US5099306A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked tab leadframe assembly
Assignee: Samsung Electronics Co Ltd
•
Filing: 1991-03-26
•
Granted: 1992-03-24
•
Expires: 2011-03-26
Abstract
Abstract Disclosed is a stacked leadframe assembly for use with integrated circuit chips. The assembly comprises multiple leadframes arranged in stacked relation. Each leadframe comprises conductive elements and solder bumps for electrically and mechanically connecting selected conductive elements of the leadframes.
Inventors
- 👤 Thomas J. Dunaway
- 👤 Richard K. Spielberger
- 👤 Jerald M. Loy
- 👤 Lori A. Dicks
- 👤 Francis J. Belcourt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 19:24
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/451; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/071; H10W72/077
Claims Analysis
Total Claims: 56
Claim 1
Independent Claim
75 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member and a pattern of conductive elements formed on the flexible tape insulating member; and b) solder bump means comprising solder bumps for providing direct electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 2
Dependent Claim
75 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member and a pattern of conductive elements formed on the flexible tape insulating member; and b) solder bump means comprising solder bumps for providing direct electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 3
Dependent Claim
23 words
A stacked leadframe assembly according to claim 1 wherein a portion of the solder bumps connect conductive elements with an integrated circuit chip.
Claim 4
Dependent Claim
22 words
A stacked leadframe assembly according to claim 1 wherein each leadframe comprises dielectric material for selectively maintaining separation between adjacent conductive elements.
Claim 5
Dependent Claim
16 words
A stacked leadframe assembly according to claim 1 wherein the conductive elements comprise a ground conductor.
Claim 6
Dependent Claim
16 words
A stacked leadframe assembly according to claim 4 wherein the ground conductor comprises a ground plane.
Claim 7
Dependent Claim
16 words
A stacked leadframe assembly according to claim 1 wherein the conductive elements comprise a power conductor.
Claim 8
Dependent Claim
16 words
A stacked leadframe assembly according to claim 6 wherein the power conductor comprises a power plane.
Claim 9
Dependent Claim
16 words
A stacked leadframe assembly according to claim 1 wherein the conductive elements comprise a signal line.
Claim 10
Dependent Claim
98 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes, each TAB leadframe comprising a substantially planar, flexible tape insulating member and at least one of ground plane, power plane, and signal line conductive elements formed on the flexible tape insulating member, the leadframes being arranged in stacked relation to provide means for controlling impedance and noise in the assembly; and b) solder bump means comprising solder bumps for providing direct electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 11
Dependent Claim
98 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes, each TAB leadframe comprising a substantially planar, flexible tape insulating member and at least one of ground plane, power plane, and signal line conductive elements formed on the flexible tape insulating member, the leadframes being arranged in stacked relation to provide means for controlling impedance and noise in the assembly; and b) solder bump means comprising solder bumps for providing direct electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 12
Dependent Claim
23 words
A stacked leadframe assembly according to claim 9 wherein a portion of the solder bumps connect conductive elements with an integrated circuit chip.
Claim 13
Dependent Claim
69 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member, each leadframe further comprising a conductive element; and b) solder bump means comprising solder bumps for providing simultaneous electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating member of the leadframes.
Claim 14
Dependent Claim
69 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member, each leadframe further comprising a conductive element; and b) solder bump means comprising solder bumps for providing simultaneous electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating member of the leadframes.
Claim 15
Dependent Claim
23 words
A stacked leadframe assembly according to claim 11 wherein a portion of the solder bumps connect conductive elements with an integrated circuit chip.
Claim 16
Dependent Claim
16 words
A stacked leadframe assembly according to claim 11 wherein the conductive elements comprise a ground conductor.
Claim 17
Dependent Claim
16 words
A stacked leadframe assembly according to claim 11 wherein the ground conductor comprises a ground plane.
Claim 18
Dependent Claim
16 words
A stacked leadframe assembly according to claim 11 wherein the conductive elements comprise a power conductor.
Claim 19
Dependent Claim
16 words
A stacked leadframe assembly according to claim 11 wherein the power conductor comprises a power plane.
Claim 20
Dependent Claim
16 words
A stacked leadframe assembly according to claim 11 wherein the conductive elements comprise a signal line.
Claim 21
Dependent Claim
120 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) a first TAB leadframe comprising a conductive element formed on a first substantially planar, flexible tape insulating member; b) a second TAB leadframe comprising a conductive element formed on a second substantially planar, flexible tape insulating member; c) a third TAB leadframe formed on a third substantially planar, flexible tape insulating member, the third TAB leadframe comprising a signal line conductive element positioned in stacked relation between the first and second leadframes to form a buried stripline; and d) solder bump means comprising solder bumps for electrically and mechanically connecting selected leadframe conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 22
Dependent Claim
120 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) a first TAB leadframe comprising a conductive element formed on a first substantially planar, flexible tape insulating member; b) a second TAB leadframe comprising a conductive element formed on a second substantially planar, flexible tape insulating member; c) a third TAB leadframe formed on a third substantially planar, flexible tape insulating member, the third TAB leadframe comprising a signal line conductive element positioned in stacked relation between the first and second leadframes to form a buried stripline; and d) solder bump means comprising solder bumps for electrically and mechanically connecting selected leadframe conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 23
Dependent Claim
23 words
A stacked leadframe assembly according to claim 18 wherein a portion of the solder bumps connect conductive elements with an integrated circuit chip.
Claim 24
Dependent Claim
19 words
A stacked leadframe assembly according to claim 18 wherein each leadframe comprises dielectric material for separating the conductive elements.
Claim 25
Dependent Claim
39 words
A stacked leadframe assembly according to clam 1 further comprising protective means located around portions of the stacked leadframes while permitting other portions of the stacked leadframes to protrude from the protective means to provide connection with other devices.
Claim 26
Dependent Claim
39 words
A stacked leadframe assembly according to clam 1 further comprising protective means located around portions of the stacked leadframes while permitting other portions of the stacked leadframes to protrude from the protective means to provide connection with other devices.
Claim 27
Dependent Claim
119 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) a first TAB leadframe comprising a conductive element formed on a first substantially planar, flexible tape insulating member; b) a second TAB leadframe comprising a conductive element formed on a second substantially planar, flexible tape insulating member; c) a third TAB leadframe formed on a third substantially planar, flexible tape insulating member, the third TAB leadframe comprising a signal line conductive element positioned in stacked relation between the first and second leadframes to form a microstrip; and d) solder bump means comprising solder bumps for electrically and mechanically connecting selected leadframe conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 28
Dependent Claim
119 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) a first TAB leadframe comprising a conductive element formed on a first substantially planar, flexible tape insulating member; b) a second TAB leadframe comprising a conductive element formed on a second substantially planar, flexible tape insulating member; c) a third TAB leadframe formed on a third substantially planar, flexible tape insulating member, the third TAB leadframe comprising a signal line conductive element positioned in stacked relation between the first and second leadframes to form a microstrip; and d) solder bump means comprising solder bumps for electrically and mechanically connecting selected leadframe conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 29
Dependent Claim
23 words
A stacked leadframe assembly according to claim 22 wherein a portion of the solder bumps connect conductive elements with an integrated circuit chip.
Claim 30
Dependent Claim
19 words
A stacked leadframe assembly according to claim 22 wherein each leadframe comprises dielectric material for separating the conductive elements.
Claim 31
Dependent Claim
78 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising linear conductive elements formed on a substantially planar, flexible tape insulating member; b) solder bump means comprising solder bumps for electrically and mechanically connecting selective conductive elements formed on the flexible tape insulating members of the leadframes; and c) component means mounted to the stacked leadframe assembly for providing improved signal performance.
Claim 32
Dependent Claim
78 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising linear conductive elements formed on a substantially planar, flexible tape insulating member; b) solder bump means comprising solder bumps for electrically and mechanically connecting selective conductive elements formed on the flexible tape insulating members of the leadframes; and c) component means mounted to the stacked leadframe assembly for providing improved signal performance.
Claim 33
Dependent Claim
28 words
A stacked leadframe assembly according to claim 25 wherein the component means comprises a decoupling capacitor attached between power and ground conductive elements of the stacked leadframe assembly.
Claim 34
Dependent Claim
68 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising linear conductive elements formed on a substantially planar, flexible tape insulating member; and b) solder bump means comprising stacked solder bumps for providing direct electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 35
Dependent Claim
68 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in stacked relation, each leadframe comprising linear conductive elements formed on a substantially planar, flexible tape insulating member; and b) solder bump means comprising stacked solder bumps for providing direct electrical and mechanical connection with selected conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 36
Dependent Claim
24 words
A stacked leadframe assembly according to claim 27 wherein a portion of the stacked solder bumps connect conductive elements with an integrated circuit chip.
Claim 37
Dependent Claim
22 words
A stacked leadframe assembly according to claim 27 wherein each leadframe comprises dielectric material for selectively maintaining separation between adjacent conductive elements.
Claim 38
Dependent Claim
16 words
A stacked leadframe assembly according to claim 27 wherein the conductive elements comprise a ground conductor.
Claim 39
Dependent Claim
16 words
A stacked leadframe assembly according to claim 30 wherein the ground conductor comprises a ground plane.
Claim 40
Dependent Claim
16 words
A stacked leadframe assembly according to claim 27 wherein the conductive elements comprise a power conductor.
Claim 41
Dependent Claim
16 words
A stacked leadframe assembly according to claim 32 wherein the power conductor comprises a power plane.
Claim 42
Dependent Claim
16 words
A stacked leadframe assembly according to claim 27 wherein the conductive elements comprise a signal line.
Claim 43
Dependent Claim
100 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in a stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member comprising a layer of dielectric material, each leadframe further comprising solder bump means and conductive elements located within the dielectric layer; the solder bumps means comprising vertically stacked solder bumps extending respectively through each of the stacked multiple tape leadframe dielectric layers for electrically and mechanically connecting selected vertically adjacent conductive elements formed within the dielectric layers of the flexible tape insulating members of the leadframes.
Claim 44
Dependent Claim
100 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in a stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member comprising a layer of dielectric material, each leadframe further comprising solder bump means and conductive elements located within the dielectric layer; the solder bumps means comprising vertically stacked solder bumps extending respectively through each of the stacked multiple tape leadframe dielectric layers for electrically and mechanically connecting selected vertically adjacent conductive elements formed within the dielectric layers of the flexible tape insulating members of the leadframes.
Claim 45
Dependent Claim
121 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in a stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member comprising a layer of dielectric material, each leadframe further comprising solder bump means and conductive elements located within the dielectric layer; the solder bumps means comprising vertically stacked solder bumps extending respectively through each of the multiple tape leadframe dielectric layers for electrically and mechanically connecting selected vertically adjacent conductive elements formed within the dielectric layers of the flexible tape insulating members of the leadframes; and b) component means for providing a component, the component means being mounted to selected solder bumps of the stacked leadframe assembly.
Claim 46
Dependent Claim
121 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) multiple TAB leadframes arranged in a stacked relation, each leadframe comprising a substantially planar, flexible tape insulating member comprising a layer of dielectric material, each leadframe further comprising solder bump means and conductive elements located within the dielectric layer; the solder bumps means comprising vertically stacked solder bumps extending respectively through each of the multiple tape leadframe dielectric layers for electrically and mechanically connecting selected vertically adjacent conductive elements formed within the dielectric layers of the flexible tape insulating members of the leadframes; and b) component means for providing a component, the component means being mounted to selected solder bumps of the stacked leadframe assembly.
Claim 47
Dependent Claim
17 words
A stacked leadframe assembly according to claim 36 wherein the component means comprises an integrated circuit chip.
Claim 48
Dependent Claim
28 words
A stacked leadframe assembly according to claim 36 wherein the component means comprises a decoupling capacitor attached between power and ground conductive elements of the stacked leadframe assembly.
Claim 49
Dependent Claim
44 words
A stacked leadframe assembly according to claim 18 wherein the conductive element in the first leadframe comprises a conductive element stacked from the group consisting of a power conductor, a power plane conductor, a ground conductor, a ground plane conductor, and a signal line.
Claim 50
Dependent Claim
44 words
A stacked leadframe assembly according to claim 18 wherein the conductive element in the second leadframe comprises a conductive element selected from the group consisting of a power conductor, a power plane conductor, a ground conductor, a ground plane conductor, and a signal line.
Claim 51
Dependent Claim
24 words
A stacked leadframe assembly according to claim 18 further comprising a component means mounted to the stacked leadframe assembly for providing improved signal performance.
Claim 52
Dependent Claim
23 words
A stacked leadframe assembly according to claim 22 further comprising component means mounted to the stacked leadframe assembly for providing improved signal performance.
Claim 53
Dependent Claim
126 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) a first TAB leadframe comprising a conductive element formed on a first substantially planar, flexible tape insulating member; b) a second TAB leadframe comprising a conductive element formed on a second substantially planar, flexible tape insulating member; c) a third TAB leadframe formed on a third substantially planar, flexible tape insulating member, the third TAB leadframe comprising a plurality of signal line conductive elements each positioned in stacked relation between the first and second leadframes to form a plurality of buried signal lines; and d) solder bump means comprising solder bumps for electrically and mechanically connecting selected leadframe conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 54
Dependent Claim
126 words
A stacked tape automated bonding (TAB) leadframe assembly for use with integrated circuit chips, comprising: a) a first TAB leadframe comprising a conductive element formed on a first substantially planar, flexible tape insulating member; b) a second TAB leadframe comprising a conductive element formed on a second substantially planar, flexible tape insulating member; c) a third TAB leadframe formed on a third substantially planar, flexible tape insulating member, the third TAB leadframe comprising a plurality of signal line conductive elements each positioned in stacked relation between the first and second leadframes to form a plurality of buried signal lines; and d) solder bump means comprising solder bumps for electrically and mechanically connecting selected leadframe conductive elements formed on the flexible tape insulating members of the leadframes.
Claim 55
Dependent Claim
42 words
A stacked leadframe assembly according to claim 18 further comprising protective means for providing protection around portions of the stacked leadframes and for permitting other portions of the stacked leadframes to protrude from the protective means to provide connection with other devices.
Claim 56
Dependent Claim
42 words
A stacked leadframe assembly according to claim 22 further comprising protective means for providing protection around portions of the stacked leadframes and for permitting other portions of the stacked leadframes to protrude from the protective means to provide connection with other devices.
References Cited (Backward Citations)
US3683105A
Cited
US3684818A
Cited
EP0039160A2
Cited
US4454529A
Cited
US4496965A
Cited
US4410905A
Cited
US4538210A
Cited
US4551746A
Cited
US4513355A
Cited
US4827327A
Cited
JPS6217749A
Cited
US4705917A
Cited
US4801765A
Cited
JPS62173749A
Cited
US4885126A
Cited
EP0268260A1
Cited
US4791473A
Cited
US4796078A
Cited
US4801999A
Cited
US4849857A
Cited
US4878990A
Cited
US4980753A
Cited
US5010387A
Cited
US4912547A
Cited
US4948645A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-24 | 1995-09-23 | 1996-03-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-24 | 1999-09-23 | 2000-03-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-24 | 2003-09-23 | 2004-03-24 | $7700.00 | Window Closed / Lapsed |