Process for manufacturing a multi-layer lead frame having a ground plane and a power supply plane

Claim 1

A process for manufacturing a multi-layer lead frame for a semiconductor device comprising a lead frame body and metal planes including at least one power supply plane and at least one ground plane being adhered to said lead frame body by means of an adhesive material, said process comprising the following steps of: forming a lead frame strip, at least one power supply plane strip and at least one ground strip, each of said strips having surfaces, said lead frame strip comprising a plurality of lead frame bases consecutively arranged and continuously connected to each other, and each of said power supply and ground strips comprising a plurality of metal planes sequentially arranged and continuously connected to each other. coating one surface of a lead frame strip with one material selected from a first group consisting of an adhesive material and an insulative material; coating one surface of said at least one power supply plane strip with an adhesive material and coating said other surface thereof with an insulative material; coating one surface of said at least one ground plane strip with the other material of said first group; positioning said power supply plane strip between said coated surfaces of said lead frame strip and said ground strip so that said adhesive material of said power supply plane strip faces the insulative material on the surface of one of said other strips and said insulative material of said power supply plane strip faces said adhesive material on the surface of said other strip; and adhering said lead frame strip, said at least one power supply plane strip and said at least one ground plane strip together via said adhesive material and said insulative material.