US5095402A
Expired / Lapsed
US
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Internally decoupled integrated circuit package
Assignee: Circuit Components Inc
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Filing: 1990-10-02
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Granted: 1992-03-10
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Expires: 2010-10-02
Abstract
Abstract A decoupling scheme is presented which is well suited for use with any type of integrated circuit package. In accordance with the present invention, a flat decoupling capacitor is attached directly to the top of an IC die and is electrically connected to the IC by means of raised conductive bumps provided either on the surface of the decoupling capacitor or on the IC die surface. These conductive bumps interconnect the internal electrodes of the capacitor to the power and ground circuits of the IC. The resulting decoupling scheme provides a decoupling loop with an inductance which is significantly lower than previously disclosed decoupling loops.
Inventors
- 👤 Jorge M. Hernandez
- 👤 Michael S. Hyslop
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:32
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/475; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/721; H10W90/728; H10W90/731; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
124 words
An integrated circuit package comprising: a housing; an integrated circuit (IC) chip in said housing, said IC chip including a planar surface having a first plurality of contact pads peripherally arranged therealong and a second plurality of contact pads spaced inwardly from said first pads, said second pads corresponding to voltage and/or ground connections of said IC chip; a decoupling capacitor on said planar surface of said IC chip, said decoupling capacitor including a planar surface having a third plurality of contact pads arranged in a pattern corresponding to said second pads on said IC chip; and connecting means for electrically interconnecting said second and third pads wherein said decoupling capacitor is electrically connected to said voltage and/or ground connections of said IC chip.
Claim 2
Dependent Claim
124 words
An integrated circuit package comprising: a housing; an integrated circuit (IC) chip in said housing, said IC chip including a planar surface having a first plurality of contact pads peripherally arranged therealong and a second plurality of contact pads spaced inwardly from said first pads, said second pads corresponding to voltage and/or ground connections of said IC chip; a decoupling capacitor on said planar surface of said IC chip, said decoupling capacitor including a planar surface having a third plurality of contact pads arranged in a pattern corresponding to said second pads on said IC chip; and connecting means for electrically interconnecting said second and third pads wherein said decoupling capacitor is electrically connected to said voltage and/or ground connections of said IC chip.
Claim 3
Dependent Claim
22 words
The IC package of claim 1 wherein said connecting means comprises: a conductive bump deposited on each of said second contact pads.
Claim 4
Dependent Claim
12 words
The IC package of claim 2 wherein: said conductive bump comprises solder.
Claim 5
Dependent Claim
22 words
The IC package of claim 1 wherein said connecting means comprises: a conductive bump deposited on each of said third contact pads.
Claim 6
Dependent Claim
12 words
The IC package of claim 4 wherein: said conductive bump comprises solder.
Claim 7
Dependent Claim
112 words
The IC package of claim 1 wherein said decoupling capacitor comprises: a non-conductive support substrate; a first electrode on said support substrate; at least one layer of dielectric material on said first electrode; a second electrode on said layer of dielectric material with said dielectric material being sandwiched between said first and second electrodes; a non-conductive layer on said second electrode; a plurality of spaced first conductive vias extending from said first electrode through said dielectric material, said second electrode and said non-conductive layer; a plurality of spaced second conductive vias extending from said second electrode and through said non-conductive layer; said first and second vias terminating at said third contact pads.
Claim 8
Dependent Claim
18 words
The IC package of claim 6 including: a conductive bump deposited on each of said third contact pads.
Claim 9
Dependent Claim
19 words
The IC package of claim 7 including: an adherence layer between said third contact pad and said conductive bump.
Claim 10
Dependent Claim
14 words
The IC package of claim 8 wherein: said adherence layer comprises nickel or chromium.
Claim 11
Dependent Claim
17 words
The IC package of claim 6 including: a solder layer on each of said third contact pads.
Claim 12
Dependent Claim
16 words
The IC package of claim 6 wherein: said electrodes are screen printed, vapor deposited or sputtered.
Claim 13
Dependent Claim
21 words
The IC package of claim 6 wherein: said dielectric layer comprises a thin deposited layer of ceramic paste or dielectric sol-gel.
Claim 14
Dependent Claim
21 words
The IC package of claim 12 wherein: said dielectric layer has a thickness of less than or equal to 0.001 inch.
Claim 15
Dependent Claim
20 words
The IC package of claim 6 wherein: said capacitor has a thickness of less than or equal to 0.0024 inch.
Claim 16
Dependent Claim
14 words
The IC package of claim 6 wherein: said support substrate comprises a ceramic material.
Claim 17
Dependent Claim
19 words
The IC package of claim 15 wherein: said ceramic substrate has a thickness of about 0.008 to 0.010 inch.
Claim 18
Dependent Claim
50 words
An integrated circuit chip comprising: a block of semi-conductive material including a planar surface having a first plurality of contact pads peripherally arranged therealong and a second plurality of contact pads spaced inwardly from said first pads, said second pads corresponding to voltage and/or ground connections of said IC chip.
Claim 19
Dependent Claim
50 words
An integrated circuit chip comprising: a block of semi-conductive material including a planar surface having a first plurality of contact pads peripherally arranged therealong and a second plurality of contact pads spaced inwardly from said first pads, said second pads corresponding to voltage and/or ground connections of said IC chip.
Claim 20
Dependent Claim
114 words
A decoupling capacitor comprising: a non-conductive support substrate; a first electrode on said support substrate; at least one layer of dielectric material on said first electrode; a second electrode on said layer of dielectric material with said dielectric material being sandwiched between said first and second electrodes; a non-conductive layer on said second electrode; a plurality of spaced first conductive vias extending from said first electrode through said dielectric material, said second electrode and said non-conductive layer; a plurality of spaced second conductive vias extending from said second electrode and through said non-conductive layer; and a plurality of contact pads on said non-conductive layer, said first and second vias terminating at said contact pads.
Claim 21
Dependent Claim
114 words
A decoupling capacitor comprising: a non-conductive support substrate; a first electrode on said support substrate; at least one layer of dielectric material on said first electrode; a second electrode on said layer of dielectric material with said dielectric material being sandwiched between said first and second electrodes; a non-conductive layer on said second electrode; a plurality of spaced first conductive vias extending from said first electrode through said dielectric material, said second electrode and said non-conductive layer; a plurality of spaced second conductive vias extending from said second electrode and through said non-conductive layer; and a plurality of contact pads on said non-conductive layer, said first and second vias terminating at said contact pads.
Claim 22
Dependent Claim
16 words
The capacitor of claim 18 including: a conductive bump deposited on each of said contact pads.
Claim 23
Dependent Claim
19 words
The capacitor of claim 19 including: an adherence layer between each of said contact pads and said conductive bumps.
Claim 24
Dependent Claim
13 words
The capacitor of claim 20 wherein: said adherence layer comprises nickel or chromium.
Claim 25
Dependent Claim
15 words
The capacitor of claim 18 including: a solder layer on each of said contact pads.
Claim 26
Dependent Claim
15 words
The capacitor of claim 18 wherein: said electrodes are screen printed, vapor deposited or sputtered.
Claim 27
Dependent Claim
20 words
The capacitor of claim 18 wherein: said dielectric layer comprises a thin deposited layer of ceramic paste or dielectric sol-gel.
Claim 28
Dependent Claim
20 words
The capacitor of claim 24 wherein: said dielectric layer has a thickness of less than or equal to 0.001 inch.
Claim 29
Dependent Claim
19 words
The capacitor of claim 18 wherein: said capacitor has a thickness of less than or equal to 0.0024 inch.
Claim 30
Dependent Claim
13 words
The capacitor of claim 18 wherein: said support substrate comprises a ceramic material.
Claim 31
Dependent Claim
18 words
The capacitor of claim 27 wherein: said ceramic substrate has a thickness of about 0.008 to 0.010 inch.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-10 | 1995-09-09 | 1996-03-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-10 | 1999-09-09 | 2000-03-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-10 | 2003-09-09 | 2004-03-10 | $7700.00 | Window Closed / Lapsed |