US3900153A
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Formation of solder layers
Assignee: Licentia Patent Verwaltungs GmbH
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Filing: 1973-06-13
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Granted: 1975-08-19
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Expires: 1993-06-13
Abstract
Abstract In the formation of a solder connection between two parallel surfaces, particularly in the fabrication of semiconductor devices, the resulting solder connection is caused to have a desired thickness by combining solder material, prior to its introduction between the surfaces to be connected, with additives which are given dimensions equal to the desired solder layer thickness, the additives being of a material having a melting temperature higher than that employed to form the solder connection.
Inventors
- 👤 Wolfgang Beerwerth
- 👤 Albrecht Geppert
- 👤 Rigobert Schimmer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 18:43
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; B; B23; B23K; B23K35/00; B23K35/02; B23K35/0222; B23K35/0244; H10; H10W; H10W72/00; H10W72/30; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0215; H05K2201/10; H05K2201/10613; H05K2201/10954; H05K2201/10969; H05K2201/20; H05K2201/2036; H10W72/01; H10W72/013; H10W72/01361; H10W72/071; H10W72/072; H10W72/07221; H10W72/07227; H10W72/073; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07334; H10W72/321; H10W72/325; H10W72/351; H10W72/352; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
118 words
A METHOD FOR PROCURING A SLDER LAYER OF A SELECTED THICKNESS BETWEEN TWO PARALLEL SURFACES DURING THE PRODUCTION OF SEMICONDUCTOR DEVICES, COMPRISING: INCORPORATING ADDITIVES INTO SOLER WHICH IS TO FORM THE LAYER, INTRODUCING SUCH SOLDER WITH THE INCORPORTED ADDITIVES BETWEEN THE SURFACE SO THAT THE ADDITIVES EXTENDED BETWEEN, AND CONTACT THE SURFACES SUBJECTING THE SOLDER TO TIME AND TEMPERATURE CONDITIONS WHICH CAUSE IT TO FORM THE DESIRED LAYER, AND GIVING THE ADDITIVES DIMENSIONS SUCH THAT DURING THE FORMATION OF THE LAYER THE DISTANCE BETWEEN THE TWO PARALLEL SURFACES CONTRACTING THE ADDITIVES CORRESPONDS TO THE DESIRED SOLDER LAYER THICKNESS, THE ADDITIVES BEING SO SELECTED THAT THEIR DIMENSIONS CAN CHANGE ONLY WITHIN PREDETERMINED LIMITS UNDER SAID TIME AND TEMPERATURE CONDITIONS.
Claim 2
Independent Claim
118 words
A METHOD FOR PROCURING A SLDER LAYER OF A SELECTED THICKNESS BETWEEN TWO PARALLEL SURFACES DURING THE PRODUCTION OF SEMICONDUCTOR DEVICES, COMPRISING: INCORPORATING ADDITIVES INTO SOLER WHICH IS TO FORM THE LAYER, INTRODUCING SUCH SOLDER WITH THE INCORPORTED ADDITIVES BETWEEN THE SURFACE SO THAT THE ADDITIVES EXTENDED BETWEEN, AND CONTACT THE SURFACES SUBJECTING THE SOLDER TO TIME AND TEMPERATURE CONDITIONS WHICH CAUSE IT TO FORM THE DESIRED LAYER, AND GIVING THE ADDITIVES DIMENSIONS SUCH THAT DURING THE FORMATION OF THE LAYER THE DISTANCE BETWEEN THE TWO PARALLEL SURFACES CONTRACTING THE ADDITIVES CORRESPONDS TO THE DESIRED SOLDER LAYER THICKNESS, THE ADDITIVES BEING SO SELECTED THAT THEIR DIMENSIONS CAN CHANGE ONLY WITHIN PREDETERMINED LIMITS UNDER SAID TIME AND TEMPERATURE CONDITIONS.
Claim 3
Dependent Claim
19 words
Method as defined in claim 1 wherein the solder is in a liquid state during said step of incorporating.
Claim 4
Dependent Claim
19 words
Method as defined in claim 1 wherein the solder is in a solid state during said step of incorporating.
Claim 5
Dependent Claim
36 words
Method as defined in claim 3 wherein said step of incorporating is carried out by mixing the additives with pulverized solder or pulverized solder components and subsequently sintering or melting the additives and pulverized material together.
Claim 6
Dependent Claim
38 words
Method as defined in claim 1, wherein said step of giving is carried out by forming the additives, before said step of incorporation, to have the same dimensions, with the same tolerances, as the desired soldeR layer thickness.
Claim 7
Dependent Claim
65 words
Method as defined in claim 1 wherein said step of incorporating is carried out with additives which have dimensions at least equal to the desired solder layer thickness and said step of giving is carried out by shaping the solder and additives subsequent to said step of incorporating and prior to said step of subjecting for bringing such additives to the desired solder layer thickness.
Claim 8
Dependent Claim
26 words
Method as defined in claim 6 wherein said step of shaping is carried out by rolling to bring the additives to the desired solder layer thickness.
Claim 9
Dependent Claim
24 words
Method as defined in claim 1 wherein the amount of additives added to the solder is less than 12% of the total resulting mixture.
Claim 10
Dependent Claim
19 words
Method as defined in claim 1 wherein the additives have a density comparable to the density of the solder.
Claim 11
Dependent Claim
22 words
Method as defined in claim 1 wherein the additives are provided with a surface layer which is substantially insoluble in the solder.
Claim 12
Dependent Claim
31 words
Method as defined in claim 1 wherein the additives are bodies whose surface is of a material which is wettable by the solder when the solder is in its molten state.
Claim 13
Dependent Claim
31 words
Method as defined in claim 1 wherein the additives are constituted by at least one metal or metal alloy whose melting point is higher than the melting point of the solder.
Claim 14
Dependent Claim
20 words
Method as defined in claim 1 wherein the additives are constituted by at least one rollable metal or metal alloy.
Claim 15
Dependent Claim
35 words
Method as defined in claim 1 wherein the additives are bodies having a composition selected from the group consisting of: copper, nickel-plated copper, a gold-silver alloy, a nickel-plated gold-silver alloy, silver, nickel-plated silver, and nickel.
Claim 16
Dependent Claim
20 words
Method as defined in claim 14 wherein the composition is a gold-silver alloy containing approximately 10% gold and 90% silver.
Claim 17
Dependent Claim
15 words
Method as defined in claim 1 wherein the additives are constituted by hard molded bodies.
Claim 18
Dependent Claim
27 words
Method as defined in claim 1 wherein the additives are bodies of a composition selected from the group consisting of: tungsten, nickel-plated tungsten, molybdenum, and nickel-plated molybdenum.
Claim 19
Dependent Claim
16 words
Method as defined in claim 1 wherein the additives are bodies of glass or ceramic-like substances.
Claim 20
Dependent Claim
13 words
Method as defined in claim 18 wherein the additive bodies have metallized surfaces.
Claim 21
Dependent Claim
13 words
Method as defined in claim 1 wherein the solder is a soft solder.
Claim 22
Dependent Claim
29 words
Method as defined in claim 20 wherein the soft solder is of a composition selected from the group consisting of: lead-indium alloys, lead-indium-silver alloys, lead-tin alloys, and gold-tin alloys.
Claim 23
Dependent Claim
22 words
Method as defined in claim 21 wherein the soft solder composition is a lead-indium alloy containing approximately 70% lead and 30% indium.
Claim 24
Dependent Claim
25 words
Method as defined in claim 21 wherein the soft solder composition is a lead-indium-silver alloy consisting of approximately 90% lead, 5% silver and 5% indium.
Claim 25
Dependent Claim
22 words
Method as defined in claim 21 wherein the soft solder composition is a lead-tin alloy containing approximately 60% lead and 40% tin.
Claim 26
Dependent Claim
22 words
Method as defined in claim 21 wherein the soft solder composition is a lead-tin alloy containing approximately 90% lead and 10% tin.
Claim 27
Dependent Claim
22 words
Method as defined in claim 21 wherein the soft solder composition is a lead-tin alloy containing approximately 97% lead and 3% tin.
Claim 28
Dependent Claim
22 words
Method as defined in claim 21 wherein the soft solder composition is a gold-tin alloy containing approximately 80% gold and 20% tin.
Claim 29
Dependent Claim
15 words
Method as defined in claim 1 wherein a hard solder is used as the solder.
Claim 30
Dependent Claim
14 words
Method as defined in claim 1 wherein the additives are constituted by spherical bodies.
Claim 31
Dependent Claim
14 words
Method as defined in claim 1 wherein the additives are constituted by cylindrical bodies.
Claim 32
Dependent Claim
25 words
Method as defined in claim 1 further comprising, after said step of incorporating and before said step of introducing, stamping the solder into shaped pieces.
Claim 33
Dependent Claim
33 words
Method as defined in claim 1 wherein sAid step of introducing is carried out by applying the solder containing the additives to at least one of the two surfaces to be soldered together.
Claim 34
Dependent Claim
30 words
Method as defined in claim 1 wherein said step of introducing is carried out by immersing one of the surfaces in a molten mass of the solder containing the additives.
Claim 35
Dependent Claim
31 words
Method as defined in claim 1 wherein said step of introducing is carried out by applying the solder containing the additives by roller plating or pressing onto one of the surfaces.
Claim 36
Dependent Claim
37 words
Method as defined in claim 1 wherein said step of introducing is carried out by placing the solder containing the additives in the form of a foil and melting the solder foil on one of the surfaces.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-08-18 | 1979-02-17 | 1979-08-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-08-18 | 1983-02-17 | 1983-08-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-08-18 | 1987-02-17 | 1987-08-19 | $7700.00 | Window Closed / Lapsed |