US4800419A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Support assembly for integrated circuits
Assignee: LSI Corp
•
Filing: 1987-01-28
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Granted: 1989-01-24
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Expires: 2007-01-28
Abstract
Abstract A composite support assembly for an integrated circuit chip includes a rigid lead frame that is attached to a relatively thin flexible tape-like structure. The tape-like structure is etched with inner lead fingers and outer lead fingers to allow a short pitch, high density arrangement of the lead fingers, thereby enabling bond wires that connect an IC chip to the support assembly to be shortened. As a result, a significant increase in the number of leads is realized, using a standard size IC package.
Inventors
- 👤 Jon Long
- 👤 V. K. Sahakian
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 13:46
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/50; H10W70/00; H10W70/40; H10W70/464; H10W70/466; H10W70/01; H10W70/04; H10W70/411; H10W90/00; H10W90/811; H10W72/551; H10W72/552; H10W74/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
106 words
A composite package assembly for supporting an integrated circuit chip comprising; a relatively thin flexible tape-like structure having inner lead fingers, and having outer lead fingers electrically connected to said inner lead fingers; a die attach pad having one surface attached to said structure; an integrated circuit chip attached to the other exposed surface of said die attach pad; a rigid lead frame joined to said structure and having internal leads aligned to and connected to said outer lead fingers; package leads electrically connected to said internal leads for connection to external circuitry; and metallic wires connecting said integrated circuit chip to said inner lead fingers.
Claim 2
Dependent Claim
106 words
A composite package assembly for supporting an integrated circuit chip comprising; a relatively thin flexible tape-like structure having inner lead fingers, and having outer lead fingers electrically connected to said inner lead fingers; a die attach pad having one surface attached to said structure; an integrated circuit chip attached to the other exposed surface of said die attach pad; a rigid lead frame joined to said structure and having internal leads aligned to and connected to said outer lead fingers; package leads electrically connected to said internal leads for connection to external circuitry; and metallic wires connecting said integrated circuit chip to said inner lead fingers.
Claim 3
Dependent Claim
13 words
A composite assembly as in claim 1, including a package encompassing said assembly.
Claim 4
Dependent Claim
42 words
A composite assembly as in claim 1, wherein said tape-like structure has a metal portion of thickness of about 0.001 inch and a dielectric film portion of thickness of about 0.003 inch and said frame has a thickness of about 0.008 inch.
Claim 5
Dependent Claim
22 words
A composite assembly as in claim 1 wherein said tape-like structure comprises an etched configuration and said frame comprises a stamped configuration.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-01-24 | 1992-07-25 | 1993-01-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-01-24 | 1996-07-25 | 1997-01-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-01-24 | 2000-07-25 | 2001-01-24 | $7700.00 | Window Closed / Lapsed |