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FR2556550A1 Expired / Lapsed FR ⏱️ 0.0 years remaining

Method for soldering electronic components to a printed circuit and hybrid circuit obtained by this method

Assignee: Lignes Telegraphiques et Telephoniques LTT SA
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Filing: 1983-12-09
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Granted: —
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Expires: 2003-12-09
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Abstract

Abstract The invention relates to a method for soldering various types of electronic components, with and without connection pins, to the same printed circuit. This method comprises reducing the length of the connection pins to a value equal to the thickness of the printed circuit, holding the components which have pins on a first surface of the circuit, depositing solder paste onto the second surface of the circuit in the region of the pins, and carrying out two steps of soldering the components which do not have pins and finally reflowing the solder paste. The invention applies especially to hybrid circuits obtained by this method.

Inventors

  • 👤 Gerard Blangeard

Bibliographic Details

Application Number —
Jurisdiction FR
Data Source google_patents
Last Synchronized 2026-11-02 13:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H05K3/3447; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/10886; H05K2201/10901; H05K2203/00; H05K2203/14; H05K2203/1446; H05K2203/15; H05K2203/1572; H05K3/303; H05K3/305; H05K3/3465; H05K3/3485; Y; Y02; Y02P; Y02P70/00; Y02P70/50

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

DE1122118B Cited
DE2755926A1 Cited
EP0034530A1 Cited
FR2487152A1 Cited
GB2096036A Cited
EP0104565B1 Cited

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