Electronic circuit package and method for making same

Claim 2

An electronic circuit package comprising a multilayered nonconductive supporting body containing a cavity for mounting an electronic device, a first layer of said structure having a device lead connecting surface portion, a second layer immediately overlying said first layer and having an aperture aligned with the exposing the immediately underlying device lead connecting surface portion of said first layer and having a peripheral overhang portion extending outwardly from the corresponding peripheral portions of said first layer, and electrically conductive lead pattern means at the interface of said layers and extending from and at least partially across the exposed device lead connecting surface portion of said first layer to and onto the overhang portion of said second layer.

Claim 3

The structure of claim 1 and further including exterior lead means connected to said electrically conductive lead pattern means adjacent the exterior ends thereof on said overhanging portion of said second layer.

Claim 4

The structure of claim 2 wherein said exterior lead means includes a plurality of exterior leads, each having a substantially Z-shaped inner end portion connected to said electrically conductive lead pattern means on said overhang portion of said second layer, whereby each lead extends downwardly and outwardly away from the point of connection to said electrically conductive means.

Claim 5

The structure of claim 1 wherein said layers are ceramic.

Claim 6

The structure of claim 1 wherein said body contains a plurality of cavities for mounting electronic devices, said first layer having a device lead connecting surface portion for each of the cavities and said electrically conductive lead pattern means extending from and at least partially across the exposed device lead connecting surface portions of said first layer to and onto the overhang portion of said second layer.

Claim 9

The method of claim 6 wherein said electrically conductive lead pattern means portions are screen painted with a metal powder disbursed in a vehicle.

Claim 10

The method of claim 6 wherein said underlying and overlying layers are formed of a green ceramic, and the heating of the assembly to fuse the portions of the electrically conductive lead pattern means together is carried out simultaneously with the firing of the ceramic.

Claim 11

The method of claim 8 and including the further steps of applying sufficient heat and pressure to said assembly to form intimate contact and a green bond between the layers prior to firing.

Claim 12

The method of claim 6 and including the further steps of attaching exterior lead frame to the peripheral ends of the electrically conductive lead pattern means and plating the exposed portions of said electrically conductive lead pattern means and lead frames with a noble metal.

Claim 13

An electronic circuit package comprising a three layer nonconductive supporting body containing a cavity within which an electronic device is to be mounted, a first layer of said structure having an aperture and having a device lead connecting surface portion adjacent said aperture, a second layer overlying said first layer, said second layer having an overhang portion extending outwardly from the corresponding peripheral portions of said first layer for the connection of exterior leads and having an aperture larger than the aperture of said first layer and aligned therewith to expose the device lead connecting surface portion of said first layer as a shelf within the cavity below the aperture in said second layer, the side walls of the aperture defining portions of said first and second layers defining the side walls of the cavity, a third layer underlying said second layer aperture and forming the bottom of the cavity on which the electronic device is to be mounted, and electrically conductive lead pattern means at the interface of said first and second layers and extending substantially in a single plane from and at least partially across the device lead connecting surface portion of said first layer to and onto the overhang portion of said second layer.

Claim 14

An electronic circuit package comprising a three layer nonconductive supporting body containing a cavity within which an electronic device is to be mounted, a first layer of said structure having an aperture and having a device lead connecting surface portion adjacent said aperture, a second layer overlying said first layer, said second layer having an overhang portion extending outwardly from the corresponding peripheral portions of said first layer for the connection of exterior leads and having an aperture larger than the aperture of said first layer and aligned therewith to expose the device lead connecting surface portion of said first layer as a shelf within the cavity below the aperture in said second layer, the side walls of the aperture defining portions of said first and second layers defining the side walls of the cavity, a third layer underlying said second layer aperture and forming the bottom of the cavity on which the electronic device is to be mounted, and electrically conductive lead pattern means at the interface of said first and second layers and extending substantially in a single plane from and at least partially across the device lead connecting surface portion of said first layer to and onto the overhang portion of said second layer.