US5006673A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fabrication of pad array carriers from a universal interconnect structure
Assignee: NXP USA Inc
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Filing: 1989-12-07
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Granted: 1991-04-09
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Expires: 2009-12-07
Abstract
Abstract A method of manufacturing a chip carrier from a universal ceramic substrate provides for a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes. On the first side, wire bond pads and conductors connected to the conductively filled through-holes are provided as required. Similarly, on the second side, solder pads on the conductively filled through-holes are provided as required. Finally, at least one insulating layer is provided over part of the first side for die attachment.
Inventors
- 👤 Bruce J. Freyman
- 👤 Barry M. Miles
- 👤 Jill L. Flaugher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 20:30
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H05; H05K; H05K1/00; H05K1/02; H05K1/0286; H05K1/0287; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09818; H05K2201/09945; H05K3/00; H05K3/0097; H05K3/40; H05K3/4038; H05K3/4053; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
92 words
A method of manufacturing a chip carrier from a universal ceramic substrate, comprising the steps of: providing a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate; providing wire bond pads and conductors connected to said conductively filled through-holes as required on said first side; providing solder pads on said conductively filled through-holes as required on said second side; and providing at least one insulating layer over part of said first side for die attachment.
Claim 2
Independent Claim
92 words
A method of manufacturing a chip carrier from a universal ceramic substrate, comprising the steps of: providing a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate; providing wire bond pads and conductors connected to said conductively filled through-holes as required on said first side; providing solder pads on said conductively filled through-holes as required on said second side; and providing at least one insulating layer over part of said first side for die attachment.
Claim 3
Dependent Claim
34 words
The method according to claim 1, wherein said step of providing solder pads on said conductively filled through-holes on said second side comprises the step of applying conductive material to form said solder pads.
Claim 4
Dependent Claim
41 words
The method according to claim 1, wherein said step of providing wire bond pads and conductors connected to said conductively filled through-holes on said first side comprises the step of applying at least two metallized dielectric layers on said first side.
Claim 5
Dependent Claim
54 words
The method according to claim 1, wherein said step of providing at least one insulating layer over part of said first side for die attachment comprises the steps of applying and delineating at least one dielectric layer into the size of the intended semiconductor die mount pad and to cover any other desired area.
Claim 6
Dependent Claim
31 words
The method according to claim 4, wherein said step of providing at least one insulating layer further comprising the step of metallizing one surface of said at least one dielectic layer.
Claim 7
Dependent Claim
31 words
The method according to claim 4, wherein said step of providing at least one insulating layer comprises the step of applying polyimide to said first side of said universal ceramic substrate.
Claim 8
Dependent Claim
39 words
The method according to claim 1, wherein said step of providing a universal ceramic substrate comprises masking off the area around a desired section of said universal ceramic substrate to accommodate one of a wide variety of semiconductor chips.
Claim 9
Dependent Claim
31 words
The method according to claim 1 further comprising the step of severing off said desired section from said universal ceramic substrate to accommodate one of a wide variety of semiconductor chips.
Claim 10
Dependent Claim
20 words
The method according to claim 1 further comprising providing at least one insulating layer under part of said second side.
Claim 11
Independent Claim
156 words
A method of manufacturing a plurality of chip carriers from a universal ceramic substrate, comprising the steps of: providing a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate which is able to accommodate an arbitrary design of said plurality of chip carriers depending on connections of said through-holes; partitioning said universal ceramic substrate into an arbitrary quantity of sections depending on an arbitrary quantity of ports desired; metallizing and delineating wire bond pads and conductors connected to said conductively filled throug-holes as required on said first side; metallizing and delineating solder pads on said conductively filled through-holes as required on said second side; applying dielectric material and delineating at least one insulating layer over part of said first side for die attachment; and severing said universal ceramic substrate into said sections for forming said plurality of chip carriers.
Claim 12
Independent Claim
156 words
A method of manufacturing a plurality of chip carriers from a universal ceramic substrate, comprising the steps of: providing a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate which is able to accommodate an arbitrary design of said plurality of chip carriers depending on connections of said through-holes; partitioning said universal ceramic substrate into an arbitrary quantity of sections depending on an arbitrary quantity of ports desired; metallizing and delineating wire bond pads and conductors connected to said conductively filled throug-holes as required on said first side; metallizing and delineating solder pads on said conductively filled through-holes as required on said second side; applying dielectric material and delineating at least one insulating layer over part of said first side for die attachment; and severing said universal ceramic substrate into said sections for forming said plurality of chip carriers.
Claim 13
Dependent Claim
38 words
The method according to claim 10, wherein said step of applying dielectric material and delineating at least one insulating layer further comprising the step of metallizing and forming a metallized via through one surface of said insulating layer.
Claim 14
Dependent Claim
13 words
The method according to claim 10 wherein said step of severing comprises sawing.
Claim 15
Dependent Claim
44 words
The method according to claim 10, wherein said step of partitioning comprises the step of masking-off an area around said plurality of sections on said universal ceramic substrate having said array of conductively filled through-holes, formed by punching and applying a tungsten/glass paste thereto.
Claim 16
Dependent Claim
29 words
The method of claim 10 wherein said step of providing a universal ceramic substrate comprises providing said universal ceramic substrate having an array of uniformly spaced conductively filled through-holes.
Claim 17
Dependent Claim
76 words
A chip carrier, comprising: a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate; wire bond pads and conductors connected to said conductively filled through-holes as required on said; solder pads connected to said conductively filled through-holes as required on said second side; and at least one insulating layer applied over part of said first side for die attachment.
Claim 18
Dependent Claim
76 words
A chip carrier, comprising: a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes pre-formed prior to a firing of said universal ceramic substrate; wire bond pads and conductors connected to said conductively filled through-holes as required on said; solder pads connected to said conductively filled through-holes as required on said second side; and at least one insulating layer applied over part of said first side for die attachment.
Claim 19
Dependent Claim
19 words
The chip carrier of claim 15 wherein said conductively filled through-holes are uniformly spaced in said universal ceramic substrate.
Claim 20
Dependent Claim
26 words
The chip carrier of claim 15 further comprising at least one insulating layer applied under part of said second side for customizing a desired solder-pad spacing.
Claim 21
Dependent Claim
25 words
The chip carrier of claim 15 wherein said at least one insulating layer comprises at least one metallized dielectric layer for forming any desired pattern.
Claim 22
Dependent Claim
31 words
The chip carrier of claim 15 wherein said chip carrier further comprising at least one metallized insulating layer applied under part of said second side for customizing a desired solder-pad spacing.
Claim 23
Dependent Claim
42 words
The chip carrier of claim 18 wherein said at least one insulating layer comprises a top metallized dielectric layer including a via formed over said at least one metallized dielectric layer for routing conductive runners to at least one of said through-holes.
References Cited (Backward Citations)
US4710592A
Cited
US4700473A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-04-08 | 1994-10-08 | 1995-04-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-04-08 | 1998-10-08 | 1999-04-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-04-08 | 2002-10-08 | 2003-04-09 | $7700.00 | Window Closed / Lapsed |