US4761881A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Single step solder process
Assignee: International Business Machines Corp
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Filing: 1986-09-15
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Granted: 1988-08-09
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Expires: 2006-09-15
Abstract
Abstract A technique is disclosed for attaching a variety of device types to the same side of a printed circuit board including a single solder application step for both surface mountable and leaded components, placement of the devices, drying of the solder and solder reflow.
Inventors
- 👤 Muhammad-Yusuf J. Bora
- 👤 Karl G. Hoebener
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 09:12
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; B; B23; B23K; B23K1/00; B23K1/20; H05K3/341; H05K3/3415; B23K2101/00; B23K2101/36; B23K2101/40; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2203/00; H05K2203/04; H05K2203/045; H05K2203/14; H05K2203/1484; H05K2203/15; H05K2203/1572; H05K3/303; H05K3/305; H05K3/3465; H05K3/3485; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
125 words
An improved method of surface mountable components to both sides and leaded components to one side of a printed circuit board having first and second sides comprising the sequential steps of: screening solder paste on lands for surface mount components located on the first side of the board; depositing adhesive on surface mount components receiving sites located on the first side of the board; placing the surface mount components on the first side of the board; curing the deposited adhesive; inverting the board; screening solder paste on surface mount component lands and into the through hole locations on the second side of the board; placing components on the second side of the board; drying the screened solder paste; reflowing the solder; and cleaning the board.
Claim 2
Dependent Claim
125 words
An improved method of surface mountable components to both sides and leaded components to one side of a printed circuit board having first and second sides comprising the sequential steps of: screening solder paste on lands for surface mount components located on the first side of the board; depositing adhesive on surface mount components receiving sites located on the first side of the board; placing the surface mount components on the first side of the board; curing the deposited adhesive; inverting the board; screening solder paste on surface mount component lands and into the through hole locations on the second side of the board; placing components on the second side of the board; drying the screened solder paste; reflowing the solder; and cleaning the board.
Claim 3
Dependent Claim
22 words
The method of claim 1 wherein the drying step comprises using convection heat for drying solder paste associated with all component types.
References Cited (Backward Citations)
GB1199231A
Cited
US3832769A
Cited
US4051550A
Cited
US4139881A
Cited
US4215025A
Cited
US4196839A
Cited
US4373259A
Cited
US4506443A
Cited
US4515304A
Cited
FR2556550A1
Cited
US4642889A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-09 | 1992-02-08 | 1992-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-09 | 1996-02-08 | 1996-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-09 | 2000-02-08 | 2000-08-09 | $7700.00 | Window Closed / Lapsed |