Lead frame for integrated circuit

Abstract

Abstract PURPOSE:To conduct low-melting point glass sealing having high reliability at low cost by coating a wire joining section with Al in dotted shape and thinly coating the glass sealing section of the outer circumference with an oxide layer having excellent adhesive property to glass. CONSTITUTION:The wire joining section on the substrate 2 of the lead frame is coated with Al 8 in dotted form, and the glass sealing section of the outer circumference is coated with the oxide layer 9 and close adhesion force with glass is improved. The glass 5, 5' for sealing is sealed through the oxide layer 9 formed to the surface of 42 alloy 2 of the lead frame. Accordingly, strong sealing having high reliability is conducted through diffused junction. Al2O3, Y2O3 Sio2, B2O3 and PbO are effective as the oxide 9. These substances are cheap, approximate to the components of low-melting point glass for sealing and are mutually diffused and melted and a stable junction is obtained, and glass sealing having high reliability can be conducted when vapor-evaporation is conducted physically or chemically and the layer is uniformly coated in the thickness of 0.1-3mum.

Inventors

• 👤 Nobuo Ogasa
• 👤 小笠　伸夫
• 👤 Akira Otsuka
• 👤 昭 大塚

Bibliographic Details