US4989117A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Molded integrated circuit package incorporating thin decoupling capacitor
Assignee: Circuit Components Inc
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Filing: 1990-02-12
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Granted: 1991-01-29
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Expires: 2010-02-12
Abstract
Abstract A decoupling scheme which is particularly well suited for use with molded integrated circuit packages incorporating lead frames is presented. In accordance with the present invention, a thin decoupling capacitor is used which is comprised of a ceramic or like substrate having printed or otherwise applied thereon conductive layers, dielectric layers (e.g., glass/ceramic dielectric paste or dielectric sol-gel) and protective layers. Mounted on this thin capacitor is an integrated circuit chip. This thin capacitor/IC chip assembly is attached directly to the IC lead frame and thereafter encapsulated within the molded package resulting in a decoupling scheme which is internal to the molded IC package. Printed conductors on the thin capacitor's ceramic substrate are attached to appropriate fingers of the lead frame by welding, soldering or the like to effect strong mechanical and electrical contact.
Inventors
- 👤 Jorge M. Hernandez
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 15:11
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/475; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5449; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W72/951; H10W72/952; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S257/00; Y10S257/916
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
130 words
A molded integrated circuit (IC) package comprising: lead frame means, said lead frame means including a plurality of conductive fingers arranged in a pre-selected pattern, said fingers each having a first end and a second end, said first ends of said fingers terminating at an inner space; a capacitor provided onto a non-conductive support substrate, said capacitor including leads in the form of circuit traces which extend outwardly therefrom and along a surface of said support substrate, said leads being electrically connected to selected fingers of said lead frame means; an integrated circuit chip on said capacitor, said integrated circuit chip being electrically connected to said first ends of said fingers; and molding material encapsulating said integrated circuit chip and capacitor and at least part of said lead frame means.
Claim 2
Dependent Claim
130 words
A molded integrated circuit (IC) package comprising: lead frame means, said lead frame means including a plurality of conductive fingers arranged in a pre-selected pattern, said fingers each having a first end and a second end, said first ends of said fingers terminating at an inner space; a capacitor provided onto a non-conductive support substrate, said capacitor including leads in the form of circuit traces which extend outwardly therefrom and along a surface of said support substrate, said leads being electrically connected to selected fingers of said lead frame means; an integrated circuit chip on said capacitor, said integrated circuit chip being electrically connected to said first ends of said fingers; and molding material encapsulating said integrated circuit chip and capacitor and at least part of said lead frame means.
Claim 3
Dependent Claim
64 words
The IC package of claim 1 wherein said capacitor comprises: a pair of first and second electrodes sandwiching therebetween at least one layer of dielectric material with said leads extending from at least one of said first and second electrodes and with said first and second electrodes comprising a thin layer of deposited conductive material, said first electrode being deposited on said support substrate.
Claim 4
Dependent Claim
16 words
The IC package of claim 2 wherein: said electrodes are screen printed, vapor deposited or sputtered.
Claim 5
Dependent Claim
20 words
The IC package of claim 2 wherein: said capacitor has a thickness of less than or equal to 0.0024 inch.
Claim 6
Dependent Claim
16 words
The IC package of claim 2 including: a non-conductive protective insulating layer on said second electrode.
Claim 7
Dependent Claim
26 words
The IC package of claim 5 including: a conductive layer deposited on said protective insulating layer, said integrated circuit chip being positioned on said conductive layer.
Claim 8
Dependent Claim
18 words
The IC package of claim 2 wherein: said conductive layer is screen printed, vapor deposited, sputtered or electroplated.
Claim 9
Dependent Claim
20 words
The IC package of claim 2 including: a metal clad polymeric film, said film being bonded to said second electrode.
Claim 10
Dependent Claim
18 words
The IC package of claim 2 including: electrically conductive adhesive bonding said second electrode to said circuit chip.
Claim 11
Dependent Claim
16 words
The IC package of claim 9 wherein: said second electrode is free of leads extending therefrom.
Claim 12
Dependent Claim
17 words
The IC package of claim 2 including: leads extending from both of said first and second electrodes.
Claim 13
Dependent Claim
21 words
The IC package of claim 1 wherein: said dielectric layer comprises a thin deposited layer of ceramic paste or dielectric sol-gel.
Claim 14
Dependent Claim
18 words
The IC package of claim 12 wherein: said dielectric layer has a dielectric constant of between about 1750-3000.
Claim 15
Dependent Claim
21 words
The IC package of claim 12 wherein: said dielectric layer has a thickness of less than or equal to 0.001 inch.
Claim 16
Dependent Claim
14 words
The IC package of claim 1 wherein: said support substrate comprises a ceramic material.
Claim 17
Dependent Claim
19 words
The IC package of claim 15 wherein: said ceramic substrate has a thickness of about 0.008 to 0.010 inch.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-01-28 | 1994-07-30 | 1995-01-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-01-28 | 1998-07-30 | 1999-01-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-01-28 | 2002-07-30 | 2003-01-29 | $7700.00 | Window Closed / Lapsed |