US4067104A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
Assignee: Boeing North American Inc
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Filing: 1977-02-24
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Granted: 1978-01-10
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Expires: 1997-02-24
Abstract
Abstract A method of interconnecting microelectronic components with flexible metallic interconnects. A layer of photoresist is applied to the surface of a microelectronic component and then removed from selected locations. A deposit of metal is applied to the selected location. A second layer of photoresist is applied over the first layer and over the deposited metal. The second layer of photoresist is removed from above the metal deposit and a second metal deposit is applied over the first metal deposit. These steps are repeated until a predetermined height of deposited metal is reached supported by layers of photoresist. The upper surface of the deposit and photoresist is polished flat and pads of metal deposited. A second microelectronic component having mating metal pads is positioned over the first microelectronic component and bonded to it through the mating metal pads. Finally, the layers of photoresist are removed.
Inventors
- 👤 John M. Tracy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 20:08
CPC Classifications
H; H10; H10W; H10W72/00; H05; H05K; H05K3/00; H05K3/40; H05K3/4007; H10W90/00; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/0364; H05K2201/0367; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0577; H05K2203/14; H05K2203/1476; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W72/01; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/701; H10W90/721; H10W90/722; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/4981; Y10T29/49812
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
127 words
A method of providing at least one interconnector for microelectronic components, comprising the steps of: a. providing a microelectronic component having a surface with a first coat of photoresist and at least one surface uncoated with photoresist; b. applying a first deposit of metal on said uncoated surface; c. coating said first deposit of metal and said first coat of photoresist with a second coat of photoresist; d. removing material from said second coat of photoresist until its top surface is flush with the top surface of said first deposit of metal and until irregularities in the height of said topsurface are removed; and e. applying a second deposit of metal on said top surface, whereby at least one supported interconnect is provided on said microelectronic component.
Claim 2
Independent Claim
127 words
A method of providing at least one interconnector for microelectronic components, comprising the steps of: a. providing a microelectronic component having a surface with a first coat of photoresist and at least one surface uncoated with photoresist; b. applying a first deposit of metal on said uncoated surface; c. coating said first deposit of metal and said first coat of photoresist with a second coat of photoresist; d. removing material from said second coat of photoresist until its top surface is flush with the top surface of said first deposit of metal and until irregularities in the height of said topsurface are removed; and e. applying a second deposit of metal on said top surface, whereby at least one supported interconnect is provided on said microelectronic component.
Claim 3
Dependent Claim
22 words
The method as claimed in claim 1, wherein said step (b) comprises electroplating a first deposit of metal on said uncoated surface.
Claim 4
Dependent Claim
12 words
The method as claimed in claim 1, wherein said metal comprises indium.
Claim 5
Independent Claim
136 words
A method of providing at least one interconnector for microelectronic components, comprising the steps of: a. providing a microelectronic component having a surface with a coat of photoresist and at least one surface uncoated with photoresist; b. applying a deposit of metal on the uncoated surface; c. applying photoresist to the deposit of metal and to the coat of photoresist; d. removing the photoresist from the top surface of said deposit of metal; e. repeating steps (b), (c), and (d) until a predetermined height of deposited metal is reached; f. applying a top deposit of metal on the uncoated surface; g. smoothing said top deposit of metal and the surrounding photoresist as required to make their upper surfaces flush and free from surface irregularities, whereby at least one supported interconnect is provided on said microelectronic component.
Claim 6
Independent Claim
136 words
A method of providing at least one interconnector for microelectronic components, comprising the steps of: a. providing a microelectronic component having a surface with a coat of photoresist and at least one surface uncoated with photoresist; b. applying a deposit of metal on the uncoated surface; c. applying photoresist to the deposit of metal and to the coat of photoresist; d. removing the photoresist from the top surface of said deposit of metal; e. repeating steps (b), (c), and (d) until a predetermined height of deposited metal is reached; f. applying a top deposit of metal on the uncoated surface; g. smoothing said top deposit of metal and the surrounding photoresist as required to make their upper surfaces flush and free from surface irregularities, whereby at least one supported interconnect is provided on said microelectronic component.
Claim 7
Dependent Claim
12 words
The method as claimed in claim 4, wherein said metal is indium.
Claim 8
Dependent Claim
30 words
The method as claimed in claim 4, including after step (g) the step of applying a final deposit of metal on the upper surface of said top deposit of metal.
Claim 9
Dependent Claim
47 words
The method as claimed in claim 4, wherein said step (g) comprises: applying a top coat of photoresist on said top deposit of metal and on the uppermost coat of photoresist; and removing material from said top coat of photoresist and from said top deposit of metal.
Claim 10
Dependent Claim
54 words
The method as claimed in claim 4, including after step (g) the steps of: applying a further coat of photoresist on said flush upper surfaces; removing said further coat of photoresist from said top deposit of metal; and applying a final deposit of metal on the upper surface of said top deposit of metal.
Claim 11
Independent Claim
189 words
A method of interconnecting two microelectronic components, comprising the steps of: a. providing a first microelectronic component having a surface with a coat of photoresist and at least one surface uncoated with photoresist; b. applying a deposit of metal on the uncoated surface; c. applying photoresist to the deposit of metal and to the coat of photoresist; d. removing the photoresist from the top surface of said deposit of metal; e. repeating steps (b), (c), and (d) until a predetermined height of deposited metal is reached; f. applying a top deposit of metal on the uncoated surface; g. applying a top coat of photoresist on said top deposit of metal and on the uppermost coat of photoresist; h. removing material from said top coating of photoresist and from said top deposit of metal until their upper surfaces are flush and free from surface irregularities; i. applying a final deposit of metal on the upper surface of said top deposit of metal; j. positioning a contact location on a second microelectronic component against said final deposit; and k. bonding said contact location of said second microelectronic to said final deposit.
Claim 12
Independent Claim
189 words
A method of interconnecting two microelectronic components, comprising the steps of: a. providing a first microelectronic component having a surface with a coat of photoresist and at least one surface uncoated with photoresist; b. applying a deposit of metal on the uncoated surface; c. applying photoresist to the deposit of metal and to the coat of photoresist; d. removing the photoresist from the top surface of said deposit of metal; e. repeating steps (b), (c), and (d) until a predetermined height of deposited metal is reached; f. applying a top deposit of metal on the uncoated surface; g. applying a top coat of photoresist on said top deposit of metal and on the uppermost coat of photoresist; h. removing material from said top coating of photoresist and from said top deposit of metal until their upper surfaces are flush and free from surface irregularities; i. applying a final deposit of metal on the upper surface of said top deposit of metal; j. positioning a contact location on a second microelectronic component against said final deposit; and k. bonding said contact location of said second microelectronic to said final deposit.
Claim 13
Dependent Claim
21 words
The method as claimed in claim 9, including after step (k) the step of removing photoresist from between said microelectronic components.
Claim 14
Independent Claim
198 words
A method of interconnecting a two-dimensional array of sensors, each sensor having an electrical output location, with signal processor means having a two-dimensional array of electrical input locations, comprising: a. applying photoresist to the surface of said processor means having said electrical input locations; b. removing photoresist from said array of electrical input locations; c. applying a deposit of metal on said electrical input locations; d. applying photoresist to the deposit of metal and to the applied photoresist; e. removing the photoresist from the top surface of said deposit of metal; f. applying a deposit of metal on the uncoated surface; g. repeating steps (d), (e), and (f), until a predetermined height of deposited metal is reached; h. applying a top coat of photoresist on the uppermost deposit of metal and applied photoresist; i. removing material from said top coat of photoresist and from said uppermost deposit of metal until their upper surfaces are flush and free from surface irregularities; j. applying a final deposit of metal on said uppermost deposit of metal; k. positioning said output locations on said sensors against said final deposit; and l. bonding said output locations of said sensors to said final deposit.
Claim 15
Independent Claim
198 words
A method of interconnecting a two-dimensional array of sensors, each sensor having an electrical output location, with signal processor means having a two-dimensional array of electrical input locations, comprising: a. applying photoresist to the surface of said processor means having said electrical input locations; b. removing photoresist from said array of electrical input locations; c. applying a deposit of metal on said electrical input locations; d. applying photoresist to the deposit of metal and to the applied photoresist; e. removing the photoresist from the top surface of said deposit of metal; f. applying a deposit of metal on the uncoated surface; g. repeating steps (d), (e), and (f), until a predetermined height of deposited metal is reached; h. applying a top coat of photoresist on the uppermost deposit of metal and applied photoresist; i. removing material from said top coat of photoresist and from said uppermost deposit of metal until their upper surfaces are flush and free from surface irregularities; j. applying a final deposit of metal on said uppermost deposit of metal; k. positioning said output locations on said sensors against said final deposit; and l. bonding said output locations of said sensors to said final deposit.
Claim 16
Dependent Claim
31 words
The method as claimed in claim 11, wherein said steps (c) and (f) comprise electroplating said deposit of metal and said step (j) comprises vapor depositing said final deposit of metal.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-01-09 | 1981-07-11 | 1982-01-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-01-09 | 1985-07-11 | 1986-01-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-01-09 | 1989-07-11 | 1990-01-10 | $7700.00 | Window Closed / Lapsed |