Integrated circuit sealing method and structure

Claim 1

THE PROCESS OF MANUFACTURING SEALED MICRO-CIRCUITRY MODULES INCLUDING NETWORKS OF INTEGRATED DEPOSITED CIRCUIT ELEMENTS COMPRISING THE STEPS OF: (A) PROVIDING CIRCUIT PACKAGING MEMBERS INCLUDING AN INSULATING GLASS SUBSTRATE HAVING A RAISED RIDGE SURROUNDING A CIRCUIT-ELEMENT-RECEIVING CAVITY RECESSED BELOW THE RIDGE TO A DEPTH AT LEAST EQUALLING THE HEIGHT OF THE ELEMENTS TO BE DEPOSITED; (B) APPLYING TO THE SUBSTRATE SPACED CONDUCTIVE METALLIZED CONNECTOR FILMS, EACH HAVING AN EXTERNAL PORTION EXTENDING TO A LOCATION OUTSIDE OF SAID PACKAGING MEMBERS FOR THE PURPOSE OF PROVIDING EXTERNAL CONNECTIONS FOR THE NETWORK ELEMENTS WHEN DEPOSITED WITHIN THE CAVITY, AND EACH EXTENDING INTO A LOCATION WITHIN THE CIRCUIT-ELEMENT-RECEIVING CAVITY; (C) FIRING THE FLIMS ONTO THE SURFACE TO WHICH THEY ARE APPLIED; (D) SUBSEQUENTLY DEPOSITING CIRCUIT-ELEMENT NETWORKS IN THE RECESSED CAVITY INCLUDING DEPOSITING PORTIONS OF ELEMENTS IN OVERLAPPING RELATIONSHIP WITH SAID CONNECTOR FILM PORTIONS LOCATED WITHIN THE CAVITY; AND (E) SEALING THE CIRCUITRY BY APPLYING A COVER MEMBER OVER THE RECESSED CAVITY AND BONDING IT TO THE RAISED RIDGE WHILE LEAVING EXPOSED AT LEAST PART OF SAID EXTERNAL PORTION OF EACH CONNECTOR FILM.