US5388327A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
Assignee: LSI Corp
•
Filing: 1993-09-15
•
Granted: 1995-02-14
•
Expires: 2013-09-15
Abstract
Abstract A technique for simultaneously forming large numbers of solder ball (or bump) contacts on a surface of a substrate is described. A dissolvable film carrier is provided with holes arranged in a shape to correspond to an array of contact pads on a substrate. The holes are filled with solder. The film carrier retains the solder. The carrier is placed over the surface of the substrate and is heated, causing the solder to re-flow and to wet and to adhere to the contact pads. The carrier, which resists the re-flow temperature, maintains the shape of the solder contacts while cooling. After cooling, the film carrier can be removed from around the solder contacts with a suitable solvent.
Inventors
- 👤 Robert T. Trabucco
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:08
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0607; B23K3/0638; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/3465; H05K3/3468; H10; H10W; H10W70/00; H10W70/099; B23K2101/00; B23K2101/36; B23K2101/42; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2201/10424; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0126; H05K2203/04; H05K2203/041; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K2203/12; H05K2203/128; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
91 words
A method of fabricating a film carrier containing conductive bump contacts for placement on a semiconductor device package, comprising the steps of: forming a non-conductive film of a desired thickness; curing the non-conductive film; forming holes in the non-conductive film of a desired pattern and size; forming conductive contacts in the holes of the non-conductive film comprising the steps of, casting a molten metal into the holes of the non-conductive film, solidifying the molten metal to form conductive contacts; and cutting the non-conductive film containing the conductive contacts into desired shapes.
Claim 2
Independent Claim
91 words
A method of fabricating a film carrier containing conductive bump contacts for placement on a semiconductor device package, comprising the steps of: forming a non-conductive film of a desired thickness; curing the non-conductive film; forming holes in the non-conductive film of a desired pattern and size; forming conductive contacts in the holes of the non-conductive film comprising the steps of, casting a molten metal into the holes of the non-conductive film, solidifying the molten metal to form conductive contacts; and cutting the non-conductive film containing the conductive contacts into desired shapes.
Claim 3
Dependent Claim
22 words
The method of claim 1, wherein the step of forming a non-conductive film is the step of forming a non-conductive dissolvable film.
Claim 4
Dependent Claim
20 words
The method of claim 1, wherein the step of curing is the step of curing with an ultra violet light.
Claim 5
Dependent Claim
19 words
The method of claim 1, wherein the step of curing is the step of heating with an infrared light.
Claim 6
Dependent Claim
46 words
The method of claim 1, wherein the step of forming conductive contacts comprises the steps of: heating molten solder in a crucible; heating the non-conductive film; flowing molten solder into the holes in the non-conductive film; and cooling the molten solder in the holes until solidified.
Claim 7
Dependent Claim
23 words
The method of claim 1, further comprising the step of applying a support backing to the non-conductive film while it is being formed.
Claim 8
Independent Claim
102 words
An apparatus for fabricating a film carrier containing conductive bump contacts for placement on a semiconductor device package, comprising: means for forming a non-conductive film of a desired thickness; means for curing the non-conductive film; means for forming holes in the non-conductive film of a desired pattern and size; means for forming conductive contacts in the holes of the non-conductive film comprising the steps of, means for casting a molten metal into the holes of the non-conductive film, means for solidifying the molten metal to form conductive contacts; and means for cutting the non-conductive film containing the conductive contacts into desired shapes.
Claim 9
Independent Claim
102 words
An apparatus for fabricating a film carrier containing conductive bump contacts for placement on a semiconductor device package, comprising: means for forming a non-conductive film of a desired thickness; means for curing the non-conductive film; means for forming holes in the non-conductive film of a desired pattern and size; means for forming conductive contacts in the holes of the non-conductive film comprising the steps of, means for casting a molten metal into the holes of the non-conductive film, means for solidifying the molten metal to form conductive contacts; and means for cutting the non-conductive film containing the conductive contacts into desired shapes.
Claim 10
Dependent Claim
22 words
The apparatus of claim 7, wherein the means for forming a non-conductive film is the means for forming a non-conductive dissolvable film.
Claim 11
Dependent Claim
14 words
The apparatus of claim 7, wherein the curing means is an ultra violet light.
Claim 12
Dependent Claim
13 words
The apparatus of claim 7, wherein the curing means is an infrared light.
Claim 13
Dependent Claim
51 words
The apparatus of claim 7, wherein the means for forming conductive contacts comprises: means for heating molten solder in a crucible; means for heating the non-conductive film; means for flowing molten solder into the holes in the non-conductive film; and means for cooling the molten solder in the holes until solidified.
Claim 14
Dependent Claim
22 words
The apparatus of claim 7, further comprising means for applying a support backing to the non-conductive film while it is being formed.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-02-13 | 1998-08-15 | 1999-02-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-02-13 | 2002-08-15 | 2003-02-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-02-13 | 2006-08-15 | 2007-02-14 | $7700.00 | Window Closed / Lapsed |