US3811186A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of aligning and attaching circuit devices on a substrate
Assignee: International Business Machines Corp
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Filing: 1972-12-11
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Granted: 1974-05-21
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Expires: 1992-12-11
Abstract
Abstract Method for aligning and supporting micro-circuit devices on substrate conductors during attachment thereto in which shaped, flexible, insulative material is placed between the devices and their respective conductors to support heat fusible terminals of the devices in alignment with mating heat-fusible conductor lands during formation of the respective fused connections. The insulative material can be of selected thickness to support the non-attached terminals either in contact or out of contact with their mating lands. When the circuit devices are held out of contact with their lands, the supporting material, being of plastic character, softens during heating to allow contact during the joining of the fusible connections and, upon cooling, returns to a thicker state to elongate the fused connections.
Inventors
- 👤 J Larnerd
- 👤 Garigle D Mc
- 👤 C Samuelson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:18
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09818; H05K2201/09909; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10727; H05K2201/10734; H05K2201/20; H05K2201/2036; H05K2203/00; H05K2203/16; H05K2203/167; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07202; H10W72/07204; H10W72/07221; H10W72/07227; H10W72/07231; H10W72/07236; H10W72/20; H10W72/241; H10W72/281; H10W72/285; H10W72/287; H10W72/30; H10W72/331; H10W72/332; H10W72/337; H10W72/341; H10W72/344; H10W72/347; H10W72/348; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
92 words
A method for joining a circuit device having heat-fusible terminals projecting from a common surface thereon with mating heat-fusible lands on a substrate comprising the steps of: forming insulative material in relief on said substrate so that its edges engage a plurality of said terminals of a said circuit device positioned thereon to maintain lateral alignment between said terminals and their said mating lands; placing said device over said material with each of said terminals aligned with its said mating land; and heating said aligned terminals and lands to produce fusing therebetween.
Claim 2
Independent Claim
92 words
A method for joining a circuit device having heat-fusible terminals projecting from a common surface thereon with mating heat-fusible lands on a substrate comprising the steps of: forming insulative material in relief on said substrate so that its edges engage a plurality of said terminals of a said circuit device positioned thereon to maintain lateral alignment between said terminals and their said mating lands; placing said device over said material with each of said terminals aligned with its said mating land; and heating said aligned terminals and lands to produce fusing therebetween.
Claim 3
Dependent Claim
32 words
The method as described in claim 1, further including the step of removing said material from between said device and said substrate subsequent to the fusing of said aligned terminals and lands.
Claim 4
Dependent Claim
33 words
The method as described in claim 1, wherein the material shaped by said forming step is of a height sufficient to support said terminals in spaced, non-contacting alignment with their respective mating lands.
Claim 5
Dependent Claim
21 words
The method according to claim 1 wherein said material is a resilient polymer material which becomes more easily compressible upon heating.
Claim 6
Dependent Claim
37 words
The method as described in claim 4 wherein said heating is accompanied by the application of a pressure on said device sufficient to compress said material and allow contact between mating ones of said terminals and lands.
Claim 7
Dependent Claim
51 words
The method as described in claim 4 wherein said heating is accomplished by directing a stream of pressurized heated gas against said device to heat and soften said material and said fusible terminals and lands, while forcing said device toward said substrate to bring said terminals and lands into abutting relationship.
Claim 8
Dependent Claim
30 words
The method as described in claim 1 wherein said material is formed in relief on said substrate to occupy the included area defined by three or more of said terminals.
Claim 9
Dependent Claim
41 words
The method as described in claim 5 wherein said heating is accomplished by the application of an electrical resistance element to said device opposite said material to thereby compress said material and heat said terminals and lands to a fusible condition.
Claim 10
Dependent Claim
15 words
The method as described in claim 1 wherein said material is an electrically insulative material.
Claim 11
Dependent Claim
14 words
The method as described in claim 9 wherein said insulative material is a photoresist.
Claim 12
Dependent Claim
19 words
The method as described in claim 10 wherein said insulative material is formed by the utilization of photographic procedures.
Claim 13
Dependent Claim
40 words
The method as described in claim 1 wherein said material is formed to extend between and engage at least two of said terminals so as to prevent relative movement of said device longitudinally along a line between said two terminals.
Claim 14
Dependent Claim
23 words
The method as described in claim 1 wherein said material formed in relief is located so as to surround said terminals and lands.
Claim 15
Independent Claim
99 words
A method for joining a circuit device having heat-fusible terminals projecting from a common surface thereon with mating heat-fusible lands on a substrate comprising the steps of: securing insuLative material to the surface of said substrate; forming said material in relief on said substrate so that its edges engage a plurality of said terminals of a said circuit device positioned thereon to maintain lateral alignment between said terminals and mating lands; placing said device over said material with each of said terminals aligned with its said mating land; and heating said aligned terminals and lands to produce fusing therebetween.
Claim 16
Independent Claim
99 words
A method for joining a circuit device having heat-fusible terminals projecting from a common surface thereon with mating heat-fusible lands on a substrate comprising the steps of: securing insuLative material to the surface of said substrate; forming said material in relief on said substrate so that its edges engage a plurality of said terminals of a said circuit device positioned thereon to maintain lateral alignment between said terminals and mating lands; placing said device over said material with each of said terminals aligned with its said mating land; and heating said aligned terminals and lands to produce fusing therebetween.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-05-20 | 1977-11-19 | 1978-05-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-05-20 | 1981-11-19 | 1982-05-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-05-20 | 1985-11-19 | 1986-05-21 | $7700.00 | Window Closed / Lapsed |