US4984059A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and a method for fabricating the same
Assignee: Fujitsu Ltd
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Filing: 1983-10-07
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Granted: 1991-01-08
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Expires: 2003-10-07
Abstract
Abstract In a plastic molded semiconductor device in which inner leads overlap a semiconductor chip in a molded plastic body, the width of the chip may be close to the width of the plastic body without a decrease in the high resistance of the inner leads to the pull out thereof from the plastic body, and the layout of the inner leads may be unrestricted since the inner leads may occupy the region above the chip.
Inventors
- 👤 Akihiro Kubota
- 👤 Rikio Sugiura
- 👤 Tsuyoshi Aoki
- 👤 Michio Ono
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:36
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W90/00; H10W90/811; H10W70/01; H10W70/04; H10W70/411; H10W70/456; H10W70/458; H10W70/475; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/121; H10W74/131; H10W76/00; H10W76/10; H10W76/17; H10W76/18; H10W95/00; H10W72/00; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/541; H10W72/5445; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S257/00; Y10S257/916
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
162 words
A semiconductor device having a molded plastic body, said semiconductor device comprising: a semiconductor chip having a major surface and having electrodes formed on said major surface, said semiconductor chip being encapsulated in the molded plastic body; a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded so that said major surface is opposite to and faces said metal stage, said stage being encapsulated in said molded plastic body; a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and extending over said major surface of said semiconductor chip; and interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip.
Claim 2
Dependent Claim
162 words
A semiconductor device having a molded plastic body, said semiconductor device comprising: a semiconductor chip having a major surface and having electrodes formed on said major surface, said semiconductor chip being encapsulated in the molded plastic body; a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded so that said major surface is opposite to and faces said metal stage, said stage being encapsulated in said molded plastic body; a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and extending over said major surface of said semiconductor chip; and interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip.
Claim 3
Dependent Claim
178 words
A semiconductor device having a molded plastic body, said semiconductor device comprising: a semiconductor chip having electrodes and being encapsulated in the molded plastic body; a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded, said stage being encapsulated in said molded plastic body; a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and said semiconductor chip; and interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip, wherein said electrodes are arranged along at least one side of said semiconductor chip and said inner lead end portion of at least one of said leads extends over said semiconductor chip to a position adjacent to inner sides of said electrodes relative to said semiconductor chip.
Claim 4
Dependent Claim
178 words
A semiconductor device having a molded plastic body, said semiconductor device comprising: a semiconductor chip having electrodes and being encapsulated in the molded plastic body; a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded, said stage being encapsulated in said molded plastic body; a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and said semiconductor chip; and interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip, wherein said electrodes are arranged along at least one side of said semiconductor chip and said inner lead end portion of at least one of said leads extends over said semiconductor chip to a position adjacent to inner sides of said electrodes relative to said semiconductor chip.
Claim 5
Dependent Claim
25 words
A semiconductor device according to claim 2, wherein an insulating film covers an entire top surface of the semiconductor chip except for the electrodes thereof.
Claim 6
Dependent Claim
31 words
A semiconductor device according to claim 2, wherein an insulating film exists in part of the space between the semiconductor chip and only the inner lead end portions of the leads.
Claim 7
Dependent Claim
33 words
A semiconductor device according to claim 4, wherein the insulating film between the semiconductor chip and the inner lead end portions of the leads is adhered to the end portion of the leads.
Claim 8
Dependent Claim
30 words
A semiconductor device according to claim 4, wherein the insulating film between the semiconductor chip and the inner lead end portions of the leads is adhered to the semiconductor chip.
Claim 9
Dependent Claim
16 words
A semiconductor device according to claim 3 or 4, wherein the insulating film is of polyimide.
Claim 10
Dependent Claim
15 words
A semiconductor device according to claim 3 or 4, wherein the insulating film is silicone.
Claim 11
Dependent Claim
52 words
A semiconductor device according to claim 2, wherein the inner lead end portions of the leads are arranged in at least one row, said electrodes of the semiconductor chip being arranged along two sides of the semiconductor chip forming rows of electrodes which run perpendicular to at least one row of leads.
Claim 12
Dependent Claim
154 words
A semiconductor device having a molded plastic body, said semiconductor device comprising: a semiconductor chip having electrodes and being encapsulated in the molded plastic body; a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded, said stage being encapsulated in said molded plastic body; a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and said semiconductor chip; and interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip, wherein the stage is a capacitor made of a ceramic plate having two electrodes, each electrode being interconnected to one of the leads.
Claim 13
Dependent Claim
154 words
A semiconductor device having a molded plastic body, said semiconductor device comprising: a semiconductor chip having electrodes and being encapsulated in the molded plastic body; a thin, flat, self-supportive metal stage onto which said semiconductor chip is bonded, said stage being encapsulated in said molded plastic body; a plurality of leads, each comprising an inner lead end portion embedded in the molded plastic body and an outer lead end portion extending outside of the molded plastic body, said inner lead end portions of the leads being spaced apart from said semiconductor chips, said inner lead end portion of at least one of the leads overlapping said stage and said semiconductor chip; and interconnection wires interconnecting each of said inner lead end portions and each of said electrodes of said semiconductor chip, wherein the stage is a capacitor made of a ceramic plate having two electrodes, each electrode being interconnected to one of the leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-07 | 1994-07-09 | 1995-01-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-07 | 1998-07-09 | 1999-01-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-07 | 2002-07-09 | 2003-01-08 | $7700.00 | Window Closed / Lapsed |