US3646409A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat-sinking package for semiconductor integrated circuit
Assignee: US Philips Corp
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Filing: 1969-07-29
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Granted: 1972-02-29
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Expires: 1989-07-29
Abstract
Abstract A package to improve heat dissipation of a semiconductor integrated circuit is described. The semiconductor crystal is mounted on one conductor of a lead frame, to which is joined a cooling block, and then the assembly encapsulated in a resin envelope, such that the whole block, except for the side joined to the conductor, lies outside the plane of the conductors. In this way, adequate heat dissipation is ensured via the block rather than the lead conductors themselves. If desired, this first package can then be encapsulated in a second resin envelope containing a second conductor set and a second cooler in the form of a plate.
Inventors
- 👤 Johannes Theodorus Van D Water
- 👤 Joannes Joseph Van Hout
- 👤 Arie Baelde
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 16:45
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
207 words
A semiconductor device comprising a semiconductor crystal containing an integrated circuit, a first set of striplike electrical conductors having portions situated substantially in one plane, means for electrically connecting some of the first set of conductors to points of the integrated circuit on the crystal, means joining the crystal in an electrically conductive manner to another of the conductors as a support therefor, a first solid cooling element, means joining the cooling element on one of its sides to said other conductor on the side thereof opposite to the side joined to the crystal, a first insulating envelope of synthetic material encapsulating the crystal, the connecting means, and a part of the conductors adjacent the connecting means and including the portions thereof situated substantially in said one plane, all of the cooling element except for the side joined to said other conductor extending outside said one plane in which the conductor portions are situated, a second set of striplike electrical conductors, means connecting ends of the first conductor set remote from the crystal to adjacent ends of the second conductor set, and a second insulating envelope of synthetic material encapsulating the first envelope, the first conductor set, and the part of the second conductor set adjacent thereto.
Claim 2
Dependent Claim
207 words
A semiconductor device comprising a semiconductor crystal containing an integrated circuit, a first set of striplike electrical conductors having portions situated substantially in one plane, means for electrically connecting some of the first set of conductors to points of the integrated circuit on the crystal, means joining the crystal in an electrically conductive manner to another of the conductors as a support therefor, a first solid cooling element, means joining the cooling element on one of its sides to said other conductor on the side thereof opposite to the side joined to the crystal, a first insulating envelope of synthetic material encapsulating the crystal, the connecting means, and a part of the conductors adjacent the connecting means and including the portions thereof situated substantially in said one plane, all of the cooling element except for the side joined to said other conductor extending outside said one plane in which the conductor portions are situated, a second set of striplike electrical conductors, means connecting ends of the first conductor set remote from the crystal to adjacent ends of the second conductor set, and a second insulating envelope of synthetic material encapsulating the first envelope, the first conductor set, and the part of the second conductor set adjacent thereto.
Claim 3
Dependent Claim
58 words
A semiconductor device as claimed in claim 1 wherein another side of the first cooling element is situated on the outside of the first insulating envelope, a second heat-conducting plate is connected to the outer other side of the first cooling element, and the second plate is incorporated at least partly in the second envelope of synthetic material.
Claim 4
Dependent Claim
29 words
A semiconductor device as claimed in claim 2 wherein the second plate is constructed so that its outer surface coincides substantially with an outer surface of the second envelope.
Claim 5
Dependent Claim
21 words
A semiconductor device as claimed in claim 2 wherein the ends of the second heat-conducting plate project from the second envelope.
Claim 6
Dependent Claim
29 words
A semiconductor device as claimed in claim 4 wherein the ends of the second plate projecting from the envelope include a mounting hole for mounting to a heat sink.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-02-28 | 1975-08-30 | 1976-02-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-02-28 | 1979-08-30 | 1980-02-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-02-28 | 1983-08-30 | 1984-02-29 | $7700.00 | Window Closed / Lapsed |