Hybrid integrated circuit device

Claim 1

A hybrid integrated circuit device, comprising: (a) a semiconductor circuit element; (b) a multilayer ceramic package including-- (i) a first frame member having a first surface and a second surface and creating a cavity therebetween for incorporating said semiconductor circuit element therein, (ii) a cap mounted on the second surface of said first frame member so as to seal said cavity, and (iii) a second frame member having a first surface and a second surface, wherein the first surface of the second frame member is mounted on said second surface of said first frame member and surrounding said cap, said cap being thinner than said second frame member; (c) external connection terminals mounted on the multilayer ceramic package opposite the second frame member; (d) a base having a first surface and a second surface, wherein the base's first surface is mounted on said second surface of said second frame member; (e) first and second conductive patterns formed on said base; said second conductive pattern being bonded to said first conductive pattern by soldering; and (f) a film resistor pattern formed on the second surface of said base and electrically connected to said first and second conductive patterns and to said semiconductor circuit element, said film resistor pattern being trimmed so that the resistance value of said film resistor pattern is adapted to the characteristics of said semiconductor circuit element.