coplanar interdigitated sectors to a ground Vcc bond pad of said plurality of bond pads of said semiconductor die.

Claim 7

Dependent Claim 47 words

The semiconductor device assembly of claim 5, further comprising: at least one conductive wire connecting at least one bond pad of said plurality of bond pads of said semiconductor die to at least one corresponding inner lead of said plurality of inner leads of said lead frame.

Claim 8

Dependent Claim 31 words

The semiconductor device assembly of claim 1, further comprising conductive wires connecting said plurality of bond pads and said at least one corresponding inner lead of said plurality of inner leads.

Claim 9

Dependent Claim 16 words

The semiconductor device assembly of claim 1, wherein said lead frame comprises a single conductive layer.

Claim 10

Dependent Claim 36 words

The semiconductor device assembly of claim 1, wherein said lead frame comprises a single layer of metal stamped to form said plurality of inner leads, said plurality of outer leads, and said bifurcated die mounting member.

Claim 11

Dependent Claim 22 words

The semiconductor device assembly of claim 1, wherein said lead frame comprises a single conductive layer fixed to an insulative base layer.

Claim 12

Dependent Claim 27 words

The semiconductor device assembly of claim 1, wherein said die mounting member comprises a two-part paddle for attachment to the back side of said semiconductor bifurcated die.

Claim 13

Dependent Claim 20 words

The semiconductor device assembly of claim 11, wherein said die mounting member is adhesively attached to said semiconductor bifurcated die.

Claim 14

Dependent Claim 28 words

The semiconductor device assembly of claim 1, wherein said bifurcated die mounting member comprises a lead-on-chip (LOC) member for attachment to the active surface of said semiconductor die.

Claim 15

Dependent Claim 30 words

The semiconductor device assembly of claim 13, wherein said bifurcated die mounting member is adhesively attached to the active surface of said semiconductor die having an intervening insulative layer therebetween.

Claim 16

Dependent Claim 241 words

A semiconductor device assembly, comprising: a semiconductor die having a plurality of circuits formed thereon, having an active surface, having a plurality of bond pads on said active surface, at least one bond pad of said plurality of bond pads connected to at least one circuit of said plurality of circuits, and having an opposing back side; a lead frame including a plurality of inner leads extending over a first plane, at least one lead of the plurality of inner leads corresponding to at least one bond pad of said plurality of bond pads of said semiconductor die, a plurality of outer leads, at least one outer lead of said plurality of outer leads connected to at least one inner lead of said plurality of inner leads, and a bifurcated die mounting member including a pair of generally coplanar interdigitated sectors extending over a second plane different from said first plane; an insulative member adhesively connected to said semiconductor die and said bifurcated die mounting member; a first electrical connection from one of said pair of generally coplanar interdigitated sectors to a power supply Vss bond pad; a second electrical connection from the other of said pair of generally coplanar interdigitated sectors to a ground Vcc bond pad; and at least one conductive wire connecting said at least one bond pad of said plurality of bond pads to said at least one corresponding inner lead of said plurality of inner leads.

Claim 17

Dependent Claim 241 words

A semiconductor device assembly, comprising: a semiconductor die having a plurality of circuits formed thereon, having an active surface, having a plurality of bond pads on said active surface, at least one bond pad of said plurality of bond pads connected to at least one circuit of said plurality of circuits, and having an opposing back side; a lead frame including a plurality of inner leads extending over a first plane, at least one lead of the plurality of inner leads corresponding to at least one bond pad of said plurality of bond pads of said semiconductor die, a plurality of outer leads, at least one outer lead of said plurality of outer leads connected to at least one inner lead of said plurality of inner leads, and a bifurcated die mounting member including a pair of generally coplanar interdigitated sectors extending over a second plane different from said first plane; an insulative member adhesively connected to said semiconductor die and said bifurcated die mounting member; a first electrical connection from one of said pair of generally coplanar interdigitated sectors to a power supply Vss bond pad; a second electrical connection from the other of said pair of generally coplanar interdigitated sectors to a ground Vcc bond pad; and at least one conductive wire connecting said at least one bond pad of said plurality of bond pads to said at least one corresponding inner lead of said plurality of inner leads.

Claim 18

Dependent Claim 34 words

The semiconductor device assembly of claim 15, further comprising a plurality of conductive wires connecting said plurality of bond pads and said at least one corresponding inner lead of said plurality of inner leads.

Claim 19

Dependent Claim 16 words

The semiconductor device assembly of claim 15, wherein said lead frame comprises a single conductive layer.

Claim 20

Dependent Claim 36 words

The semiconductor device assembly of claim 15, wherein said lead frame comprises a single layer of metal stamped to form said plurality of inner leads, said plurality of outer leads, and said bifurcated die mounting member.

Claim 21

Dependent Claim 29 words

The semiconductor device assembly of claim 15, wherein said lead frame comprises a single conductive layer fixed to said insulative member wherein said insulative member includes a base layer.

Claim 22

Dependent Claim 27 words

The semiconductor device assembly of claim 15, wherein said bifurcated die mounting member comprises a two-part paddle for attachment to the back side of said semiconductor die.

Claim 23

Dependent Claim 28 words

The semiconductor device assembly of claim 15, wherein said bifurcated die mounting member comprises a lead-on-chip (LOC) member for attachment to the active surface of said semiconductor die.

Claim 24

Dependent Claim 30 words

The semiconductor device assembly of claim 21, wherein said bifurcated die mounting member is attached to said insulative member that is attached to the active surface of said semiconductor die.

Claim 25

Dependent Claim 74 words

A conductive lead frame strip for a semiconductor device, comprising a strip of polymeric film having a metallized conductive layer, lateral rails, and a plurality of spaced lead frames wherein each lead frame of said plurality of spaced lead frames includes a pattern of a plurality of conductive inner leads and a plurality of conductive outer leads and a die support member bifurcated into two interdigitated capacitor portions, said portions comprising a decoupling capacitor.

Claim 26

Dependent Claim 74 words

A conductive lead frame strip for a semiconductor device, comprising a strip of polymeric film having a metallized conductive layer, lateral rails, and a plurality of spaced lead frames wherein each lead frame of said plurality of spaced lead frames includes a pattern of a plurality of conductive inner leads and a plurality of conductive outer leads and a die support member bifurcated into two interdigitated capacitor portions, said portions comprising a decoupling capacitor.

Claim 27

Dependent Claim 41 words

The conductive lead frame strip of claim 23, wherein said two interdigitated capacitor portions are generally coplanar, configured for bonding to a semiconductor die, and configured for wire bond connections to Vss and Vcc bond pads of a semiconductor die, respectively.

Claim 28

Dependent Claim 22 words

The conductive lead frame strip of claim 23, wherein said bifurcated die support member is generally centrally positioned in said lead frame.

Claim 29

Independent Claim 84 words

A method for producing a lead frame including an inductance decoupling capacitor for a semiconductor device, said method comprising: providing a strip of metallized polymeric film; and removing portions of said metallized polymeric film to form a plurality of patterns in said strip including a pair of opposed side rails, each pattern including a plurality of inner and outer leads supportively connected to said side rails and two separated, interdigitated die attach members, said die attach members configured to be a decoupling capacitor couple.

Claim 30

Independent Claim 84 words

A method for producing a lead frame including an inductance decoupling capacitor for a semiconductor device, said method comprising: providing a strip of metallized polymeric film; and removing portions of said metallized polymeric film to form a plurality of patterns in said strip including a pair of opposed side rails, each pattern including a plurality of inner and outer leads supportively connected to said side rails and two separated, interdigitated die attach members, said die attach members configured to be a decoupling capacitor couple.

Claim 31

Dependent Claim 68 words

The method of claim 26, wherein said removing portions of said metallized polymeric film to form said plurality of patterns in said strip including said pair of opposed side rails, said each pattern including said plurality of inner and outer leads supportively connected to said side rails and said two separated interdigitated die attach members comprises forming a pattern including two coplanar, separated, and interdigitated die attach members.

Claim 32

Independent Claim 242 words

A method for producing a semiconductor device assembly having an inductance decoupling capacitor, comprising: providing a strip of metallized polymeric film; removing portions of said metallized polymeric film to form a plurality of patterns in said strip including a pair of opposed side rails, each pattern including a plurality of inner leads and a plurality of outer leads supportively connected by bars to said side rails and at least two separated die attach members supportively connected to said side rails by paddle bars, said at least two separated interdigitated die attach members, said at least two separated interdigitated die attach members configured to be a decoupling capacitor couple; providing a semiconductor die having an active surface and a back side, and a plurality of bond pads on said active surface, a first portion of said plurality of bond pads configured to be conductively connected to a power supply, a second portion of said plurality of bond pads configured to be conductively connected to ground, and a third portion of said plurality of bond pads configured to be connected to said inner leads; securing said semiconductor die to said at least two separated interdigitated die attach members; connecting one of said at least two separated interdigitated die attach members to said first portion of said plurality of bond pads; and connecting the other of said at least two separated interdigitated die attach members to said second portion of said plurality of bond pads.

Claim 33

Independent Claim 242 words

A method for producing a semiconductor device assembly having an inductance decoupling capacitor, comprising: providing a strip of metallized polymeric film; removing portions of said metallized polymeric film to form a plurality of patterns in said strip including a pair of opposed side rails, each pattern including a plurality of inner leads and a plurality of outer leads supportively connected by bars to said side rails and at least two separated die attach members supportively connected to said side rails by paddle bars, said at least two separated interdigitated die attach members, said at least two separated interdigitated die attach members configured to be a decoupling capacitor couple; providing a semiconductor die having an active surface and a back side, and a plurality of bond pads on said active surface, a first portion of said plurality of bond pads configured to be conductively connected to a power supply, a second portion of said plurality of bond pads configured to be conductively connected to ground, and a third portion of said plurality of bond pads configured to be connected to said inner leads; securing said semiconductor die to said at least two separated interdigitated die attach members; connecting one of said at least two separated interdigitated die attach members to said first portion of said plurality of bond pads; and connecting the other of said at least two separated interdigitated die attach members to said second portion of said plurality of bond pads.

Claim 34

Dependent Claim 33 words

The method of claim 28, further comprising: attaching said at least two separated interdigitated die attach members to said first and second portions, respectively, of said plurality of bond pads by conductive wires.

Claim 35

Dependent Claim 47 words

The method of claim 29, wherein said attaching said at least two separated interdigitated die attach members to said first and second portions, respectively, of said plurality of bond pads by conductive wires comprises bonding said conductive wires by one of thermocompression, thermosonic bonding and ultrasonic bonding.

Claim 36

Dependent Claim 27 words

The method of claim 28, further comprising attaching said third portion of said plurality of bond pads to at least one of said plurality of inner leads.

Claim 37

Dependent Claim 23 words

The method of claim 28, further comprising: singulating said plurality of inner leads and said plurality of outer leads from said side rails.

Claim 38

Dependent Claim 13 words

The method of claim 32, wherein said singulating includes cutting said paddle bars.

Claim 39

Dependent Claim 26 words

The method of claim 28, further comprising: singulating said at least two separated interdigitated die attach members from said side rails by cutting said paddle bars.

Claim 40

Dependent Claim 43 words

The method of claim 28, wherein said securing said semiconductor die to said at least two separated interdigitated die attach members comprises attaching the back side of said semiconductor die to said at least two separated interdigitated die attach members using an adhesive.

Claim 41

Dependent Claim 49 words

The method of claim 35, wherein said attaching the back side of said semiconductor die to said at least two separated interdigitated die attach members comprises attaching said back side of said semiconductor die to said at least two separated interdigitated die attach members using polymeric tape and adhesive.

Claim 42

Dependent Claim 48 words

The method of claim 35, wherein said attaching the back side of said semiconductor die to said at least two separated interdigitated die attach members comprises attaching said back side of said semiconductor die to said at least two separated interdigitated die attach members using insulative polymeric adhesive.

Claim 43

Dependent Claim 34 words

The method of claim 37, further comprising attaching a portion of said active surface of said semiconductor die to at least one inner lead of said plurality of inner leads using an insulative layer.

Claim 44

Dependent Claim 50 words

The method of claim 37, wherein said attaching the back side of said semiconductor die to said at least two separated interdigitated die attach members comprises attaching said back side of said semiconductor die to said at least two separated interdigitated die attach members using said polymeric tape and adhesive.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2003-09-05	2004-03-06	2004-09-05	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2007-09-05	2008-03-06	2008-09-05	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2011-09-05	2012-03-06	2012-09-05	$7700.00	Window Closed / Lapsed

Interdigitated capacitor design for integrated circuit leadframes

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