US3684818A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-layer beam-lead wiring for semiconductor packages
Assignee: Sprague Electric Co
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Filing: 1970-10-20
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Granted: 1972-08-15
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Expires: 1990-10-20
Abstract
Abstract A ceramic package having Kapton reverse beam leads with two sided wiring boards, plated thru holes, and pinouts on the exterior of the package. This package is bound together with preformed sheet adhesive and heat bonded together as are standard packages, but at a lower temperature. The leads are part of the interconnecting pattern and can be made as one piece, and eliminates many connections from inside to outside the package.
Inventors
- 👤 Paul H Netherwood
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 13:04
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W72/071; H10W72/077
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
153 words
A packaged semiconductor device comprising a non-rigid plastic substrate, copper wiring strips bonded on both sides of said plastic substrate providing therewith a reverse beam lead wiring unit, a ceramic substrate having at least one integrated circuit chip mounted thereon, at least one of said copper strips of said wiring unit being conductively bonded to a terminal on said circuit chip, said wiring unit being bonded to said ceramic substrate around said circuit chip by a first insulating resin member, a ceramic cap being bonded to said wiring unit opposite said ceramic substrate by a second insulating resin member, said ceramic substrate and said ceramic cap and said first and said second resin members providing a sealed package containing said circuit chip and said terminal, said wiring unit extending outwardly from between said first and said second resin members and providing a copper contact from said terminal to the outside of said package.
Claim 2
Dependent Claim
153 words
A packaged semiconductor device comprising a non-rigid plastic substrate, copper wiring strips bonded on both sides of said plastic substrate providing therewith a reverse beam lead wiring unit, a ceramic substrate having at least one integrated circuit chip mounted thereon, at least one of said copper strips of said wiring unit being conductively bonded to a terminal on said circuit chip, said wiring unit being bonded to said ceramic substrate around said circuit chip by a first insulating resin member, a ceramic cap being bonded to said wiring unit opposite said ceramic substrate by a second insulating resin member, said ceramic substrate and said ceramic cap and said first and said second resin members providing a sealed package containing said circuit chip and said terminal, said wiring unit extending outwardly from between said first and said second resin members and providing a copper contact from said terminal to the outside of said package.
Claim 3
Dependent Claim
15 words
The package device of claim 1 wherein said plastic substrate is polypyromellitimide, a polyimide plastic.
Claim 4
Dependent Claim
43 words
The packaged device of claim 1 wherein said copper strips have a 25 percent stretch factor, said wiring unit has at least one hole therethrough, and wherein said at least one of said copper strips is bonded through said hole to said terminal.
Claim 5
Dependent Claim
48 words
The packaged device of claim 1 wherein said plastic substrate is polypyromellitimide, said copper strips have a 25 percent stretch factor, said wiring unit has at least one hole therethrough, and wherein said at least one of said copper strips is bonded through said hole to said terminal.
References Cited (Backward Citations)
US3390308A
Cited
US3544857A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-08-15 | 1976-02-14 | 1976-08-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-08-15 | 1980-02-14 | 1980-08-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-08-15 | 1984-02-14 | 1984-08-15 | $7700.00 | Window Closed / Lapsed |