US4935581A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Pin grid array package
Assignee: Citizen Watch Co Ltd
•
Filing: 1988-11-29
•
Granted: 1990-06-19
•
Expires: 2008-11-29
Abstract
Abstract In a method of forming a protective cover of a pin grid array in which a semiconductor chip is mounted on an upper surface of a resin board having a plurality of contact pins on a lower surface thereof, the pin grid array is inserted in a recess of a lower mold so as to be at a level lower than an upper surface of the lower mold and to leave a space therearound, the lower mold having the recess for receiving the resin board, grooves, formed on a bottom of the recess, for receiving the contact pins, and projections, formed on a peripheral portion of the recess, for abutting against part of side surfaces of the resin board. An upper mold is then placed above the upper surface of the lower mold. Finally, a thermosetting resin is injected in a gap defined between the upper and lower molds, thereby performing transfer molding. A pin grid array manufactured by the above method is also disclosed.
Inventors
- 👤 Kathuzi Komathu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 11:49
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H; H10; H10P; H10P72/00; H10P72/04; H10P72/0438; H10W; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/114; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
85 words
A pin grid array package comprising: a resinous printed circuit board having an upper surface and a lower surface; a semiconductor chip mounted directly on the upper surface of the resinous printed circuit board; a plurality of contact pins on the lower surface of the circuit board; a protective cover being transfer-molded and formed of a thermosetting resin; wherein the entire upper surface of the printed circuit board, including the semiconductor chip, and side surfaces of the circuit board, are encapsulated by the protective cover.
Claim 2
Dependent Claim
85 words
A pin grid array package comprising: a resinous printed circuit board having an upper surface and a lower surface; a semiconductor chip mounted directly on the upper surface of the resinous printed circuit board; a plurality of contact pins on the lower surface of the circuit board; a protective cover being transfer-molded and formed of a thermosetting resin; wherein the entire upper surface of the printed circuit board, including the semiconductor chip, and side surfaces of the circuit board, are encapsulated by the protective cover.
Claim 3
Dependent Claim
95 words
A pin grid array package comprising: a resinous printed circuit board having an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the resinous printed circuit board; a plurality of contact pins on the lower surface of the circuit board; a protective cover being transfer-molded, formed of a thermosetting resin and including recesses around the peripheral edges of a lower surface thereof; wherein the entire upper surface of the printed circuit board, including the semiconductor chip, and side surfaces of the circuit board, are encapsulated by the protective cover.
Claim 4
Dependent Claim
95 words
A pin grid array package comprising: a resinous printed circuit board having an upper surface and a lower surface; a semiconductor chip mounted on the upper surface of the resinous printed circuit board; a plurality of contact pins on the lower surface of the circuit board; a protective cover being transfer-molded, formed of a thermosetting resin and including recesses around the peripheral edges of a lower surface thereof; wherein the entire upper surface of the printed circuit board, including the semiconductor chip, and side surfaces of the circuit board, are encapsulated by the protective cover.
Claim 5
Dependent Claim
91 words
A pin grid array package comprising: a resinous printed circuit board having an upper surface and a lower surface; a semiconductor mounted on the upper surface of the resinous printed circuit board; a plurality of contact pins on the lower surface of the circuit board; a protective cover being transfer-molded, formed of a thermosetting resin and including a thickened portion overlying the semiconductor chip; wherein the entire upper surface of the printed circuit board, including the semiconductor chip, and side surfaces of the circuit board, are encapsulated by the protective cover.
Claim 6
Dependent Claim
91 words
A pin grid array package comprising: a resinous printed circuit board having an upper surface and a lower surface; a semiconductor mounted on the upper surface of the resinous printed circuit board; a plurality of contact pins on the lower surface of the circuit board; a protective cover being transfer-molded, formed of a thermosetting resin and including a thickened portion overlying the semiconductor chip; wherein the entire upper surface of the printed circuit board, including the semiconductor chip, and side surfaces of the circuit board, are encapsulated by the protective cover.
References Cited (Backward Citations)
US3374536A
Cited
US3444440A
Cited
US3388464A
Cited
US3449641A
Cited
US3659821A
Cited
US3959874A
Cited
US4305204A
Cited
US4410469A
Cited
US4498883A
Cited
US4657006A
Cited
US4574474A
Cited
US4542260A
Cited
US4514752A
Cited
US4688152A
Cited
US4778641A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-18 | 1993-12-18 | 1994-06-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-18 | 1997-12-18 | 1998-06-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-18 | 2001-12-18 | 2002-06-19 | $7700.00 | Window Closed / Lapsed |