US5048166A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making rigid-flexible multilayer board system
Assignee: Mitsubishi Electric Corp
•
Filing: 1990-04-06
•
Granted: 1991-09-17
•
Expires: 2010-04-06
Abstract
Abstract Mounting only electronic parts on a printed circuit board puts a limit on the mounting density. According to the invention, electronic parts are mounted on a flexible board. This flexible board is then mounted on a printed circuit board to thereby increase the mounting density.
Inventors
- 👤 Chiharu Wakamatsu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 09:25
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/02; H05K1/14; H05K1/141; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H05K1/0296; H05K1/0298; H05K1/03; H05K1/0393; H05K1/18; H05K1/189; H05K2203/00; H05K2203/15; H05K2203/1572; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/368; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
225 words
A method of making a rigid-flexible multilayer board system, which comprises the steps of: applying a first solder having a first melting point to at least two part mounting lands of a flexible multilayer printed circuit board; attaching at least two lead pins of a first electronic part to said part mounting lands; subjecting said flexible multilayer printed circuit board with said electronic part to a first temperature which is higher than said first melting point whereby said electronic part is secured to said flexible multilayer printed circuit board; applying a second solder having a second melting point to at least two part mounting lands and two board mounting lands of a rigid multilayer printed circuit board; attaching at least two lead pins of a second electronic part to said part mounting lands of said rigid printed circuit board and two board mounting lands of said flexible multilayer printed circuit board to said board mounting lands of said rigid multilayer printed circuit board; and subjecting said rigid multilayer printed circuit board with said flexible multilayer printed circuit board and said first and second electronic parts to a second temperature which is lower than said first melting point but higher than said second melting point, whereby said flexible multilayer printed circuit board and said second electronic part are secured to said rigid multilayer printed circuit board.
Claim 2
Independent Claim
225 words
A method of making a rigid-flexible multilayer board system, which comprises the steps of: applying a first solder having a first melting point to at least two part mounting lands of a flexible multilayer printed circuit board; attaching at least two lead pins of a first electronic part to said part mounting lands; subjecting said flexible multilayer printed circuit board with said electronic part to a first temperature which is higher than said first melting point whereby said electronic part is secured to said flexible multilayer printed circuit board; applying a second solder having a second melting point to at least two part mounting lands and two board mounting lands of a rigid multilayer printed circuit board; attaching at least two lead pins of a second electronic part to said part mounting lands of said rigid printed circuit board and two board mounting lands of said flexible multilayer printed circuit board to said board mounting lands of said rigid multilayer printed circuit board; and subjecting said rigid multilayer printed circuit board with said flexible multilayer printed circuit board and said first and second electronic parts to a second temperature which is lower than said first melting point but higher than said second melting point, whereby said flexible multilayer printed circuit board and said second electronic part are secured to said rigid multilayer printed circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-09-16 | 1995-03-18 | 1995-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-09-16 | 1999-03-18 | 1999-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-09-16 | 2003-03-18 | 2003-09-17 | $7700.00 | Window Closed / Lapsed |