EP0104565B1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Mounting of electronic components on printed circuit boards
Assignee: Nortel Networks Ltd
•
Filing: 1983-09-17
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Granted: 1986-09-17
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Expires: 2003-09-17
Abstract
No abstract record available.
Inventors
- 👤 Jean Phillip Berger
- 👤 Carlyle Wellesley Crothers
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 18:51
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3415; H05K3/3447; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0126; H05K2203/14; H05K2203/1446; H05K2203/1476; H05K2203/15; H05K2203/1572; H05K3/3465; H05K3/3485; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
139 words
A method of mounting electronic components on printed circuit boards, comprising inserting leaded components (20) on a first side of a circuit board (10), the leads (21) passing through holes (22) in the circuit board (10), the first side being uppermost; cutting and clinching the leads (21) on the second side of the circuit board (10); turning the circuit board (10) over; applying solder paste (24), (25) at the ends of the leads (21) and on solder pads at predetermined positions on a circuit pattern (11) on the second side of the circuit board (10) through individual applicator nozzles; positioning surface mounting components (26) on the second side, contact positions on the components (26) aligned with the solder pads; and reflow soldering to solder both the leads (21) and the surface mounting components (26) to the circuit pattern (11).
Claim 2
Independent Claim
139 words
A method of mounting electronic components on printed circuit boards, comprising inserting leaded components (20) on a first side of a circuit board (10), the leads (21) passing through holes (22) in the circuit board (10), the first side being uppermost; cutting and clinching the leads (21) on the second side of the circuit board (10); turning the circuit board (10) over; applying solder paste (24), (25) at the ends of the leads (21) and on solder pads at predetermined positions on a circuit pattern (11) on the second side of the circuit board (10) through individual applicator nozzles; positioning surface mounting components (26) on the second side, contact positions on the components (26) aligned with the solder pads; and reflow soldering to solder both the leads (21) and the surface mounting components (26) to the circuit pattern (11).
Claim 3
Dependent Claim
131 words
A method as claimed in claim 1, further comprising; inserting further leaded components (31) in the circuit board (10), on the second side of the circuit board (10), the leads (33) passing through holes (32) in the circuit board (10), the second side being uppermost; cutting and clinching the leads (33) of the further leaded components (31) on the first side of the circuit board (10); turning the circuit board (10) over; applying solder paste (35) to the ends of the leads (33) of the further leaded components (31) through individual applicator nozzles; reflow soldering to solder the leads (33) of the further leaded components (31) to a circuit pattern (30) on said first side, the second reflow soldering being carried out at a lower temperature than the first reflow soldering.
Claim 4
Dependent Claim
108 words
A method as claimed in claim 2, characterised by applying the solder paste (35), (36) to the ends of the leads (33) of the further leaded components (31) and on solder pads at predetermined positions on the circuit pattern (30) on the first side of the circuit board (10); positioning further surface mounting components (37) on the first side, with contact positions on the surface mounting components aligned with the solder pads; and reflow soldering to solder both the leads (33) of the further leaded components (31) and the further surface mounting components (37) to the circuit pattern (30) on the first side of the circuit board (10).
Claim 5
Dependent Claim
109 words
A method as claimed in claim 1, further characterised by; applying solder paste (36) on solder pads at predetermined positions on a circuit pattern (30) on the first side of the circuit board (10) through individual applicator nozzles; positioning further surface mounting components (37) on the first side, with contact positions on the further surface mounting components (37) being aligned with the solder pads on the circuit pattern (30) on the first side; and reflow soldering to solder the further surface mounting components (37) to the circuit pattern (30) on the first side, the second reflow soldering being carried out at a lower temperature than the first reflow soldering.
Claim 6
Independent Claim
28 words
A method as claimed in any one of claims 1 to 4, characterised by the reflow soldering being carried out by vapour phase resoldering or by infra-red heating.
References Cited (Backward Citations)
No citation records indexed.
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