EP0155044A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Plastic pin grid array chip carrier
Assignee: Augat Inc
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Filing: 1985-02-28
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Granted: —
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Expires: 2005-02-28
Abstract
Abstract A low cost injection-molded plastic pin grid array chip carrier is provided as an alternative to a ceramic pin grid array chip carrier, in which an electrically superior package is fabricated by supporting nested lead frames in the mold cavity at the centers of the lead frames through the provision of a central carrier for each of the nested lead frames, with the central carrier permitting a one shot molding process. In one embodiment the lead frames include square toroidal central carriers, with one set of nested lead frames being provided with offset leads such that all leads lie in the same plane in the package. Path resistance is lower than the ceramic pin grid array chip carrier because of the use of a copper lead frame as opposed to the sputtered tungsten used in ceramic packages. Interlead resistance is increased through the utilization of conical or pyramidal supports for the pins which lengthens the resistance paths between the leads. Due to the lower dielectric constant of plastic, the interlead capacitance is significantly reduced to permit higher speed operation and reduced cross-talk. The subject plastic pin grid array chip carrier is also electrically superior to a conventional glass epoxy package and can be produced at a fraction of the cost.
Inventors
- 👤 Richard Muehling
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-26 19:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/047; H10W70/048; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W70/479; H10W74/00; H10W74/01; H10W74/016; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W72/541; H10W72/5449
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
24 words
A plastic pin grid array package for electronic circuits in which concentric patterns of pins project normal to the bottom surface of the package.
Claim 2
Dependent Claim
24 words
A plastic pin grid array package for electronic circuits in which concentric patterns of pins project normal to the bottom surface of the package.
Claim 3
Dependent Claim
16 words
The package of claim 1 wherein the package is made in a one shot molding process.
Claim 4
Dependent Claim
22 words
The package of claim 2 wherein said package is formed by the insertion of centrally supported lead frames into a mold cavity.
Claim 5
Dependent Claim
26 words
The package of claim 3 wherein said centrally supported lead frames are each supported by toroidal carriers prior to molding, said carriers being removed after molding.
Claim 6
Dependent Claim
38 words
The package of claim 3 wherein said centrally supported lead frames are each supported by carriers and wherein said carriers are stacked one on top of the other in said mold cavity, said carriers being removed after molding.
Claim 7
Dependent Claim
22 words
The package of claim 5 wherein the leads of one carrier are offset to the plane of the leads of another carrier.
Claim 8
Dependent Claim
17 words
The package of claim 3 wherein the leads of said lead frames are interdigitated in said package.
Claim 9
Dependent Claim
20 words
The package of claim 1 wherein the pins of said pin grid array are surrounded by tapered projections of plastic.
Claim 10
Dependent Claim
47 words
The package of claim 1 wherein the package includes a central aperture, a heat sink to one side of said aperture, a die on said heat sink, said die having contact pads electrically connected to said pins, and a cover to an opposing side of said aperture.
Claim 11
Dependent Claim
17 words
The package of claim 9 wherein said cover is plastic and is ultrasonically bonded to said package.
Claim 12
Independent Claim
191 words
A method of making pin grid array electronic component packages comprising the steps of: providing a mold cavity having cooperating mold halves with pin receiving apertures to accommodate the ends of lead frames corresponding to the pins, locating lead frames supported by central carriers in the mold cavity, each lead frame having leads which have ends perpendicular to the corresponding lead, with the central carriers stacked one on top of the other in the mold cavity such that the lead frame ends project through corresponding pin receiving apertures, said mold cavity being configured to prevent injection molded material from entering a central region at which the central carriers are located, thereby to leave a central aperture in the part to be molded; injecting a low dielectric constant material into the mold cavity; removing the injection molded part; removing the central carriers from the central aperture; affixing a support to one side of the central aperture; mounting an electronic component on the support, said component having contact pads; electrically connecting the electronic component contact pads to different lead frame leads; and mounting a cover to the opposing side of the central aperture.
Claim 13
Independent Claim
191 words
A method of making pin grid array electronic component packages comprising the steps of: providing a mold cavity having cooperating mold halves with pin receiving apertures to accommodate the ends of lead frames corresponding to the pins, locating lead frames supported by central carriers in the mold cavity, each lead frame having leads which have ends perpendicular to the corresponding lead, with the central carriers stacked one on top of the other in the mold cavity such that the lead frame ends project through corresponding pin receiving apertures, said mold cavity being configured to prevent injection molded material from entering a central region at which the central carriers are located, thereby to leave a central aperture in the part to be molded; injecting a low dielectric constant material into the mold cavity; removing the injection molded part; removing the central carriers from the central aperture; affixing a support to one side of the central aperture; mounting an electronic component on the support, said component having contact pads; electrically connecting the electronic component contact pads to different lead frame leads; and mounting a cover to the opposing side of the central aperture.
Claim 14
Dependent Claim
12 words
The method of claim 11 wherein said pin receiving apertures are tapered.
Claim 15
Dependent Claim
18 words
The method of claim 11 wherein the ends of the lead frames define a concentric array of pins.
Claim 16
Dependent Claim
19 words
The method of claim 11 wherein said support is highly thermally conductive so as to form a heat sink.
Claim 17
Dependent Claim
14 words
The method of claim 11 wherein said cover and said injected material is plastic.
Claim 18
Dependent Claim
18 words
The method of claim 15 wherein said cover is bonded to the injection molded part by plastic reflow.
Claim 19
Dependent Claim
41 words
5 17. The method of claim 11 wherein said central carriers each have an aperture and wherein one half of said mold cavity has a projection which passes through the carrier apertures to locate said lead frames within said mold cavity.
References Cited (Backward Citations)
No citation records indexed.
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