EPROM device and a manufacturing method thereof

Claim 1

An EPROM device comprising: a lead frame including a chip mounting portion and a plurality of terminal portions thereon, each said terminal portion including an inner portion and an outer portion; an EPROM chip mounted on said chip mounting portion, said EPROM chip having a main surface and being connected to said terminal portions by thin metal wires; a hollow cap mounted on said lead frame and covering said EPROM chip and said wires, said cap including a head portion made of a material which passes UV rays therethrough, said cap defining an interior space; a UV ray permeable resin filling at least a gap portion of said space between said head portion of said hollow cap and said main surface of said EPROM chip and thereby forming a UV ray transmissive path from said head portion to said main surface; a first insulating resin filling a remaining portion of said space around said UV ray permeable resin and thereby forming therewith a double filling resin structure completely filling said space; and a second insulating resin enclosing said cap except for said head portion thereof and enclosing said inner portions of said terminal portions of said lead frame.