Semiconductor chip module

Claim 2

A semiconductor chip module comprising; a plurality of semiconductor chips, each provided with an array of contacts on its substantially entire front face; a multi-layered organic circuit board mounting said semiconductor chips on its front face, said multi-layered organic circuit board is provided on its front face with array of contacts corresponding to the array of contacts of said respective semiconductor chips, and said multi-layered organic circuit board is provided on its back face with a plurality of engage- and disengageable connector pins; intermediate insulating substrates, each disposed between said respective semiconductor chips and said multi-layered organic circuit board, the thermal expansion coefficient of each of said intermediate insulating substrates is substantially the same as that of said respective semiconductor chips, each of said intermediate insulating substrates is provided with an array of contacts on its front and back faces corresponding to that of the associated semiconductor chip, the contacts on the front face of each of said intermediate insulating substrates are electrically connected directly to the corresponding contacts on the back face thereof, the respective contacts on the front faces of said intermediate insulating substrates are electrically and mechanically connected to the corresponding contacts on the front face of the associated semiconductor chip through a solder; a connecting member electrically and mechanically connecting the contacts on the back face of each of said intermediate insulating substrates to the corresponding contacts on the front face of said multi-layered organic circuit board, and mechanically coupling said intermediate insulating substrates with said multi-layered organic circuit board to the extent permitting relative displacement of said intermediate insulating substrates to said multi-layered organic circuit board due to thermal expansion difference therebetween through a gap of predetermined distance, said connecting member includes electrical conductors with a predetermined flexibility and rigidity bridged between the respective corresponding contacts on the back face of each of said intermediate insulating substrates and on the front face of said multi-layered organic circuit board and bonded thereat through a solder.

Claim 3

The semiconductor chip module according to claim 1 wherein said electrical conductor of said connecting member is formed of a material selected from the group consisting of copper, a copper-alloy, and an iron-nickel alloy.

Claim 4

The semiconductor chip module according to claim 2, wherein said electrical conductor of said connecting member is in a pin shape.

Claim 5

The semiconductor chip module according to claim 3, wherein the diameter of said pin shaped electrical conductor is 0.1 to 0.2 mm.

Claim 6

The semiconductor chip module according to claim 2, wherein said electrical conductor of said connecting member is in a strip shape.

Claim 7

The semiconductor chip module according to claim 2, wherein said electrical conductor of said connecting member is in a spiral shape.

Claim 8

The semiconductor chip module according to claim 2, wherein said electrical conductor of said connecting member is in a corrugate shape.

Claim 9

A semiconductor chip module comprising: a plurality of semiconductor chips, each provided with an array of contacts on its substantially entire front face; a multi-layered organic circuit board mounting said semiconductor chips on its front face, said multi-layered organic circuit board is provided on its front face with array of contacts corresponding to the array of contacts of said respective semiconductor chips, and said multi-layered organic circuit board is provided on its back face with a plurality of engage- and disengageable connector pins; intermediate insulating substrates, each disposed between said respective semiconductor chips and said multi-layered organic circuit board, the thermal expansion coefficient of each of said intermediate insulating substrates is substantially the same as that of said respective semiconductor chips each of said intermediate insulating substrates is provided with an array of contacts on its front and back face corresponding to that of the associated semiconductor chip, the contacts on the front face of each of said intermediate insulating substrates are electrically connected directly to the corresponding contacts on the back face thereof, the respective contacts on the front faced of said intermediate insulating substrates are electrically connected to the corresponding contacts on the front face of the associated semiconductor chip through a solder; a connecting member electrically connecting the contacts on the back face of each of said intermediate insulating substrates to the corresponding contacts on the front face of said multi-layered organic circuit board, and mechanically coupling said intermediate insulating substrates with said multi-layered organic circuit board to the extent permitting relative displacement of said intermediate insulating substrates to said multi-layered organic circuit board due to thermal expansion difference therebetween through a gap of predetermined distance, the predetermined gap distance between said intermediate insulating substrate and said multi-layered organic circuit board is 0.5 to 1.0 mm, said connecting member includes electrical conductors with a predetermined flexibility and rigidity bridged between the respective corresponding contacts on the back face of each of said intermediate insulating substrate and on the front face of said multi-layered organic circuit board and bonded thereat through a solder.

Claim 10

A semiconductor chip module comprising: a plurality of semiconductor chips, each provided with an array of contacts on its substantially entire front face; a multi-layered organic circuit board mounting said semiconductor chips on its front face, said multi-layered organic circuit board is provided on its front face with array of contacts corresponding to the array of contacts of said respective semiconductor chips, and said multi-layered organic circuit board is provided on its back face with a plurality of engage- and disengageable connector pins; intermediate insulating substrates, each disposed between said respective semiconductor chips and said multi-layered organic circuit board, the thermal expansion coefficient of each of said intermediate insulating substrates is substantially the same as that of said respective semiconductor chips each of said intermediate insulating substrates is provided with an array of contacts on its front and back face corresponding to that of the associated semiconductor chip, the contacts on the front face of each of said intermediate insulating substrates are electrically connected directly to the corresponding contacts on the back face thereof, the respective contacts on the front faced of said intermediate insulating substrates are electrically connected to the corresponding contacts on the front face of the associated semiconductor chip through a solder; a connecting member electrically connecting the contacts on the back face of each of said intermediate insulating substrates to the corresponding contacts on the front face of said multi-layered organic circuit board, and mechanically coupling said intermediate insulating substrates with said multi-layered organic circuit board to the extent permitting relative displacement of said intermediate insulating substrates to said multi-layered organic circuit board due to thermal expansion difference therebetween through a gap of predetermined distance, the predetermined gap distance between said intermediate insulating substrate and said multi-layered organic circuit board is 0.5 to 1.0 mm, said connecting member includes electrical conductors with a predetermined flexibility and rigidity bridged between the respective corresponding contacts on the back face of each of said intermediate insulating substrate and on the front face of said multi-layered organic circuit board and bonded thereat through a solder.

Claim 11

The semiconductor chip module according to claim 1, wherein said intermediate insulating substrate includes first and second intermediate insulating substrates, said first intermediate insulating substrate is provided with an array of contacts each on its front and back faces corresponding to that of said semiconductor chip, the contacts on the front face of said first intermediate insulating substrate are electrically connected directly to the corresponding contacts on the back face of said first intermediate insulating substrate, the respective contacts on the front face of said first intermediate insulating substrate are electrically connected to the corresponding contacts on the front face of said semiconductor chip through a solder, the thermal expansion coefficient of said second intermediate insulating substrate is substantially the same as that of said first intermediate insulating substrate, said second intermediate insulating substrate is provided with an array of contacts each on its front and back faces corresponding to that of said first intermediate insulating substrate, the contacts on the front face of said second intermediate insulating substrate are electrically connected directly to the corresponding contacts on the back face of said second intermediate insulating substrate, the respective contacts on the front face of said second intermediate insulating substrate are electrically connected to the corresponding contacts on the back face of said first intermediate insulating substrate through a solder, and said second intermediate insulating substrate further carries said respective electrical conductors of said connecting member through the respective contacts on the back face of said second intermediate insulating substrate.

Claim 12

The semiconductor chip module according to claim 1, wherein said intermediate insulating substrate includes a built-in capacitor.

Claim 13

The semiconductor chip module according to claim 10, wherein said built-in capacitor in said intermediate insulating substrate comprises an inorganic layer having a high dielectric constant and formed of a perovskite material selected from the group consisting of PbO, Fe 2 O 3 , WO 3 , TiO 2 and Nb 2 O 5 and a pair of electrodes disposed on the both faces of the inorganic layer.

Claim 14

The semiconductor chip module according to claim 1 wherein the thermal expansion coefficient of said intermediate insulating substrate is 30 to 65×10 -7 /°C.

Claim 15

A semiconductor chip module comprising: a plurality of semiconductor chips, each provided with an array of contacts on its substantially entire front face; a multi-layered organic circuit board mounting said semiconductor chips on its front face, said multi-layered organic circuit board is provided on its front face with array of contacts corresponding to the array of contacts of said respective semiconductor chips, and said multi-layered organic circuit board is provided on its back face with a plurality of engage- and disengageable connector pins; intermediate insulating substrates, each disposed between said respective semiconductor chips and said multi-layered organic circuit board, the thermal expansion coefficient of each of said intermediate insulating substrates is substantially the same as that of said respective semiconductor chips each of said intermediate insulating substrates is provided with an array of contacts on its front and back faces corresponding to that of the associated semiconductor chip, the contacts on the front face of each of said intermediate insulating substrates are electrically connected directly to the corresponding contacts on the back face thereof, the respective contacts on the front face of said intermediate insulating substrates are electrically connected to the corresponding contacts on the front face of the associated semiconductor chip through a solder, said intermediate insulating substrate is formed of a material selected from the group consisting of composites of silica and borosilicate glass, silica and aluminum borate glass, and alumina and borosilicate glass; a connecting member electrically connecting the contacts on the back face of each of said intermediate insulating substrates to the corresponding contacts on the front face of said multi-layered organic circuit board, and mechanically coupling said intermediate insulating substrates with said multi-layered organic circuit board to the extend permitting relative displacement of said intermediate insulating substrates to said multi-layered organic circuit board due to thermal expansion difference therebetween through a gap of predetermined distance, said connecting member includes electrical conductors with a predetermined flexibility and rigidity bridged between the respective corresponding contact on the back face of each of said intermediate insulating substrates and on the front face of said multi-layered organic circuit board and bonded thereat through a solder, said electrical conductor of said connecting member is formed of a material selected from the group consisting of a copper, a copper-alloy, and an iron-nickel alloy.

Claim 16

A semiconductor chip module comprising: a plurality of semiconductor chips, each provided with an array of contacts on its substantially entire front face; a multi-layered organic circuit board mounting said semiconductor chips on its front face, said multi-layered organic circuit board is provided on its front face with array of contacts corresponding to the array of contacts of said respective semiconductor chips, and said multi-layered organic circuit board is provided on its back face with a plurality of engage- and disengageable connector pins; intermediate insulating substrates, each disposed between said respective semiconductor chips and said multi-layered organic circuit board, the thermal expansion coefficient of each of said intermediate insulating substrates is substantially the same as that of said respective semiconductor chips each of said intermediate insulating substrates is provided with an array of contacts on its front and back faces corresponding to that of the associated semiconductor chip, the contacts on the front face of each of said intermediate insulating substrates are electrically connected directly to the corresponding contacts on the back face thereof, the respective contacts on the front face of said intermediate insulating substrates are electrically connected to the corresponding contacts on the front face of the associated semiconductor chip through a solder, said intermediate insulating substrate is formed of a material selected from the group consisting of composites of silica and borosilicate glass, silica and aluminum borate glass, and alumina and borosilicate glass; a connecting member electrically connecting the contacts on the back face of each of said intermediate insulating substrates to the corresponding contacts on the front face of said multi-layered organic circuit board, and mechanically coupling said intermediate insulating substrates with said multi-layered organic circuit board to the extend permitting relative displacement of said intermediate insulating substrates to said multi-layered organic circuit board due to thermal expansion difference therebetween through a gap of predetermined distance, said connecting member includes electrical conductors with a predetermined flexibility and rigidity bridged between the respective corresponding contact on the back face of each of said intermediate insulating substrates and on the front face of said multi-layered organic circuit board and bonded thereat through a solder, said electrical conductor of said connecting member is formed of a material selected from the group consisting of a copper, a copper-alloy, and an iron-nickel alloy.

Claim 17

The semiconductor chip module according to claim 1, wherein said multi-layered organic circuit board is formed of a material selected from the group consisting of epoxy, isomelamine and fluorine resins.

Claim 18

A semiconductor chip module comprising: a plurality of semiconductor chips, each provided with an array of contacts on its substantially entire front face; a multi-layered organic circuit board mounting said semiconductor chips on its front face, said multi-layered organic circuit board is provided on its front face with array of contacts corresponding to the array of contacts of said responective semiconductor chips, and said multi-layered organic circuit board is provided on its back face with a plurality of engage- and disengageable connector pins; intermediate insulating substrates, each disposed between said respective semiconductor chips and said multi-layered organic circuit board, the thermal expansion coefficient of each of said intermediate insulating substrates is substantially the same as that of said respective semiconductor chips each of said intermediate insulating substrates is provided with an array of contacts on its front and back faces corresponding to that of the associated semiconductor chip, the contacts on the front face of each of said intermediate insulating substrates are electrically connected directly to the corresponding contacts on the back face thereof, the respective contacts on the front face of said intermediate insulating substrates are electrically connected to the corresponding contacts on the front face of the associated semiconductor chip through a solder, the spacing between adjacent contacts on the back face of each of said intermediate insulating substrates is larger than that between adjacent contacts on the front face thereof; a connecting member electrically connecting the contacts on the back face of each of said intermediate insulating substrates to the corresponding contacts on the front face of said multi-layered organic circuit board, and mechanically coupling said intermediate insulating substrates with said multi-layered organic circuit board to the extent permitting relative displacement of said intermediate insulating substrates to said multi-layered organic circuit board due to thermal expansion difference therebetween through a gap of predetermined distance, said connecting member includes electrical conductors with a predetermined flexibility and rigidity bridged between the respective corresponding contacts on the back face of each of said intermediate insulating substrates and on the front face of said multi-layered organic circuit board and bonded thereat through a solder.

Claim 19

A semiconductor chip module comprising: a plurality of semiconductor chips, each provided with an array of contacts on its substantially entire front face; a multi-layered organic circuit board mounting said semiconductor chips on its front face, said multi-layered organic circuit board is provided on its front face with array of contacts corresponding to the array of contacts of said responective semiconductor chips, and said multi-layered organic circuit board is provided on its back face with a plurality of engage- and disengageable connector pins; intermediate insulating substrates, each disposed between said respective semiconductor chips and said multi-layered organic circuit board, the thermal expansion coefficient of each of said intermediate insulating substrates is substantially the same as that of said respective semiconductor chips each of said intermediate insulating substrates is provided with an array of contacts on its front and back faces corresponding to that of the associated semiconductor chip, the contacts on the front face of each of said intermediate insulating substrates are electrically connected directly to the corresponding contacts on the back face thereof, the respective contacts on the front face of said intermediate insulating substrates are electrically connected to the corresponding contacts on the front face of the associated semiconductor chip through a solder, the spacing between adjacent contacts on the back face of each of said intermediate insulating substrates is larger than that between adjacent contacts on the front face thereof; a connecting member electrically connecting the contacts on the back face of each of said intermediate insulating substrates to the corresponding contacts on the front face of said multi-layered organic circuit board, and mechanically coupling said intermediate insulating substrates with said multi-layered organic circuit board to the extent permitting relative displacement of said intermediate insulating substrates to said multi-layered organic circuit board due to thermal expansion difference therebetween through a gap of predetermined distance, said connecting member includes electrical conductors with a predetermined flexibility and rigidity bridged between the respective corresponding contacts on the back face of each of said intermediate insulating substrates and on the front face of said multi-layered organic circuit board and bonded thereat through a solder.

Claim 20

The semiconductor chip module according to claim 1, wherein each of said semiconductor chip is provided on its back face with a ceramic insulating plate having a high thermal conductivity for radiating heat generated thereby.