US4355463A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for hermetically encapsulating semiconductor devices
Assignee: National Semiconductor Corp
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Filing: 1980-03-24
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Granted: 1982-10-26
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Expires: 2000-03-24
Abstract
Abstract A tape assembly process attaches semiconductor chips to a tape via thermocompression gang bonding and the tape is wound onto a reel. The tape is fabricated during its manufacture to have a plurality of spaced finger array patterns. The inner finger ends are located so as to mate with the bonding pads of a semiconductor device and are bonded thereto. A ring-shaped strip is included in each finger pattern that joins all of the fingers in each pattern into a unitary structure in which the fingers are accurately spaced. Where the ring joins onto the fingers, weakened regions are introduced and the side of the tape that contains the semiconductor device includes a recess that is in registry with the ring. A ceramic substrate that will ultimately mount the semiconductor device is provided with an array of conductor patterns that match the tape finger patterns. A layer of sealing glass is screened over the ceramic, so as to align with the ring. Then the tape fingers are thermocompression bonded to the metal pattern, so that a bond is created for each finger on both sides of the glass. The ring is then mechanically stripped away with the weakened regions determining where the metal will rupture. This leaves a finger element on each side of the glass ring with the underlying conductor providing electrical continuity. The glass ring can then be joined to a ceramic cover that has a matching glass ring. The assembly is heat sealed to provide a hermetic housing.
Inventors
- 👤 Carmen D. Burns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 05:01
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/421; H10W72/071; H10W72/0711; H10W72/077; H10W95/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/49789; Y10T29/4979
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
342 words
A tape assembly process for hermetically encapsulating semiconductive devices secured to a tape having a plurality of fingers defining a plurality of metal finger patterns, one pattern each for each semiconductive device, said finger patterns including an inner end arrayed to conform with the contact pads of the semiconductive device which is secured thereto, said process comprising the steps: applying a series of conductive patterns around the periphery of a first ceramic part that is to become a portion of a housing for said semiconductive device, said conductive patterns being arrayed so that individual conductors register with said fingers in said finger patterns and radiate outward toward an outer edge of said first ceramic part; applying a first ring of sealing glass over said conductive patterns so as to lie wholly within said conductive patterns which thereby extend on both sides of said first ring; forming a metal ring on said metal finger pattern, thereby to mechanically join the fingers thereof together in each successive pattern on said tape, said metal ring having regions of mechanical weakness where it joins each finger and being shaped so as to conform with said first glass ring; aligning said first ceramic part with respect to said tape so that said first glass ring is located in registry with said metal ring; bonding said fingers in said patterns to said conductive patterns to secure adherence thereto, on both sides of said glass ring, whereby said metal ring lies over said glass ring; removing said metal ring by stripping so as to break said regions of mechanical weakness, thereby exposing said first glass ring; forming a second ceramic part that mates with said first ceramic part; applying a second ring of sealing glass to the periphery of said second ceramic part to conform to said glass ring on said first ceramic part; bringing said first and second ceramic parts together so that said first and second glass rings abut; and sealing said first and second ceramic parts together by means of said first and second glass rings.
Claim 2
Dependent Claim
342 words
A tape assembly process for hermetically encapsulating semiconductive devices secured to a tape having a plurality of fingers defining a plurality of metal finger patterns, one pattern each for each semiconductive device, said finger patterns including an inner end arrayed to conform with the contact pads of the semiconductive device which is secured thereto, said process comprising the steps: applying a series of conductive patterns around the periphery of a first ceramic part that is to become a portion of a housing for said semiconductive device, said conductive patterns being arrayed so that individual conductors register with said fingers in said finger patterns and radiate outward toward an outer edge of said first ceramic part; applying a first ring of sealing glass over said conductive patterns so as to lie wholly within said conductive patterns which thereby extend on both sides of said first ring; forming a metal ring on said metal finger pattern, thereby to mechanically join the fingers thereof together in each successive pattern on said tape, said metal ring having regions of mechanical weakness where it joins each finger and being shaped so as to conform with said first glass ring; aligning said first ceramic part with respect to said tape so that said first glass ring is located in registry with said metal ring; bonding said fingers in said patterns to said conductive patterns to secure adherence thereto, on both sides of said glass ring, whereby said metal ring lies over said glass ring; removing said metal ring by stripping so as to break said regions of mechanical weakness, thereby exposing said first glass ring; forming a second ceramic part that mates with said first ceramic part; applying a second ring of sealing glass to the periphery of said second ceramic part to conform to said glass ring on said first ceramic part; bringing said first and second ceramic parts together so that said first and second glass rings abut; and sealing said first and second ceramic parts together by means of said first and second glass rings.
Claim 3
Dependent Claim
18 words
The process of claim 1, wherein said first ceramic part includes a cup for accommodating said semiconductor device.
Claim 4
Dependent Claim
20 words
The process of claim 2 further including the step of securing said semiconductor device to the bottom of said cup.
Claim 5
Dependent Claim
25 words
The process of claim 1, wherein said first ceramic part is flat and said second ceramic part includes a cup to accommodate said semiconductor device.
Claim 6
Dependent Claim
19 words
The process of claim 4 further including the step of securing said semiconductor device to said first ceramic part.
Claim 7
Dependent Claim
21 words
The process of claim 1, wherein both said first and second ceramic parts are cup shaped to accommodate said semiconductor device.
Claim 8
Dependent Claim
22 words
The process of claim 1, further including the step of shaping said metal fingers so that they clear said first glass ring.
Claim 9
Dependent Claim
20 words
The process of claim 7, wherein said shaping is achieved by etching said fingers during the making of said tape.
Claim 10
Dependent Claim
16 words
The process of claim 7, wherein said shaping is achieved by mechanical deformation of said fingers.
Claim 11
Dependent Claim
9 words
The product manufactured by the process of claim 1.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-10-25 | 1986-04-26 | 1986-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-10-25 | 1990-04-26 | 1990-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-10-25 | 1994-04-26 | 1994-10-26 | $7700.00 | Window Closed / Lapsed |