Patent US422906A successfully refreshed from Google Patents.
US5077633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Grounding an ultra high density pad array chip carrier
Assignee: NXP USA Inc
•
Filing: 1989-05-01
•
Granted: 1991-12-31
•
Expires: 2009-05-01
Abstract
Abstract A die pad (108) with a punched hole providing a throughway (110) is affixed upon the chip carrier base 100. Such throughway permits the electronic interconnection of the die backside (112) to a conductive runner (104) by electrically conductive material (110) set between the die backside (112) and the conductive runner (104).
Inventors
- 👤 Bruce J. Freyman
- 👤 Barry M. Miles
- 👤 Frank J. Juskey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 07:01
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/381; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
88 words
A chip carrier assembly comprising: a semiconductor chip, having a bottom surface; a substrate including at least one conductive area; a nonconductive die pad intimately bonded to at least one of the conductive areas of the substrate having at least one passage therethrough, and being positioned between the semiconductor chip and the substrate; and an electrically conductive material, located in said passage and between the substrate and the semiconductor chip, for providing electrical interconnection between the semiconductor chip bottom surface and said one conductive area of the substrate.
Claim 2
Dependent Claim
88 words
A chip carrier assembly comprising: a semiconductor chip, having a bottom surface; a substrate including at least one conductive area; a nonconductive die pad intimately bonded to at least one of the conductive areas of the substrate having at least one passage therethrough, and being positioned between the semiconductor chip and the substrate; and an electrically conductive material, located in said passage and between the substrate and the semiconductor chip, for providing electrical interconnection between the semiconductor chip bottom surface and said one conductive area of the substrate.
Claim 3
Dependent Claim
18 words
A chip carrier assembly as defined in claim 1, wherein said substrate comprises an ceramic chip carrier base.
Claim 4
Dependent Claim
19 words
The chip carrier assembly as defined in claim 1, wherein said electrically conductive material comprises conductive metal filled epoxy.
Claim 5
Dependent Claim
15 words
The chip carrier assembly of claim 3, wherein said conductive metal filled epoxy comprises silver.
Claim 6
Dependent Claim
89 words
A chip carrier assembly comprises: a semiconductor chip, having a bottom surface; a substrate including at least one conductive area; a polyimide film die pad intimately bonded to at least one of the conductive areas of the substrate having at least one passage therethrough, and being positioned between the semiconductor chip and the substrate; and an electrically conductive material, located in said passage and between the substrate and the semiconductor chip, for providing electrical interconnection between the semiconductor chip bottom surface and said one conductive area of the substrate.
Claim 7
Dependent Claim
89 words
A chip carrier assembly comprises: a semiconductor chip, having a bottom surface; a substrate including at least one conductive area; a polyimide film die pad intimately bonded to at least one of the conductive areas of the substrate having at least one passage therethrough, and being positioned between the semiconductor chip and the substrate; and an electrically conductive material, located in said passage and between the substrate and the semiconductor chip, for providing electrical interconnection between the semiconductor chip bottom surface and said one conductive area of the substrate.
Claim 8
Dependent Claim
74 words
A chip carrier assembly comprising: a semiconductor chip; an alumina ceramic substrate including conductive areas; a polyimide film die pad carried by the substrate having at least one passage therethrough, and being positioned between the semiconductor and the substrate, and an electrically conductive silver filled epoxy, located in said passage and between the substrate and the semiconductor chip, for providing electrical inerconnection between the semiconductor chip and said one conductive area of the substrate.
Claim 9
Dependent Claim
74 words
A chip carrier assembly comprising: a semiconductor chip; an alumina ceramic substrate including conductive areas; a polyimide film die pad carried by the substrate having at least one passage therethrough, and being positioned between the semiconductor and the substrate, and an electrically conductive silver filled epoxy, located in said passage and between the substrate and the semiconductor chip, for providing electrical inerconnection between the semiconductor chip and said one conductive area of the substrate.
Claim 10
Dependent Claim
79 words
A chip carrier assembly for mounting a semiconductor chip comprising: a semiconductor die, having a bottom surface; a chip carrier base including metallic runners; a nonconductive die pad with at least one pathway intimately bonded to at least one of the metallic runners on the chip carrier base and positioned between the semiconductor die and said carrier base; electrically conductive material interconnecting said semiconductor die bottom surface and said said metallic runner through said pathway in said die pad.
Claim 11
Dependent Claim
79 words
A chip carrier assembly for mounting a semiconductor chip comprising: a semiconductor die, having a bottom surface; a chip carrier base including metallic runners; a nonconductive die pad with at least one pathway intimately bonded to at least one of the metallic runners on the chip carrier base and positioned between the semiconductor die and said carrier base; electrically conductive material interconnecting said semiconductor die bottom surface and said said metallic runner through said pathway in said die pad.
Claim 12
Dependent Claim
15 words
The chip carrier assembly of claim 7, wherein said chip carrier base comprises ceramic alumina.
Claim 13
Dependent Claim
16 words
The chip carrier assembly of claim 7, wherein said electrically conductive material comprises silver filled epoxy.
Claim 14
Dependent Claim
25 words
The chip carrier assembly of claim 7, wherein said pathway comprises a punched hole therethrough said die pad positioned directly above said one metallic runner.
Claim 15
Dependent Claim
83 words
A chip carrier assembly for mounting a semiconductor chip comprising: a semiconductor die, having a bottom surface; a chip carrier base including metallic runners; a polyimide film die pad with at least one pathway intimately bonded to at least one of the metallic runners on the chip carrier base and positioned between the semiconductor die and said carrier base; electrically conductive material interconnecting said semiconductor die bottom surface and said at least one said metallic runner through said pathway in said die pad.
Claim 16
Dependent Claim
83 words
A chip carrier assembly for mounting a semiconductor chip comprising: a semiconductor die, having a bottom surface; a chip carrier base including metallic runners; a polyimide film die pad with at least one pathway intimately bonded to at least one of the metallic runners on the chip carrier base and positioned between the semiconductor die and said carrier base; electrically conductive material interconnecting said semiconductor die bottom surface and said at least one said metallic runner through said pathway in said die pad.
References Cited (Backward Citations)
US4631639A
Cited
US4574879A
Cited
US4626309A
Cited
US4700276A
Cited
US4700473A
Cited
US4787853A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-12-30 | 1995-07-01 | 1995-12-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-12-30 | 1999-07-01 | 1999-12-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-12-30 | 2003-07-01 | 2003-12-31 | $7700.00 | Window Closed / Lapsed |