US4496965A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stacked interdigitated lead frame assembly
Assignee: Texas Instruments Inc
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Filing: 1984-01-09
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Granted: 1985-01-29
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Expires: 2004-01-09
Abstract
Abstract An integrated circuit package having a large number of external connections is assembled using two lead frames stacked one atop the other. The lead frames have complementary lead patterns which interdigitate to provide a very close lead spacing at the periphery of a semiconductor chip on which a complex integrated circuit is fabricated.
Inventors
- 👤 John W. Orcutt
- 👤 Angus W. Hightower
- 👤 Reginald W. Smith
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:01
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/442
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
117 words
A lead frame assembly for an integrated circuit device comprising: a first lead frame having opposed side rails and a first group of leads extending inward from each side rail; and a second lead frame disposed atop and in contact with the first lead frame, the second lead frame having opposed side rails and a second group of leads extending inward therefrom, wherein each lead in the second group of leads includes a joggled section near its associated side rail and wherein the second group of leads is staggered in relationship to the first group of leads so that the leads of the second group lie between and substantially coplanar with adjacent leads of the first group.
Claim 2
Dependent Claim
117 words
A lead frame assembly for an integrated circuit device comprising: a first lead frame having opposed side rails and a first group of leads extending inward from each side rail; and a second lead frame disposed atop and in contact with the first lead frame, the second lead frame having opposed side rails and a second group of leads extending inward therefrom, wherein each lead in the second group of leads includes a joggled section near its associated side rail and wherein the second group of leads is staggered in relationship to the first group of leads so that the leads of the second group lie between and substantially coplanar with adjacent leads of the first group.
Claim 3
Dependent Claim
58 words
The lead frame assembly of claim 1, further comprising a heat sink for supporting a semiconductor integrated circuit chip wherin said heat sink is anchored to at least one of said lead frames, said heat sink including a plurality of raised, generally frustoconical heat transfer elements extending outward from a surface thereof away from said integrated circuit chip.
References Cited (Backward Citations)
US1649741A
Cited
US3469017A
Cited
US3646409A
Cited
US3676748A
Cited
US4079511A
Cited
JPS5512791A
Cited
US4195193A
Cited
JPS5624955A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-01-29 | 1988-07-30 | 1989-01-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-01-29 | 1992-07-30 | 1993-01-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-01-29 | 1996-07-30 | 1997-01-29 | $7700.00 | Window Closed / Lapsed |