Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor

Claim 1

In combination, a lead frame and a plastic encapsulated semiconductor device, comprising: a lead frame comprising: first and second parallel connecting bands; a relatively thick substrate support disposed between said connecting bands, said support having opposed upper and lower surfaces; a plurality of external leads extending from said first connecting band toward said substrate support, at least one of said external leads having an end adjacent said support, another of said external leads being mechanically connected to a first side of said substrate support adjacent said first connecting band; at least two relatively thin strips disposed substantially parallel to said other of said external leads and mechanically connecting said second connecting band to a second side of said substrate support adjacent said second connecting band and opposite said first side of said substrate support, each of said strips having opposed upper and lower surfaces, said strips being connected relatively close to the upper surface of said substrate support and relatively remote from the lower surface of said substrate support, so that a step is formed between the lower surface of said substrate support and the adjacent lower surfaces of said strips; said substrate support being mechanically supported between said first and second connecting bands by means of said other of said external leads and said strips; a semiconductor element disposed on said substrate support and electrically connected to said external leads; and a plastic mass surrounding said substrate support and semiconductor element and adjacent portions of said external leads and said strips, the thickness of said plastic mass below said adjacent portions of said strips being substantially greater than the thickness of said plastic mass below said substrate support, whereby the parts of said strips extending from said plastic mass may be readily severed therefrom.