US4965654A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package with ground plane
Assignee: International Business Machines Corp
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Filing: 1989-10-30
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Granted: 1990-10-23
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Expires: 2009-10-30
Abstract
Abstract A plastic encapsulated semiconductor package in which the connecting lead frame members are deposited over the surface of the device together with a covering ground plane so as to provide enhanced electrical and thermal coupling of the members and the device and so reduce the signal to noise ratio by a factor or greater than three over that available in other similar plastic encapsulated packages while simultaneously improving the transfer of heat out of the package. In particular, a lead frame having a plurality of conductors is attached to a major active surface of a semiconductor chip via a ground plane which, in the preferred embodiment, is a multilayered structure containing an insulated integral, uniform ground plane positioned between the lead frame and the chip and adhesively and insulatively joined to both of them. Wires connect terminals on the major active surface of the semiconductor chip to the ground plane and to selective lead frame conductors. The lead frame, the ground plane structure, the semiconductor chip, and the wires which connect the semiconductor chip terminals to the ground plane and to selected lead frame conductors are encapsulated with a suitable insulating material to form a semiconductor module or package.
Inventors
- 👤 Friedrich A. Karner
- 👤 Douglas W. Phelps, Jr.
- 👤 Stephen G. Starr
- 👤 William C. Ward
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 18:18
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/464; H10W70/468; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
130 words
An encapsulated semiconductor module comprising: a semiconductor chip having a major surface with terminals thereon disposed within an encapsulating material; a plurality of self supporting unitary, discrete, and continuous lead frame conductors formed of metal sheet stock extending over said major surface of said chip at spaced locations from said terminals, said lead frame conductor extending from said chip and cantilevered out of the encapsulating material; a ground plane interposed between said lead frame conductors and said major surface and insulatively bonded to said lead frame conductors and said major surface; discrete electrical conducting means bonded to said conductors and said terminals and electrically connecting said conductors to said terminals, and at least one electrical conducting means bonded to a selected one of said conductors and to said ground plane.
Claim 2
Dependent Claim
130 words
An encapsulated semiconductor module comprising: a semiconductor chip having a major surface with terminals thereon disposed within an encapsulating material; a plurality of self supporting unitary, discrete, and continuous lead frame conductors formed of metal sheet stock extending over said major surface of said chip at spaced locations from said terminals, said lead frame conductor extending from said chip and cantilevered out of the encapsulating material; a ground plane interposed between said lead frame conductors and said major surface and insulatively bonded to said lead frame conductors and said major surface; discrete electrical conducting means bonded to said conductors and said terminals and electrically connecting said conductors to said terminals, and at least one electrical conducting means bonded to a selected one of said conductors and to said ground plane.
Claim 3
Dependent Claim
16 words
The module of claim 1 wherein said ground plane comprises a copper sheet having insulation thereon.
Claim 4
Dependent Claim
11 words
The module of claim 2 wherein the insulation comprises a polyimide.
Claim 5
Dependent Claim
55 words
The module of claim 1 wherein the ground plane comprises a multilayer structure consisting of a copper sheet having two major surfaces, an insulator adhesively joined to each major surface and an adhesive coating on each insulator for adhering said ground plane structures to said lead frame conductors and the major surface of the chip.
Claim 6
Dependent Claim
15 words
The module of claim 4 wherein the adhesives used in said structure is butyrl phenolic
Claim 7
Dependent Claim
11 words
The module of claim 1 wherein said ground plane is bipartite.
Claim 8
Dependent Claim
28 words
The module of claim 4 wherein said ground plane structure is provided with exposed areas on one of said major surfaces for bonding said electrical conducting means thereto.
Claim 9
Dependent Claim
14 words
The module of claim 1 wherein said electrical conducting means comprises a gold wire.
Claim 10
Dependent Claim
142 words
An encapsulated semiconductor module comprising; a semiconductor chip having terminals thereon disposed within an encapsulating material; a plurality of self supporting unitary, discrete, and continuous lead frame conductors, formed of metal sheet stock, extending over said chip and positioned to avoid contact with said terminals; said lead frame conductors extending from said chip and cantilevered out of the encapsulating material, a ground plane having a terminal thereon positioned between said lead frame conductors and said chip, electrically insulating material disposed between said chip and said ground plane and between said ground plane and said plurality of lead frame conductors, and attached to said plurality of lead frame conductors to said ground plane, and to said semiconductor chip with respective adhesive layers; and discrete electrical conducting wire means respectively bonded to each conductor and electrically connecting a respective conductor to a respective terminal.
Claim 11
Dependent Claim
142 words
An encapsulated semiconductor module comprising; a semiconductor chip having terminals thereon disposed within an encapsulating material; a plurality of self supporting unitary, discrete, and continuous lead frame conductors, formed of metal sheet stock, extending over said chip and positioned to avoid contact with said terminals; said lead frame conductors extending from said chip and cantilevered out of the encapsulating material, a ground plane having a terminal thereon positioned between said lead frame conductors and said chip, electrically insulating material disposed between said chip and said ground plane and between said ground plane and said plurality of lead frame conductors, and attached to said plurality of lead frame conductors to said ground plane, and to said semiconductor chip with respective adhesive layers; and discrete electrical conducting wire means respectively bonded to each conductor and electrically connecting a respective conductor to a respective terminal.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-10-22 | 1994-04-23 | 1994-10-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-10-22 | 1998-04-23 | 1998-10-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-10-22 | 2002-04-23 | 2002-10-23 | $7700.00 | Window Closed / Lapsed |