US4705205A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip carrier mounting device
Assignee: Tyco International Ltd Bermuda
•
Filing: 1984-05-14
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Granted: 1987-11-10
•
Expires: 2004-05-14
Abstract
Abstract A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.
Inventors
- 👤 Leslie J. Allen
- 👤 Gabe Cherian
- 👤 Stephen H. Diaz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 18:17
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K3/00; B23K3/06; H; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K13/0465; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0215; H05K2201/03; H05K2201/0302; H05K2201/0314; H05K2201/0332; H05K2201/0364; H05K2201/0373; H05K2201/10; H05K2201/10227; H05K2201/1028; H05K2201/10378; H05K2201/10424; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10742; H05K2201/10886; H05K2201/10946; H05K2203/00; H05K2203/04; H05K2203/0415; H05K2203/07; H05K2203/0756; H05K2203/0769; H05K3/3421; H05K3/3442; H05K3/40; H05K3/4007; H05K3/4015; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
145 words
A device for providing a plurality of discrete quantities of preformed solder material for forming connections between electrically conductive elements comprising: a retaining member having a plurality of apertures therein spaced to correspond to preselected points on the electrically conductive elements; and preforms of solder material disposed in or supported by the apertures whereby the ends of the preforms are adapted to contact preselected points on the electrically conductive elements and wherein the solder material comprises filled solder which contains from about 20% to about 80% by weight based on the total weight of the solder-filler mixture of a filler which is solid at a temperature at which the solder is molten or supported solder and wherein the filled solder or supported solder, separate from the retaining member and apertures thereof, substantially retains its preform physical shape while the solder is in a molten state.
Claim 2
Independent Claim
145 words
A device for providing a plurality of discrete quantities of preformed solder material for forming connections between electrically conductive elements comprising: a retaining member having a plurality of apertures therein spaced to correspond to preselected points on the electrically conductive elements; and preforms of solder material disposed in or supported by the apertures whereby the ends of the preforms are adapted to contact preselected points on the electrically conductive elements and wherein the solder material comprises filled solder which contains from about 20% to about 80% by weight based on the total weight of the solder-filler mixture of a filler which is solid at a temperature at which the solder is molten or supported solder and wherein the filled solder or supported solder, separate from the retaining member and apertures thereof, substantially retains its preform physical shape while the solder is in a molten state.
Claim 3
Dependent Claim
30 words
A device according to claim 1 wherein the preform of solder material comprises filled solder which substantially retains its preform physical shape while the solder is in a molten state.
Claim 4
Dependent Claim
37 words
A device according to claim 2 wherein the filled solder comprises solder within which is disposed discrete particles or filaments which are of a material which is solid at a temperature at which the solder is molten.
Claim 5
Dependent Claim
29 words
A device according to claim 2 in combination with an electrically conductive element wherein the preforms are bonded at one end to preselected points on the electrically conductive element.
Claim 6
Dependent Claim
30 words
A device according to claim 1 wherein the preform of solder material comprises supported solder which substantially retains its preform physical shape while the solder is in a molten state.
Claim 7
Dependent Claim
19 words
A device according to claim 5 wherein the support for the solder comprises a spiral metalic wire or tape.
Claim 8
Dependent Claim
29 words
A device according to claim 5 in combination with an electrically conductive element wherein the preforms are bonded at one end to preselected points on the electrically conductive element.
Claim 9
Dependent Claim
22 words
A device according to claim 1 wherein the preform of solder material has a height dimension greater than its transverse cross-sectional dimension.
Claim 10
Dependent Claim
18 words
A device according to claim 1 wherein the retaining member comprises a combination of conductive and dielectric materials.
Claim 11
Dependent Claim
13 words
A device according to claim 1 wherein the retaining member comprises a laminate.
Claim 12
Dependent Claim
14 words
A device according to claim 1 wherein the retaining member comprises a dissolvable material.
Claim 13
Dependent Claim
16 words
A device according to claim 1 wherein the retaining member comprises a segmented or frangible material.
Claim 14
Dependent Claim
22 words
A device according to claim 1 wherein the retaining member provides overvoltage protection for at least one of the electrically conductive elements.
Claim 15
Dependent Claim
18 words
A device according to claim 1 wherein the retaining member provides a heat-sink for the electrically conductive elements.
Claim 16
Dependent Claim
14 words
A device according to claim 1 wherein the retaining member comprises a heat-recoverable material.
Claim 17
Dependent Claim
29 words
A device according to claim 1 in combination with an electrically conductive element wherein the preforms are bonded at one end to preselected points on the electrically conductive element.
Claim 18
Independent Claim
146 words
A method for forming a resilient connection for connection preselected points of first and second electrically conductive elements comprising: positioning a first electrically conductive element in alignment with one side of a retaining member having apertures spaced to correspond to the preselected points on the electrically conductive elements and having disposed in said apertures preforms of solder material; and effecting a bond between one end of the preforms and the preselected points on the first electrically conductive element; wherein the preforms of solder material are filled solder containing from about 20% to about 80% by weight based on the total weight of the solder-filler mixture of a filler which is solid at a temperature at which the solder is molten or supported solder which, separate from the retaining member and apertures thereof, substantially retains its preform physical shape while the solder is in a molten state.
Claim 19
Independent Claim
146 words
A method for forming a resilient connection for connection preselected points of first and second electrically conductive elements comprising: positioning a first electrically conductive element in alignment with one side of a retaining member having apertures spaced to correspond to the preselected points on the electrically conductive elements and having disposed in said apertures preforms of solder material; and effecting a bond between one end of the preforms and the preselected points on the first electrically conductive element; wherein the preforms of solder material are filled solder containing from about 20% to about 80% by weight based on the total weight of the solder-filler mixture of a filler which is solid at a temperature at which the solder is molten or supported solder which, separate from the retaining member and apertures thereof, substantially retains its preform physical shape while the solder is in a molten state.
Claim 20
Dependent Claim
46 words
A method according to claim 17 which further comprises: positioning a second electrically conductive element in alignment with the opposite side of the retaining member; and effecting a bond between the other end of the preforms and the preselected points on the second electrically conductive element.
Claim 21
Dependent Claim
37 words
A method according to claim 18 wherein the bonds between ends of the preforms and the preselected points on the first electrically conductive element and the preselected points on the second electrically conductive member are effected simultaneously.
Claim 22
Dependent Claim
29 words
A method according to claim 19 comprising the further step of removing the retaining member after the preforms are bonded to both the first and second electrically conductive elements.
Claim 23
Dependent Claim
29 words
A method according to claim 18 comprising the further step of removing the retaining member after the preforms are bonded to both the first and second electrically conductive elements.
Claim 24
Dependent Claim
15 words
A method according to claim 17 wherein the preforms comprise filled solder or supported solder.
Claim 25
Dependent Claim
40 words
A method according to claim 22 wherein the preforms comprise filled solder which comprises solder within which is disposed discrete particles or filaments which are of a material which is solid at a temperature at which the solder is molten.
Claim 26
Dependent Claim
25 words
A method according to claim 22 wherein the preforms comprises supported solder wherein the support for the solder is a spiral metalic wire or tape.
Claim 27
Dependent Claim
41 words
A method according to claim 22 wherein the retaining member comprises a heat-recoverable material and further comprising adhering the retaining member to the electrically conductive elements, then effecting recovery of the material to pull the electrically conductive elements toward each other.
Claim 28
Dependent Claim
16 words
A method according to claim 17 which further comprises the step of removing the retaining member.
Claim 29
Dependent Claim
59 words
A method according to claim 26 which further comprises: positioning, after the retaining member has been removed, a second electrically conductive element in alignment with the other ends of the preforms bonded to the first electrically conductive element; and effecting a bond between the other end of the preforms and the preselected points on the second electrically conductive element.
References Cited (Backward Citations)
US3148310A
Cited
GB861242A
Cited
US3070650A
Cited
GB1017650A
Cited
US3373481A
Cited
GB1113005A
Cited
US3467765A
Cited
GB1112693A
Cited
US3472365A
Cited
US3871015A
Cited
US3591839A
Cited
US3616532A
Cited
US3680037A
Cited
US3900153A
Cited
US3811186A
Cited
US3861135A
Cited
US3795884A
Cited
US3862791A
Cited
US3839727A
Cited
US3926360A
Cited
US3921285A
Cited
US4027936A
Cited
US3991463A
Cited
US4003621A
Cited
US4064623A
Cited
US4109378A
Cited
US4201435A
Cited
US4089575A
Cited
US4067104A
Cited
US4130327A
Cited
US4179802A
Cited
US4290195A
Cited
US4402562A
Cited
US4295700A
Cited
JPS5553431A
Cited
US4209893A
Cited
JPS5561032A
Cited
US4240198A
Cited
US4195193A
Cited
US4433887A
Cited
US4354629A
Cited
US4334727A
Cited
US4390220A
Cited
US4402450A
Cited
GB2113134A
Cited
EP0083436A2
Cited
US4412642A
Cited
US4458968A
Cited
US4487638A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-09 | 1991-05-11 | 1991-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-09 | 1995-05-11 | 1995-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-09 | 1999-05-11 | 1999-11-10 | $7700.00 | Window Closed / Lapsed |