US5023202A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Rigid strip carrier for integrated circuits
Assignee: LSI Corp
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Filing: 1989-07-14
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Granted: 1991-06-11
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Expires: 2009-07-14
Abstract
Abstract An improved method to assemble tape packaged integrated circuits includes spot welding a strip of TAB tape to a thin strip of copper called a strip carrier. The strip carrier provides mechanical rigidity to the tape during later processing, including die attachment and lead bonding and solder plating, as well as providing ESD protection since each tape lead is shorted to the strip carrier. The packaged die and the surrounding tape are excised from the strip carrier prior to final testing and the strip carrier is capable of being reused. The strip carriers are of a size and shape to be readily handled by existing integrated circuit handling equipment.
Inventors
- 👤 Jon M. Long
- 👤 Michael J. Steidl
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 13:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/077; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/688; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0254; H05K1/0271; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/701; H10W74/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
42 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: providing a strip carrier which is a rigid flat metal plate; attaching the tape to the strip carrier; and bonding the die to the tape leads.
Claim 2
Dependent Claim
42 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: providing a strip carrier which is a rigid flat metal plate; attaching the tape to the strip carrier; and bonding the die to the tape leads.
Claim 3
Dependent Claim
31 words
The process of claim 1, wherein the step of attaching the tape comprises the step of affixing a metal area on the tape to a metal area on the strip carrier.
Claim 4
Dependent Claim
19 words
The process of claim 1, wherein the step of attaching comprises spot welding the tape to the strip carrier.
Claim 5
Dependent Claim
23 words
The process of claim 1, further comprising the step, after the step of attaching the tape, of attaching the die to the tape.
Claim 6
Dependent Claim
23 words
The process of claim 1, further comprising the step, after the step of bonding the die, of encapsulating the die in a package.
Claim 7
Dependent Claim
20 words
The process of claim 5, further comprising the step, after the step of encapsulating the package, of curing the package.
Claim 8
Dependent Claim
23 words
The process of claim 6, further comprising the step, after the step of curing the package, of plating solder on the tape leads.
Claim 9
Dependent Claim
23 words
The process of claim 7, further comprising the step, after the step of plating solder, of excising the die from the strip carrier.
Claim 10
Dependent Claim
12 words
The process of claim 1, wherein the strip carrier substantially comprises copper.
Claim 11
Dependent Claim
29 words
The process of claim 2, wherein the strip carrier is rectangular in shape and the tape is affixed to the die at two opposing sides of the strip carrier.
Claim 12
Dependent Claim
34 words
The process of claim 2, wherein the tape includes at least two attachment areas formed of conductive material on the tape, and the tape is affixed to the strip carrier at the attachment areas.
Claim 13
Dependent Claim
17 words
The process of claim 1, wherein the strip carrier includes alignment holes along at least one side.
Claim 14
Dependent Claim
13 words
The process of claim 1, wherein the bonding step comprises tape automated bonding.
Claim 15
Dependent Claim
12 words
The process of claim 1, wherein the bonding step comprises wire bonding.
Claim 16
Dependent Claim
14 words
The process of claim 1, wherein the bonding step comprises finger-to-bump tape automated bonding.
Claim 17
Dependent Claim
23 words
The process of claim 1, wherein the step of bonding the die to the tape leads comprises attaching the die to the tape.
Claim 18
Dependent Claim
19 words
The process of claim 1, further comprising the step of bonding a plurality of die to the tape leads.
Claim 19
Dependent Claim
23 words
The process of claim 1, wherein the strip carrier means is of a size so as to fit into a semiconductor processing magazine.
Claim 20
Dependent Claim
16 words
The process of claim 1, wherein the strip carrier means includes at last one cut-out section.
Claim 21
Dependent Claim
24 words
The process of claim 1, wherein the strip carrier means has a width in the range of about 45 mm to about 115 mm.
Claim 22
Dependent Claim
21 words
The process of claim 1, wherein the strip carrier means has a thickness of about 0.1 mm to about 0.4 mm.
Claim 23
Dependent Claim
20 words
The process of claim 1, wherein the strip carrier has as small a thickness as possible while maintaining mechanical rigidity.
Claim 24
Dependent Claim
33 words
The process of claim 8, further comprising the step, after the step of excising, of removing the solder plating and tape from the strip carrier so as to render the strip carrier reusable.
Claim 25
Dependent Claim
29 words
The process of claim 7, further comprising the steps, before the step of solder plating, of: plating silver on the strip carrier; and plating nickel on the plate silver.
Claim 26
Dependent Claim
15 words
The process of claim 1, wherein the inner portions of the leads are gold plated.
Claim 27
Dependent Claim
28 words
The process of claim 4, wherein a strip carrier having a particular width is capable of having tapes having a plurality of widths attached to the strip carrier.
Claim 28
Dependent Claim
71 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: attaching the tape to a rigid member; bonding the die to the tape leads; forming a package on the die; plating solder on the tape leads and rigid member; excising the die from the rigid member; and removing the solder plating and tape from the rigid member so as to render the rigid member reusable.
Claim 29
Dependent Claim
71 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: attaching the tape to a rigid member; bonding the die to the tape leads; forming a package on the die; plating solder on the tape leads and rigid member; excising the die from the rigid member; and removing the solder plating and tape from the rigid member so as to render the rigid member reusable.
Claim 30
Dependent Claim
55 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: attaching the tape to a rigid member; bonding the die to the tape leads; forming a package on the die; plating silver on the rigid member; plating nickel on the plated silver; and plating solder on the tape leads.
Claim 31
Dependent Claim
55 words
A process for bonding a semiconductor die to a tape having leads comprising the steps of: attaching the tape to a rigid member; bonding the die to the tape leads; forming a package on the die; plating silver on the rigid member; plating nickel on the plated silver; and plating solder on the tape leads.
References Cited (Backward Citations)
US3778887A
Cited
US4209355A
Cited
US4411719A
Cited
JPS60160625A
Cited
US4835120A
Cited
US4837184A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-06-10 | 1994-12-10 | 1995-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-06-10 | 1998-12-10 | 1999-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-06-10 | 2002-12-10 | 2003-06-11 | $7700.00 | Window Closed / Lapsed |