Method of mounting electronic components on a printed-circuit board, and product obtained by this method

Abstract

Abstract The invention concerns mounting electronic components, especially those without connecting pads, on a double-sided or multilayer printed-circuit board. This method principally comprises the following steps: - preparation (1) of the components, comprising especially a step (11) for protecting the components in areas outside their connection points; - assembly (2) of the components on the printed-circuit board and their immobilisation by means of a bonding (22) and by one or more solder points (23); - soldering (3) collectively all the components by immersion of the components without connecting pads in a solder bath; - cleaning (4) of the printed-circuit board and its components, especially by removal (42) of the protecting material of the first step. <IMAGE>

Inventors

• 👤 Alain Sevestre

Bibliographic Details