Abstract A pin-grid package is created by starting with printed wiring boards that have plated through holes that can accommodate wire pins. Pins are secured in position to extend outward from one face of the PW board in the form of a pin grid array of the desired configuration which is typically a plurality of concentric rings thereby creating a square grid pattern of predetermined spacing. The opposing PW board face includes a central pin-free area to which is secured a semiconductor die. This face of the PW board includes a plurality of wiring traces that connect each pin to an array that surrounds the semiconductor die. The traces are connected to the bonding pads of the semiconductor die by either wire bonds or a spider assembly using tape assembly bonding. The PW board is located in a mold that has a flat faced first platen that contains cut-out regions that will accommodate the package pins. The other flat-faced mold platen contains molding cavities that are in registry with and slightly larger than the PW boards. The mold cavities include a series of ribs that are distributed around the cavity periphery. These ribs bear against the PW board when the mold is assembled so that the PW board is centered and pressed against the flat face of first platen in the region outboard of the pin-grid pattern. When a liquified plastic encapsulant is forced into the mold the cavities will be filled and the liquid will be excluded from the pin side of the PW board.
A molded pin grid array package comprising: a printed circuit wiring board having plated through holes including a plurality of package pins secured therein and extending from a first face to form a pin grid array; said printed wiring board having a second face which carries a printed wiring pattern and a centrally mounted semiconductor die, said printed wiring including an array of traces having tips that form a pattern that surrounds the periphery of said die; means electrically connecting said pattern that surrounds said die to the bonding pads on said die; and a molded plastic encapsulant surrounding said second face of said printed wiring board, said molded plastic encapsulant including a series of indentations around its peripheral edge, whereby said printed wiring board along with said semiconductor die and said electrical connecting means are encapsulated in a molded package.
Claim 2
Dependent Claim
141 words
A molded pin grid array package comprising: a printed circuit wiring board having plated through holes including a plurality of package pins secured therein and extending from a first face to form a pin grid array; said printed wiring board having a second face which carries a printed wiring pattern and a centrally mounted semiconductor die, said printed wiring including an array of traces having tips that form a pattern that surrounds the periphery of said die; means electrically connecting said pattern that surrounds said die to the bonding pads on said die; and a molded plastic encapsulant surrounding said second face of said printed wiring board, said molded plastic encapsulant including a series of indentations around its peripheral edge, whereby said printed wiring board along with said semiconductor die and said electrical connecting means are encapsulated in a molded package.
Claim 3
Dependent Claim
35 words
The molded pin grid array package of claim 1 whereby said molded encapsulant further surrounds the edge of said printed wiring board to form a skirt that terminates in the plane of said first face.
Claim 4
Dependent Claim
33 words
The molded pin grid array package of claim 2 wherein said indentations include a tapered portion extending from said first face of said printed wiring board to the outer face of said package.