US3585272A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package of alumina and aluminum
Assignee: Fairchild Semiconductor Corp
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Filing: 1969-10-01
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Granted: 1971-06-15
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Expires: 1989-10-01
Abstract
Abstract A semiconductor package capable of dissipating large amounts of power consists of a first portion of hard, electrically insulating material containing a cavity for holding a semiconductor ship and a second underlying portion of softer insulating material separated from the first portion by a layer of pliable, thermally conductive material.
Inventors
- 👤 Solomon Shatz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 13:30
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/132; H10W40/00; H10W40/70
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
99 words
A microelectronic package comprising: a first portion of electrically nonconducting material containing a cavity therein for holding a semiconductor chip; and a bottom second portion adjacent said first portion but separated therefrom by a layer of pliable high-heat conductivity material; said first and second portions containing selected passages, the passages through said first portion being aligned with thE passages through said second portion, said passages in said first and second portions containing electrically conductive pins which run from the cavity in said first portion through said first and second portions and extend a selected distance beyond said second portion.
Claim 2
Dependent Claim
33 words
Structure as in claim 2 in which said first portion possesses a first thermal expansion coefficient and said second portion possesses a second thermal expansion coefficient different from said first thermal expansion coefficient.
Claim 3
Dependent Claim
23 words
Structure as in claim 2 in which the second portion of said package is more ductile than said first portion of said package.
Claim 4
Dependent Claim
38 words
Structure as in claim 2 in which first portion of said package is alumina ceramic, said second portion of said package is anodized aluminum, and said first and second portions are separated by a layer of silicone grease.
Claim 5
Dependent Claim
13 words
Structure as in claim 5 in which said silicone grease contains beryllia spheres.
Claim 6
Dependent Claim
51 words
Structure as in claim 5 including a semiconductor chip hermetically sealed in said cavity by a layer of material extending across and closing said cavity, said semiconductor chip being connected by electrically conductive leads to said electrically conductive pins, said pins being hermetically sealed to said passages in said first portion.
Claim 7
Dependent Claim
25 words
Structure as in claim 7 in which said hermetic seal across said cavity is flush with one surface of said first portion of said package.
Claim 8
Dependent Claim
57 words
Structure as in claim 5 including a semiconductor chip sealed in said cavity by a plastic extending across and closing said cavity, said semiconductor chip being connected by electrically conductive leads to said electrically conductive pins, said plastic also occupying the annular spaces in said passages in said first portion between said pins and said first portion.
References Cited (Backward Citations)
US3118016A
Cited
US3469684A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-06-14 | 1974-12-14 | 1975-06-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-06-14 | 1978-12-14 | 1979-06-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-06-14 | 1982-12-14 | 1983-06-15 | $7700.00 | Window Closed / Lapsed |