Printed wiring board for high speed signal transmission

Abstract

Abstract PURPOSE:To enable both increasing of the number of input terminals and high packaging density to be easily achieved and to enable the high speed of chip to be sufficiently exhibited, by applying TAB (Tape Automated Bonding) system, and forming feed through wiring on a TAB board. CONSTITUTION:After a copper foil is stuck on a resin film 1 to form a wiring pattern 2, polyimide 6 is coated over the surface on the side of the wiring, and again, copper foils 3 and 5 are thereafter stuck on the upper and lower surfaces, respectively, to form a TAB board. A ground conductor wiring 3 and a rear ground conductor wiring 5 are connected each other through a plurality of through hole conductors 9. An integrated circuit device 7 and a signal transmission wiring 2 are connected each other through bump electrodes 8 which are formed on element electrodes. The space, width, thickness and the like of the signal transmission wiring 2, the ground conductors 3, 5, and the through hole conductors 9 are so selected, respectively, as to produce a predetermined characteristic impedance, thereby these elements form strip transmission lines.

Inventors

• 👤 Kazuyoshi Saito
• 👤 Tomoaki Takubo
• 👤 Toshio Sudo

Bibliographic Details