US5153379A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Shielded low-profile electronic component assembly
Assignee: Motorola Solutions Inc
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Filing: 1990-10-09
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Granted: 1992-10-06
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Expires: 2010-10-09
Abstract
Abstract A shielded low-profile electronic component assembly 100 providing shielding for electronic components is disclosed which includes a substrate 124, and shield 102. In a first embodiment the shield 102 is chamfered at each shield corner 110 and is attached to the substrate 124 at ground pad patterns 114, which are found at each corner of the substrate 124 on surface 128. A ground paddle 120 is also located in substrate 124 which lies substantially underneath the electronic component 112, and is utilized in maximizing shielding. In an alternate embodiment a substrate 124 is overmolded with encapsulation material 302 after the electronic component 112 is affixed to the substrate 124, with each of the encapsulation material corners 306 being chamfered exposing ground pads 114. The metallized shield 310 is then placed over the overmolded encapsulant and attached to the substrate 124 at ground pad patterns 114. The overmolded encapsulant 302 adding protection to the electronic component 112. In a third embodiment the metallized shield is slightly smaller in area than the substrate 124 and is attached at each of the four ground pads 114, with the shield edges 204 resting on substrate 124.
Inventors
- 👤 Andrzej T. Guzuk
- 👤 Todd W. Roshitsh
- 👤 Scott M. Engstrom
- 👤 Lonnie L. Bernardoni
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 06:54
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/20; H10W44/00; H10W44/20; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
106 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern: the electronic component affixed to the one major surface of said electronic component carrier. the electronic component being encapsulated with encapsulant material substantially covering the electronic component; and a metallized shield attached to the ground pad pattern and substantially covering the electronic component.
Claim 2
Dependent Claim
106 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern: the electronic component affixed to the one major surface of said electronic component carrier. the electronic component being encapsulated with encapsulant material substantially covering the electronic component; and a metallized shield attached to the ground pad pattern and substantially covering the electronic component.
Claim 3
Dependent Claim
33 words
An electronic component assembly according to claim 1, further comprising: a grounded die paddle on the major surface for receiving the electronic component, with the die paddle located substantially underneath the electronic component.
Claim 4
Dependent Claim
31 words
An electronic component assembly according to claim 1, wherein the metallized shield includes a recessed area overlying the electronic component allowing the recessed area to be closer to the electronic component.
Claim 5
Dependent Claim
115 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals: an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern: the electronic component affixed to the one major surface of said electronic component carrier: and a metallized shield attached to the ground pad pattern and substantially covering the electronic component: the metallized shield including a recessed area overlying the electronic component allowing the recessed area to be closer to the electronic component.
Claim 6
Dependent Claim
115 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals: an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern: the electronic component affixed to the one major surface of said electronic component carrier: and a metallized shield attached to the ground pad pattern and substantially covering the electronic component: the metallized shield including a recessed area overlying the electronic component allowing the recessed area to be closer to the electronic component.
Claim 7
Dependent Claim
29 words
An electronic component assembly according to claim 4, wherein the metallized shield includes at least one pin, and the substrate includes at least one aperture for receiving the pin.
Claim 8
Dependent Claim
29 words
An electronic component assembly according to claim 4, wherein the metallized shield has an aperture, and the electronic component is encapsulated with encapsulation material substantially covering the electronic component.
Claim 9
Dependent Claim
84 words
An electronic component assembly, as defined in claim 6, wherein the overmolded encapsulant material has at least three corners, and is chamfered on the at least three corners exposing the one major surface area which has the electronic component affixed to it at the at least three corners, the encapsulant material also having a recess area substantially around the peripheral edge sides of the substrate, and the metallized shield having a metallized shield overhang which rests on the recess area of the encapsulant material.
Claim 10
Dependent Claim
33 words
An electronic component assembly according to claim 7, further comprising: a grounded die paddle on the major surface for receiving the electronic component, with the die paddle located substantially underneath the electronic component.
Claim 11
Dependent Claim
136 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern; the electronic component affixed to the one major surface of the electronic component carrier; an encapsulant material overmolded over the electronic component and substantially covering the one major surface area where the electronic component is affixed to, and having a portion of the at least one ground pad pattern not overmolded with encapsulant; and a metallized shield attached to the at least one ground pad pattern and substantially covering the overmolded encapsulant material.
Claim 12
Dependent Claim
136 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern; the electronic component affixed to the one major surface of the electronic component carrier; an encapsulant material overmolded over the electronic component and substantially covering the one major surface area where the electronic component is affixed to, and having a portion of the at least one ground pad pattern not overmolded with encapsulant; and a metallized shield attached to the at least one ground pad pattern and substantially covering the overmolded encapsulant material.
Claim 13
Dependent Claim
132 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having a major surface having peripheral edge sides and a conductive pattern on the major surface for receiving the electronic component, and at least one ground pad pattern located on the major surface; the electronic component affixed to the major surface of said electronic component carrier; and a metallized shield attached to the ground pad pattern and substantially covering the electronic component, the metallized shield formed from a single piece of metal and having a shield land area which rests on the major surface of the substarte upon the metallized shield being attatched to the substrate, the metallized shield further having a shield overhang which substantially overhangs the substrate peripherial edge sides.
Claim 14
Dependent Claim
132 words
An electronic component assembly, comprising: an electronic component having a plurality of terminals; an electronic component carrier including a substrate having a major surface having peripheral edge sides and a conductive pattern on the major surface for receiving the electronic component, and at least one ground pad pattern located on the major surface; the electronic component affixed to the major surface of said electronic component carrier; and a metallized shield attached to the ground pad pattern and substantially covering the electronic component, the metallized shield formed from a single piece of metal and having a shield land area which rests on the major surface of the substarte upon the metallized shield being attatched to the substrate, the metallized shield further having a shield overhang which substantially overhangs the substrate peripherial edge sides.
Claim 15
Dependent Claim
23 words
An electronic component assembly according to claim 10, wherein the metallized shield corners are chamfered and are attached to the ground pad patterns.
Claim 16
Dependent Claim
36 words
An electronic component assembly according to claim 10, wherein the major surface includes grounded substrate regions substantially along the sides of the substrate, and the metallized shield land area is attached to the grounded substrate regions.
Claim 17
Dependent Claim
19 words
An electronic component assembly according to claim 10, wherein the height of the assembly is less than 0.060 inches.
Claim 18
Dependent Claim
23 words
An electronic component assembly as defined in claim 10, wherein the electronic component is encapsulated with encapsulation material substantially covering the electronic component.
References Cited (Backward Citations)
JPS6443498A
Cited
US4967315A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-06 | 1996-04-06 | 1996-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-06 | 2000-04-06 | 2000-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-06 | 2004-04-06 | 2004-10-06 | $7700.00 | Window Closed / Lapsed |