Circuitry and method

Claim 1

A method for mounting a semiconductor chip to a printed circuit, the method comprising the steps of: a. providing a thin dielectric substrate having a thin conductive layer bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of said conductive layer, said apertures defining a predetermined pattern, c. forming, in said apertures, conductive columns which electrically communicate with the underside of said conductive layer and which have a portion thereof exposed to the opposite surface Of the substrate for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, d. converting said conductive layer to a predetermined pattern of conductive land areas, wherein a portion of the underside of each said conductive land area forming said predetermined pattern electrically communicates with a separate conductive column, and e. electrically bonding the contact pads of a semiconductor chip to said exposed portions of said conductive columns.

Claim 2

A method for mounting a semiconductor chip to a printed circuit, the method comprising the steps of: a. providing a thin dielectric substrate having a thin conductive layer bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of said conductive layer, said apertures defining a predetermined pattern, c. forming, in said apertures, conductive columns which electrically communicate with the underside of said conductive layer and which have a portion thereof exposed to the opposite surface Of the substrate for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, d. converting said conductive layer to a predetermined pattern of conductive land areas, wherein a portion of the underside of each said conductive land area forming said predetermined pattern electrically communicates with a separate conductive column, and e. electrically bonding the contact pads of a semiconductor chip to said exposed portions of said conductive columns.

Claim 3

A method for mounting a semiconductor chip to a printed circuit, the method comprising the steps of: a. providing a thin dielectric substrate having a thin conductive layer bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of said conductive layer, said apertures defining a predetermined pattern, c. converting said conductive layer to a predetermined pattern of conductive land areas, said predetermined pattern of conductive land areas being disposed so as to overlie said predetermined pattern of apertures, d. forming, in said apertures, conductive columns which electrically communicate with the underside of said conductive land areas and which have a portion thereof exposed for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, and e. electrically bonding the contact pads of a semiconductor device to said exposed portions of said conductive columns.

Claim 4

A method for mounting a semiconductor chip to a printed circuit, the method comprising the steps of: a. providing a thin dielectric substrate having a thin conductive layer bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of said conductive layer, said apertures defining a predetermined pattern, c. converting said conductive layer to a predetermined pattern of conductive land areas, said predetermined pattern of conductive land areas being disposed so as to overlie said predetermined pattern of apertures, d. forming, in said apertures, conductive columns which electrically communicate with the underside of said conductive land areas and which have a portion thereof exposed for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, and e. electrically bonding the contact pads of a semiconductor device to said exposed portions of said conductive columns.

Claim 5

A method for mounting a semiconductor chip to a printed circuit, the method comprising the steps of: a. providing a printed circuit comprising a thin dielectric substrate having a predetermined pattern of conductive land areas bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of at least a portion of said conductive land areas, said apertures defining a predetermined pattern, c. forming in said apertures conductive columns which electrically communicate with the underside of said conductive land areas and which have a portion thereof exposed for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, and d. electrically bonding the contact pads of a semiconductor chip to said exposed portions of said conductive columns.

Claim 6

A method for mounting a semiconductor chip to a printed circuit, the method comprising the steps of: a. providing a printed circuit comprising a thin dielectric substrate having a predetermined pattern of conductive land areas bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of at least a portion of said conductive land areas, said apertures defining a predetermined pattern, c. forming in said apertures conductive columns which electrically communicate with the underside of said conductive land areas and which have a portion thereof exposed for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, and d. electrically bonding the contact pads of a semiconductor chip to said exposed portions of said conductive columns.

Claim 7

A method for interconnecting a plurality of printed circuits comprising the steps of: a. providing a thin dielectric substrate having a thin conductive layer bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of said conductive layer, said apertures defining a predetermined pattern, c. forming, in said apertures, conductive columns which electrically communicate with the underside of said conductive layer and which have a portion thereof exposed for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, d. forming a first printed circuit by converting said conductive layer to a predetermined pattern of conductive land areas, wherein a portion of the underside of each said conductive land areas forming said predetermined pattern electrically communicates with a separate conductive column, e. electrically bonding the exposed portions of said conductive columns of said first printed circuit to a predetermined pattern of conductive land areas of a second printed circuit; said second printed circuit having a plurality of conductive columns extending through a dielectric substrate, one end of each of said columns resting against and electrically communicating with the underside of a single conductive land area of the predetermined pattern of land areAs, the other end of said conductive columns extending beyond the opposite surface of the dielectric substrate and being adapted to electrically receive further electrical circuitry.

Claim 8

A method for interconnecting a plurality of printed circuits comprising the steps of: a. providing a thin dielectric substrate having a thin conductive layer bonded to one surface thereof, b. providing a plurality of apertures in said dielectric substrate, said apertures extending through said dielectric substrate and communicating with the underside of said conductive layer, said apertures defining a predetermined pattern, c. forming, in said apertures, conductive columns which electrically communicate with the underside of said conductive layer and which have a portion thereof exposed for connection to further electrical circuitry, said columns extending beyond the surface of said substrate, d. forming a first printed circuit by converting said conductive layer to a predetermined pattern of conductive land areas, wherein a portion of the underside of each said conductive land areas forming said predetermined pattern electrically communicates with a separate conductive column, e. electrically bonding the exposed portions of said conductive columns of said first printed circuit to a predetermined pattern of conductive land areas of a second printed circuit; said second printed circuit having a plurality of conductive columns extending through a dielectric substrate, one end of each of said columns resting against and electrically communicating with the underside of a single conductive land area of the predetermined pattern of land areAs, the other end of said conductive columns extending beyond the opposite surface of the dielectric substrate and being adapted to electrically receive further electrical circuitry.