EP0089044A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
A semiconductor device having a container sealed with a solder of low melting point
Assignee: NEC Corp
•
Filing: 1983-03-14
•
Granted: —
•
Expires: 2003-03-14
Abstract
Abstract A semiconductor device forming a hermetically sealed housing for a semiconductor element, comprising a base member, a wall member surrounding the semiconductor element, and a cover hermetically sealed to the wall member. According to the invention, an intermediate annular member (17) is interposed-between the cover (11) and wall member (12'), the intermediate member being attached to the cover by a solder glass (16) and exhibiting a metal surface facing the wall member for being attached to the wall member by metallic solder. A protrusion (15) of the wall member (12') fully or partly surrounds the intermediate member (17) and is also attached thereto by metallic solder. This structure enables the manufacture of a perfectly sealed housing without applying excessive heat to the assembled device which may damage the semiconductor element.
Inventors
- 👤 Kazuo Okano
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 04:36
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W76/63; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
88 words
A semiconductor device comprising: a semiconductor element; a base member supporting said semiconductor element thereon; a wall member supported on said base member while enclosing said semiconductor element; a first frame overlaid on and attached to said wall member by a metallic soldering material; and a cap member attached to said first frame by a glassy adhesive, whereby said semiconductor element is hermetically sealed in a container including said base member, said wall member, said first frame, said cap member, said metallic soldering material and said glassy adhesive.
Claim 2
Dependent Claim
88 words
A semiconductor device comprising: a semiconductor element; a base member supporting said semiconductor element thereon; a wall member supported on said base member while enclosing said semiconductor element; a first frame overlaid on and attached to said wall member by a metallic soldering material; and a cap member attached to said first frame by a glassy adhesive, whereby said semiconductor element is hermetically sealed in a container including said base member, said wall member, said first frame, said cap member, said metallic soldering material and said glassy adhesive.
Claim 3
Dependent Claim
33 words
The semiconductor device as claimed in Claim 1, further comprising a second frame placed above said wall member such that said metallic soldering material fills the gap between said first and second frames.
Claim 4
Dependent Claim
18 words
The semiconductor.device as claimed in Claim 2, wherein said cap member is made of an optically transparent material.
Claim 5
Dependent Claim
24 words
The semiconductor device as claimed in Claim 2, wherein said first and second frames at least partially overlap in the direction of their widths.
Claim 6
Dependent Claim
19 words
The semiconductor device as claimed in Claim 4, wherein said cap member is made of an optically transparent material.
Claim 7
Dependent Claim
25 words
The semiconductor device as claimed in Claim 2, wherein said second frame is made integrally of the same material as that of said wall member.
Claim 8
Dependent Claim
19 words
The semiconductor device as claimed in Claim 6, wherein said cap member is made of an optically transparent material.
Claim 9
Dependent Claim
95 words
A semiconductor device comprising: a semiconductor .element; a base member supporting said semiconductor element thereon; a wall member supported on said base member and enclosing said semiconductor element; a first frame attached onto said wall member while substantially enclosing said semiconductor element; a second frame overlaid on and attached to said wall member by a metallic soldering material such that said metallic soldering material fills up the gap between said first and second frames, and such that it encloses said second frame; and a cap member attached to said second frame by a glassy adhesive.
Claim 10
Dependent Claim
95 words
A semiconductor device comprising: a semiconductor .element; a base member supporting said semiconductor element thereon; a wall member supported on said base member and enclosing said semiconductor element; a first frame attached onto said wall member while substantially enclosing said semiconductor element; a second frame overlaid on and attached to said wall member by a metallic soldering material such that said metallic soldering material fills up the gap between said first and second frames, and such that it encloses said second frame; and a cap member attached to said second frame by a glassy adhesive.
Claim 11
Dependent Claim
24 words
The semiconductor device as claimed in Claim 8, wherein said first and second frames at least partially overlap in the direction of their widths.
Claim 12
Dependent Claim
19 words
The semiconductor device as claimed in Claim 9, wherein said cap member is made of an optically transparent material.
Claim 13
Dependent Claim
21 words
The semiconductor device as claimed in Claim 10, wherein said metallic soldering material has a melting point of at most 200°C.
Claim 14
Dependent Claim
20 words
The semiconductor device as claimed in Claim 10, wherein both of said first and second frames are made of metal.
Claim 15
Dependent Claim
25 words
The semiconductor device as claimed in Claim 10, .wherein said first frame is made integrally of the same material as that of said wall member.
Claim 16
Dependent Claim
17 words
The semiconductor device as claimed in Claim 10, wherein said semiconductor element is covered-with an optical filter.
Claim 17
Dependent Claim
20 words
The semiconductor device as claimed in Claim 11, wherein said semiconductor element includes an optical filter overlying the surface thereof.
Claim 18
Dependent Claim
29 words
The semiconductor device as claimed in Claim 9, wherein the surface of said first frame which faces said cap member has a poor wettability with said metallic soldering material.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.