Plastic molded chip carrier package and method of fabricating the same

Claim 2

A plastic molded chip carrier package comprising: a carrier member, being made of a plastic material, for mounting an integrated circuit chip at a central portion; a plurality of I/O pins each having at a first end a pair of spaced shoulders integrally embedded into said carrier member and each I/O pin at a second end protruding outwardly from the carrier member; and a conductor member integrally embedded in said carrier member, said conductor member including a substrate and a metallizing layer formed on said substrate, said metallizing layer being a plurality of conductor lines for electrical interconnection between terminals of said integrated circuit chip and corresponding I/O pins, an upper shoulder of said pair of spaced shoulders of each I/O pin being in supporting contact with said substrate.

Claim 3

A plastic molded chip carrier package according to claim 1, wherein a lower shoulder of said pair of shoulders of each I/O pin is flush with a bottom surface of the carrier member.

Claim 4

A plastic molded chip carrier package as set forth in claim 1, wherein said carrier member is integrally formed with at least one pair of positioning studs which project from the carrier member for abutment against a support member on which the package is to be mounted with said I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.

Claim 5

A plastic molded chip carrier package as set forth in claim 3, wherein said conductor line has a through hole into which the corresponding I/O pin extends with a distal top end projecting above the conductor line; and wherein said carrier member is molded to accommodate therein the conductor member in such a way as to form in the surface thereof a plurality of soldering pits which are in registration with individual through hole locations and in which distal top ends of the I/O pins and the adjacent portions of the conductor lines are exposed, said soldering pit being filled with soldering material for permanent connection between the I/O pins and the corresponding conductor lines.

Claim 6

A plastic molded chip carrier package as set forth in claim 3, further including a heat sink member having greater thermal conductivity than said carrier member and shaped to have a chip mounting surface and an opposed heat radiation surface, said heat sink member being integrally embeded centrally in the carrier member with said heat radiation surface exposed on a surface of the carrier member.

Claim 7

A plastic molded chip carrier package as set forth in claim 5, wherein said heat sink member is a flat shape member with a side wall being inclined inwardly from the chip mounting surface adjacent the conductor member to the heat radiation surface, said heat sink member being provided with an external flange extending sidewardly from a periphery of the heat radiation surface and being engaged in the carrier member.

Claim 8

A plastic molded chip carrier package as set forth in claim 5, wherein said heat sink member has said heat radiating surface projecting beyond a general surface of the carrier member.

Claim 9

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having at a first end a pair of shoulders integrally embedded into the carrier member and each pin at a second end protruding from the bottom surface of the carrier member; a metallized layer being integrally embedded into the carrier member, together with said I/O pins, and having a center opening smaller than the center recess of the carrier member, said metallized layer being composed of a plurality of conductor lines formed on a substrate, an upper shoulder of said pair of shoulders of each I/O pin being in supporting contact with said substrate, said metallized layer for electrical interconnection of said I/O pins with terminals of the integrated circuit chip, said conductor lines having inner lead ends arranged on an inner peripheral edge portion around said center opening of the metallized layer; a heat sink member integrally embedded in the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting said chip thereon; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface the carrier member for abutment against a support member on which the package is mounted with said I/O pins plugged into metallized through holes formed therein for positive positioning of said package on said support member; and said metallized layer being embedded within the carrier member in such a manner as to project the inner peripheral edge portion, including said inner lead ends of the conductor lines, into the center recess and to support the inner peripheral edge portion on a periphery of the top suface of said heat sink member for connection with the integrated circuit chip on the heat sink member.

Claim 10

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having at a first end a pair of shoulders integrally embedded into the carrier member and each pin at a second end protruding from the bottom surface of the carrier member; a metallized layer being integrally embedded into the carrier member, together with said I/O pins, and having a center opening smaller than the center recess of the carrier member, said metallized layer being composed of a plurality of conductor lines formed on a substrate, an upper shoulder of said pair of shoulders of each I/O pin being in supporting contact with said substrate, said metallized layer for electrical interconnection of said I/O pins with terminals of the integrated circuit chip, said conductor lines having inner lead ends arranged on an inner peripheral edge portion around said center opening of the metallized layer; a heat sink member integrally embedded in the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting said chip thereon; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface the carrier member for abutment against a support member on which the package is mounted with said I/O pins plugged into metallized through holes formed therein for positive positioning of said package on said support member; and said metallized layer being embedded within the carrier member in such a manner as to project the inner peripheral edge portion, including said inner lead ends of the conductor lines, into the center recess and to support the inner peripheral edge portion on a periphery of the top suface of said heat sink member for connection with the integrated circuit chip on the heat sink member.

Claim 11

A plastic molded chip carrier package as set forth in claim 8, wherein said metallized layer has a plurality of through holes each of which corresponds to each of the conductor lines and into each of which the corresponding I/O pins extends with a distal top end projecting above the conductor line; and wherein said carrier member is molded to accommodate therein the metallized layer in such as a way as to form in the top surface thereof a plurality of soldering pits which are in registration with individual through hole locations and in which the distal top ends of the I/O pins and the adjacent portions of the conductor lines are exposed, said soldering pit being filled with a soldering material for permanent connection between the I/O pins and the corresponding conductor lines.

Claim 12

A plastic molded chip carrier package according to claim 8, wherein a lower shoulder of said pair of shoulders of each I/O pin is flush with a bottom surface of the carrier member.

Claim 13

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having at a first end a pair of shoulders integrally embedded into said carrier member and having a second end which protrudes from the bottom surface thereof; a plurality of metallized layers which are integrally embedded within the carrier member in a stacking relation to each other, said metallized layers being provided with respective center openings having a common center and being of sizes smaller than said center recess of the carrier member, each of said metallized layers having a plurality of conductor lines formed on a substrate for electrical interconnection between terminals of the integrated circuit chip and corresponding I/O pins, an upper shoulder of said pair of shoulders of each I/O pin being in supporting contact with said substrate of a corresponding metallized layer, the conductor lines of each metallized layer having inner lead ends arranged on an inner peripheral edge portion around the center opening thereof, and said center opening being of a size larger in an upper metallized layer than in a lower metallized layer such that the inner lead ends of the conductor lines on the metallized layers are exposed in the center recess of the carrier member in a staggered relation with each other for permitting the conductor lines of the individual metallized layers to be connected to the integrated circuit chip at the staggered inner lead ends; a heat sink integrally embeded into the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting thereon said integrated circuit chip; and at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface thereof for abutment against a support member on which the package is to be mounted with I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.

Claim 14

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having at a first end a pair of shoulders integrally embedded into said carrier member and having a second end which protrudes from the bottom surface thereof; a plurality of metallized layers which are integrally embedded within the carrier member in a stacking relation to each other, said metallized layers being provided with respective center openings having a common center and being of sizes smaller than said center recess of the carrier member, each of said metallized layers having a plurality of conductor lines formed on a substrate for electrical interconnection between terminals of the integrated circuit chip and corresponding I/O pins, an upper shoulder of said pair of shoulders of each I/O pin being in supporting contact with said substrate of a corresponding metallized layer, the conductor lines of each metallized layer having inner lead ends arranged on an inner peripheral edge portion around the center opening thereof, and said center opening being of a size larger in an upper metallized layer than in a lower metallized layer such that the inner lead ends of the conductor lines on the metallized layers are exposed in the center recess of the carrier member in a staggered relation with each other for permitting the conductor lines of the individual metallized layers to be connected to the integrated circuit chip at the staggered inner lead ends; a heat sink integrally embeded into the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting thereon said integrated circuit chip; and at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface thereof for abutment against a support member on which the package is to be mounted with I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.

Claim 15

A molded plastic chip carrier package as set forth in claim 11, wherein each of said metallized layer has a plurality of through holes into which corresponding I/O pins extend respectively with distal top ends projecting above the conductor lines, the upper metallized layer having clearance holes which are in registration with the through holes in the lower metallized layer and into which extend the distal top ends of the I/O pins which are to be electrically connected to the conductor lines of the lower metallized layer; said carrier member being formed in the top surface at the through hole locations with soldering pits in which the distal top ends of the I/O pins are exposed together with adjacent portions of the corresponding conductor lines while the conductor lines located around the clearance holes in the upper metallized layer being sealed behind a surrounding wall of the soldering pits; and said soldering pits being filled with a soldering material for providing permanent interconnections between the I/O pins and the corresponding conductor lines in the respective metallized layers.

Claim 16

A plastic molded chip carrier package according to claim 11, wherein a lower shoulder of said pair of shoulders of each I/O pin is flush with a bottom surface of the carrier member.

Claim 17

A plastic molded chip carrier package comprising: a carrier member, being made of a plastic material, for mounting an integrated circuit chip at central portion; a plurality of I/O pins each having an enlarged tapering head at a top end portion integrally embedded into said carrier member and each I/O pin at a bottom end protruding outwardly from the carrier member; and a conductor member integrally embedded in said carrier member, said conductor member including a leadframe having a plurality of conductor lines for electrical interconnection between terminals of said integrated circuit chip and corresponding I/O pins, at a top of said enlarged tapering head of each I/O pin being in supporting contact with said leadframe.

Claim 18

A plastic molded chip carrier package comprising: a carrier member, being made of a plastic material, for mounting an integrated circuit chip at central portion; a plurality of I/O pins each having an enlarged tapering head at a top end portion integrally embedded into said carrier member and each I/O pin at a bottom end protruding outwardly from the carrier member; and a conductor member integrally embedded in said carrier member, said conductor member including a leadframe having a plurality of conductor lines for electrical interconnection between terminals of said integrated circuit chip and corresponding I/O pins, at a top of said enlarged tapering head of each I/O pin being in supporting contact with said leadframe.

Claim 19

A plastic molded chip carrier package according to claim 14, wherein said enlarged tapered heat cooperates with a shoulder formed adjacent thereto.

Claim 20

A plastic molded chip carrier package comprising: a carrier member, being made of a plastic material, for mounting an integrated circuit chip at a central portion; a plurality of I/O pins each having a shoulder at a top end portion integrally embedded into said carrier member and each I/O pin protruding outwardly from the carrier member; and a conductor member integrally embedded in said carrier member, said conductor member including a substrate and a metallizing layer formed on said substrate, said metallizing layer being a plurality of conductor lines for electrical interconnection between terminals of said integrated circuit chip and corresponding I/O pins, said shoulder of each I/O pin being in supporting contact with said substrate, wherein said conductor line has a through hole into which the corresponding I/O pin extends with a distal top end projecting above the conductor line; and wherein said carrier member is molded to accommodate therein the conductor member in such a way as to form in the surface thereof a plurality of soldering pits which are in registration with individual through hole locations and in which the distal top ends of the I/O pins and adjacent portions of the conductor lines are exposed, said soldering pit being filled with soldering material for permanent connection between the I/O pins and the corresponding conductor lines.

Claim 21

A plastic molded chip carrier package comprising: a carrier member, being made of a plastic material, for mounting an integrated circuit chip at a central portion; a plurality of I/O pins each having a shoulder at a top end portion integrally embedded into said carrier member and each I/O pin protruding outwardly from the carrier member; and a conductor member integrally embedded in said carrier member, said conductor member including a substrate and a metallizing layer formed on said substrate, said metallizing layer being a plurality of conductor lines for electrical interconnection between terminals of said integrated circuit chip and corresponding I/O pins, said shoulder of each I/O pin being in supporting contact with said substrate, wherein said conductor line has a through hole into which the corresponding I/O pin extends with a distal top end projecting above the conductor line; and wherein said carrier member is molded to accommodate therein the conductor member in such a way as to form in the surface thereof a plurality of soldering pits which are in registration with individual through hole locations and in which the distal top ends of the I/O pins and adjacent portions of the conductor lines are exposed, said soldering pit being filled with soldering material for permanent connection between the I/O pins and the corresponding conductor lines.

Claim 22

A plastic molded chip carrier package as set forth in claim 3, wherein the integrated circuit chip is integrally encapsulated together with the conductor member within said carrier member.

Claim 23

A plastic molded chip carrier package as set forth in claim 16, wherein said carrier member is integrally formed with at least one pair of positioning studs which project from the carrier member for abutment against a support member on which the package is to be mounted with said I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member.

Claim 24

A plastic molded chip carrier package as set forth in claim 18, wherein the integrated circuit chip is integrally encapsulated together with the conductor member within said carrier member.

Claim 25

A plastic molded chip carrier package as set forth in claim 18, further including a heat sink member having greater thermal conductivity than said carrier member and shaped to have a chip mounting surface and an opposed heat radiation surface, said heat sink member being integrally embedded centrally in the carrier member with said heat radiation surface exposed on a surface of the carrier member.

Claim 26

A plastic molded chip carrier package as set forth in claim 20, wherein said heat sink member is a flat shape member with a side wall being included inwardly from the chip mounting surface adjacent the conductor member to the heat radiation surface, said heat sink member being provided with an external flange extending sidewardly from a periphery of the heat radiation surface and being engaged in the carrier member.

Claim 27

A plastic molded chip carrier package as set forth in claim 20, wherein said heat sink member has said heat radiating surface projecting beyond a general surface of the carrier member.

Claim 28

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having a shoulder at a top portion integrally embedded into the carrier member so as to protrude from the bottom surface thereof; a metallized layer being integrally embedded into the carrier member, together with said I/O pins, and having a center opening smaller than the center recess of the carrier member, said metallized layer being composed of a plurality of conductor lines formed on a substrate, said shoulder of each I/O pin being in supporting contact with said substrate, said metallized layer for electrical interconnection of said I/O pins with terminals of the integrated circuit chip, said conductor lines having inner lead ends arranged on an inner peripheral edge portion around said center opening of the metallized layer; a heat sink member integrally embedded in the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting said chip thereon; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface the carrier member for abutment against a support member on which the package is mounted with said I/O pins plugged into metallized through holes formed therein for positive positioning of said package on said support member and said metallized layer being embedded within the carrier member in such a manner as to project the inner peripheral edge portion, including said inner lead ends of the conductor lines, into the center recess and to support the inner peripheral edge portion on a periphery of the top surface of said heat sink member for connection with the integrated circuit chip on the heat sink member, wherein said metallized layer has a plurality of through holes each of which corresponds to each of the conductor lines and into each of which the corresponding I/O pins extends with a distal top end projecting above the conductor line; and wherein said carrier member is molded to accommodate therein the metallized layer in such a way as to form in the top surface thereof a plurality of soldering pits which are in registration with individual through hole locations and in which the distal top ends of the I/O pins and the adjacent portions of the conductor lines are exposed, said soldering pit being filled with a soldering material for permanent connection between the I/O pins and the corresponding conductor lines.

Claim 29

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having a shoulder at a top portion integrally embedded into the carrier member so as to protrude from the bottom surface thereof; a metallized layer being integrally embedded into the carrier member, together with said I/O pins, and having a center opening smaller than the center recess of the carrier member, said metallized layer being composed of a plurality of conductor lines formed on a substrate, said shoulder of each I/O pin being in supporting contact with said substrate, said metallized layer for electrical interconnection of said I/O pins with terminals of the integrated circuit chip, said conductor lines having inner lead ends arranged on an inner peripheral edge portion around said center opening of the metallized layer; a heat sink member integrally embedded in the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting said chip thereon; at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface the carrier member for abutment against a support member on which the package is mounted with said I/O pins plugged into metallized through holes formed therein for positive positioning of said package on said support member and said metallized layer being embedded within the carrier member in such a manner as to project the inner peripheral edge portion, including said inner lead ends of the conductor lines, into the center recess and to support the inner peripheral edge portion on a periphery of the top surface of said heat sink member for connection with the integrated circuit chip on the heat sink member, wherein said metallized layer has a plurality of through holes each of which corresponds to each of the conductor lines and into each of which the corresponding I/O pins extends with a distal top end projecting above the conductor line; and wherein said carrier member is molded to accommodate therein the metallized layer in such a way as to form in the top surface thereof a plurality of soldering pits which are in registration with individual through hole locations and in which the distal top ends of the I/O pins and the adjacent portions of the conductor lines are exposed, said soldering pit being filled with a soldering material for permanent connection between the I/O pins and the corresponding conductor lines.

Claim 30

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having a shoulder at a top end portion integrally embedded into said carrier member to protrude from the bottom surface thereof; a plurality of metallized layers which are integrally embedded within the carrier member in a stacking relation to each other, said metallized layers being provided with respective center openings having a common center and being of sizes smaller than said center recess of the carrier member, each of said metallized layers having a plurality of conductor lines formed on a substrate for electrical interconnection between terminals of the integrated circuit chip and corresponding I/O pins, said shoulder of each I/O pin being in supporting contact with said substrate of a corresponding metallized layer, the conductor lines of each metallized layer having inner lead ends arranged on an inner peripheral edge portion around the center opening thereof, and said center opening being of a size larger in an upper metallized layer than in a lower metallized layer such that the inner lead ends of the conductor lines on the metallized layers are exposed in the center recess of the carrier member in a staggered relation with each other for permitting the conductor lines of the individual metallized layers to be connected to the integrated circuit chip at the staggered inner lead ends; a heat sink integrally embedded into the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting thereon said integrated circuit chip; and at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface thereof for abutment against a support member on which the package is to be mounted with I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member; wherein each of said metallized layer has a plurality of through holes into which corresponding I/O pins extend respectively with distal top ends projecting above the conductor lines, the upper metallized layer having clearance holes which are in registration with the through holes in the lower metallized layer and into which extend the distal top ends of the I/O pins which are to be electrically connected to the conductor lines of the lower metallized layer; said carrier member being formed in the top surface at the through hole locations with soldering pits in which the distal top ends of the I/O pins are exposed together with adjacent portions of the corresponding conductor lines while the conductor lines located around the clearance holes in the upper metallized layer being sealed behind a surrounding wall of the soldering pits; and said soldering pits being filled with a soldering material for providing permanent interconnection between the I/O pins and the corresponding conductor lines in the respective metallized layers.

Claim 31

A plastic molded chip carrier package comprising: a carrier member for mounting an integrated circuit chip at a central portion, said carrier member, being made of a plastic material of a flat configuration, having a top surface and a bottom surface and having a center recess in which the integrated circuit chip is mounted; a plurality of I/O pins each having a shoulder at a top end portion integrally embedded into said carrier member to protrude from the bottom surface thereof; a plurality of metallized layers which are integrally embedded within the carrier member in a stacking relation to each other, said metallized layers being provided with respective center openings having a common center and being of sizes smaller than said center recess of the carrier member, each of said metallized layers having a plurality of conductor lines formed on a substrate for electrical interconnection between terminals of the integrated circuit chip and corresponding I/O pins, said shoulder of each I/O pin being in supporting contact with said substrate of a corresponding metallized layer, the conductor lines of each metallized layer having inner lead ends arranged on an inner peripheral edge portion around the center opening thereof, and said center opening being of a size larger in an upper metallized layer than in a lower metallized layer such that the inner lead ends of the conductor lines on the metallized layers are exposed in the center recess of the carrier member in a staggered relation with each other for permitting the conductor lines of the individual metallized layers to be connected to the integrated circuit chip at the staggered inner lead ends; a heat sink integrally embedded into the center portion of said carrier member with a bottom surface exposed to the bottom surface of the carrier member and with a top surface defining the bottom surface of said center recess for mounting thereon said integrated circuit chip; and at least one pair of positioning studs integrally molded with the carrier member to project from the bottom surface thereof for abutment against a support member on which the package is to be mounted with I/O pins plugged into metallized through holes formed therein for positive positioning of said package on the support member; wherein each of said metallized layer has a plurality of through holes into which corresponding I/O pins extend respectively with distal top ends projecting above the conductor lines, the upper metallized layer having clearance holes which are in registration with the through holes in the lower metallized layer and into which extend the distal top ends of the I/O pins which are to be electrically connected to the conductor lines of the lower metallized layer; said carrier member being formed in the top surface at the through hole locations with soldering pits in which the distal top ends of the I/O pins are exposed together with adjacent portions of the corresponding conductor lines while the conductor lines located around the clearance holes in the upper metallized layer being sealed behind a surrounding wall of the soldering pits; and said soldering pits being filled with a soldering material for providing permanent interconnection between the I/O pins and the corresponding conductor lines in the respective metallized layers.