Resin-sealed type semiconductor device

Abstract

Abstract PURPOSE:To contrive not to generate the decrease of erasure function for a long period by a method wherein the upper surface of a phototransmitting body adhesion-fixed on the element forming surface of a semiconductor chip exposes out of a resin package. CONSTITUTION:The phototransmitting body 28 of quartz glass, etc. which has a fixed size for covering at least the memory cell region 27 of the EP-ROM chip 22, has a fixed height to the degree that a chip stage 21 is slightly pressed down via the ROM chip 22 by a mold upper die at the time of mold forming, and transmits ultraviolet rays satisfactorily is adhered accurately on the cell region 27 of the EP-ROM chip 22 by the same means such as bonding after coating adhesive material 29 over the lower surface of this phototransmitting body 28. Next, the phototransmitting body 28 is fixed on the chip 22 by curing the adhesive material 29 at a temperature of 180 deg.C or more. Then, lead frames LF are mounted in a conventional mold die, thus resin forming is performed by means of mold resin such as epoxy as conventional, next the cure of mold resin is performed, and finally a desired region having said assembly completed body is buried into a resin case 30.

Inventors

• 👤 Rikuro Sono
• 👤 薗　陸郎
• 👤 Toshio Komuro
• 👤 小室　利雄

Bibliographic Details