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US7476586B2 Expired / Lapsed US ⏱️ 0.0 years remaining

NOR flash memory cell with high storage density

Assignee: Micron Technology Inc
•
Filing: 2006-07-20
•
Granted: 2009-01-13
•
Expires: 2026-07-20
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Abstract

Abstract Structures and methods for NOR flash memory cells, arrays and systems are provided. The NOR flash memory cell includes a vertical floating gate transistor extending outwardly from a substrate. The floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate separated from the channel region by a gate insulator, and a control gate separated from the floating gate by a gate dielectric. A sourceline is formed in a trench adjacent to the vertical floating gate transistor and coupled to the first source/drain region. A transmission line coupled to the second source/drain region. And, a wordline is coupled to the control gate perpendicular to the sourceline.

Inventors

  • 👤 Leonard Forbes

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 08:42
CPC Classifications
H; H10; H10B; H10B69/00; G; G11; G11C; G11C16/00; G11C16/02; G11C16/04; G11C16/0408; G11C16/0416; H10B41/00; H10B41/20; H10B41/23; H10B41/27; H10B41/30; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/0411; H10D30/60; H10D30/68; H10D30/681; H10D30/684; H10D30/685; H10D30/686; G11C2216/00; G11C2216/12; G11C2216/28

Claims Analysis

Total Claims: 26
Claim 1
Independent Claim 147 words
A method for forming a NOR flash memory cell, comprising: forming a vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate separated from the channel region by a gate insulator, and a control gate separated from the floating gate by a gate dielectric; forming a sourceline in a trench adjacent to the vertical floating gate transistor; coupling the first source/drain region to the sourceline; coupling a transmission line to the second source/drain region; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 2
Independent Claim 147 words
A method for forming a NOR flash memory cell, comprising: forming a vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate separated from the channel region by a gate insulator, and a control gate separated from the floating gate by a gate dielectric; forming a sourceline in a trench adjacent to the vertical floating gate transistor; coupling the first source/drain region to the sourceline; coupling a transmission line to the second source/drain region; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 3
Dependent Claim 26 words
The method of claim 1 , wherein forming each floating gate includes forming each floating gate in a trench below a top surface of the pillar.
Claim 4
Dependent Claim 27 words
The method of claim 1 , wherein forming the floating gate includes forming a vertically oriented floating gate having a vertical length of less than 100 nanometers.
Claim 5
Dependent Claim 41 words
The method of claim 1 , wherein forming a vertical floating gate transistor includes forming a pair of floating gates within a trench, and wherein forming a control gate includes forming a single control gate over the pair of floating gates.
Claim 6
Dependent Claim 39 words
The method of claim 1 , wherein forming a vertical floating gate transistor includes forming a pair of floating gates within a trench, and wherein a pair of control gates is formed over the pair of floating gates respectively.
Claim 7
Dependent Claim 33 words
The method of claim 1 , wherein forming the vertical floating gate transistor includes forming a vertical floating gate transistor having a size of approximately 2.0 lithographic features squared (2 F 2 ).
Claim 8
Independent Claim 145 words
A method for forming a NOR flash memory cell, comprising: forming a vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate separated from the channel region by a gate insulator, and a control gate separated from the floating gate by a gate dielectric; forming a sourceline in a trench adjacent to the vertical floating gate transistor; coupling the first source/drain region to the sourceline; coupling a bitline to the second source/drain region; and wherein the NOR flash memory cell is configured to program in a reverse direction to trap a charge in the floating gate, such that the programmed floating gate transistor operates at reduced drain source current when read in a forward direction.
Claim 9
Independent Claim 145 words
A method for forming a NOR flash memory cell, comprising: forming a vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate separated from the channel region by a gate insulator, and a control gate separated from the floating gate by a gate dielectric; forming a sourceline in a trench adjacent to the vertical floating gate transistor; coupling the first source/drain region to the sourceline; coupling a bitline to the second source/drain region; and wherein the NOR flash memory cell is configured to program in a reverse direction to trap a charge in the floating gate, such that the programmed floating gate transistor operates at reduced drain source current when read in a forward direction.
Claim 10
Dependent Claim 26 words
The method of claim 7 , wherein forming each floating gate includes forming each floating gate in a trench below a top surface of the pillar.
Claim 11
Dependent Claim 41 words
The method of claim 7 , wherein forming a vertical floating gate transistor includes forming a pair of floating gates within a trench, and wherein forming a control gate includes forming a single control gate over the pair of floating gates.
Claim 12
Dependent Claim 39 words
The method of claim 7 , wherein forming a vertical floating gate transistor includes forming a pair of floating gates within a trench, and wherein a pair of control gates is formed over the pair of floating gates respectively.
Claim 13
Independent Claim 178 words
A method for forming a NOR flash memory cell, comprising: forming a vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate separated from the channel region by a gate insulator, and a control gate separated from the floating gate by a gate dielectric, wherein the control gate is a common control gate shared by the floating gate and a second floating gate of a reference transistor located on an opposite side of a trench; forming a sourceline in the trench adjacent to the vertical floating gate transistor; coupling the first source/drain region to the sourceline; coupling a transmission line to the second source/drain region; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 14
Independent Claim 178 words
A method for forming a NOR flash memory cell, comprising: forming a vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a floating gate separated from the channel region by a gate insulator, and a control gate separated from the floating gate by a gate dielectric, wherein the control gate is a common control gate shared by the floating gate and a second floating gate of a reference transistor located on an opposite side of a trench; forming a sourceline in the trench adjacent to the vertical floating gate transistor; coupling the first source/drain region to the sourceline; coupling a transmission line to the second source/drain region; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 15
Dependent Claim 33 words
The method of claim 11 , wherein forming a sourceline in a trench includes forming a common sourceline in the trench coupled to both the vertical floating gate transistor and the reference transistor.
Claim 16
Dependent Claim 17 words
The method of claim 12 , wherein forming the sourceline includes implanting a dopant into the trench.
Claim 17
Dependent Claim 27 words
The method of claim 11 , wherein forming a vertical floating gate transistor includes forming a control gate between a pair of floating gates in the trench.
Claim 18
Independent Claim 238 words
A method for forming a NOR flash memory cell, comprising: forming a first vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the first floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a first floating gate separated from the channel region by a gate insulator, and a first control gate separated from the floating gate by a gate dielectric; forming a second vertical floating gate reference transistor from an adjacent vertical pillar extending outwardly from the substrate, the second floating gate reference transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a second floating gate separated from the channel region by a gate insulator, and a second control gate separated from the second floating gate by a gate dielectric; wherein the first floating gate, the second floating gate, the first control gate, and the second control gate are all located in a trench between vertical pillars; coupling the first source/drain regions to a common sourceline; coupling a transmission line to the second source/drain regions; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 19
Independent Claim 238 words
A method for forming a NOR flash memory cell, comprising: forming a first vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the first floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a first floating gate separated from the channel region by a gate insulator, and a first control gate separated from the floating gate by a gate dielectric; forming a second vertical floating gate reference transistor from an adjacent vertical pillar extending outwardly from the substrate, the second floating gate reference transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions, a second floating gate separated from the channel region by a gate insulator, and a second control gate separated from the second floating gate by a gate dielectric; wherein the first floating gate, the second floating gate, the first control gate, and the second control gate are all located in a trench between vertical pillars; coupling the first source/drain regions to a common sourceline; coupling a transmission line to the second source/drain regions; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 20
Dependent Claim 22 words
The method of claim 15 , further including forming the common sourceline by implanting a dopant into a base of the trench.
Claim 21
Dependent Claim 31 words
The method of claim 15 , wherein the first control gate, and the second control gate are located above the first floating gate and the second floating gate within the trench.
Claim 22
Dependent Claim 31 words
The method of claim 15 , wherein the first control gate, and the second control gate are located between the first floating gate and the second floating gate within the trench.
Claim 23
Independent Claim 204 words
A method for forming a NOR flash memory cell, comprising: forming a first vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the first floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions; forming a second vertical floating gate reference transistor from an adjacent vertical pillar extending outwardly from the substrate, the second floating gate reference transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions; forming a single shared floating gate in a trench between the channel regions of the first vertical floating gate transistor and the second vertical floating gate reference transistor; forming a single shared control gate within the trench, separated from the single shared floating gate by an insulator layer; coupling the first source/drain regions to a common sourceline; coupling a transmission line to the second source/drain regions; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 24
Independent Claim 204 words
A method for forming a NOR flash memory cell, comprising: forming a first vertical floating gate transistor from a vertical pillar extending outwardly from a substrate, the first floating gate transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions; forming a second vertical floating gate reference transistor from an adjacent vertical pillar extending outwardly from the substrate, the second floating gate reference transistor having a first source/drain region, a second source/drain region, a channel region between the first and the second source/drain regions; forming a single shared floating gate in a trench between the channel regions of the first vertical floating gate transistor and the second vertical floating gate reference transistor; forming a single shared control gate within the trench, separated from the single shared floating gate by an insulator layer; coupling the first source/drain regions to a common sourceline; coupling a transmission line to the second source/drain regions; and coupling circuitry to the source/drain regions to store a charge in the floating gate in a first direction such that the programmed floating gate transistor operates at reduced drain source current when read in a second direction opposite from the first direction.
Claim 25
Dependent Claim 28 words
The method of claim 19 , wherein forming the floating gate includes forming a floating gate having a vertical height within the trench of less than 100 nanometers.
Claim 26
Dependent Claim 22 words
The method of claim 19 , further including forming the common sourceline by implanting a dopant into a base of the trench.

References Cited (Backward Citations)

US3665423A Cited
US3641516A Cited
US3877054A Cited
US3964085A Cited
US4152627A Cited
US4217601A Cited
US4507673A Cited
US4939559A Cited
US4661833A Cited
US5021999A Cited
US5293560A Cited
US4888733A Cited
US5042011A Cited
US5111430A Cited
US5027171A Cited
JPH03222367A Cited
US5253196A Cited
US5449941A Cited
US5399516A Cited
US5388069A Cited
US5280205A Cited
US5317535A Cited
US5550770A Cited
US5409859A Cited
US5508544A Cited
JPH06224431A Cited
US5438544A Cited
JPH06302828A Cited
US5539279A Cited
US6521950B1 Cited
US5493140A Cited
US5298447A Cited
US5467306A Cited
US5430670A Cited
US5424993A Cited
US5541872A Cited
US5541871A Cited
US5434815A Cited
US5508543A Cited
US5410504A Cited
US5485422A Cited
US5457649A Cited
US5572459A Cited
US5627781A Cited
US5600587A Cited
US5477485A Cited
US5891773A Cited
JPH08255878A Cited
US5530668A Cited
US5530581A Cited
US5670790A Cited
US5714766A Cited
US5627785A Cited
US5768192A Cited
US5912488A Cited
US5916365A Cited
US5989958A Cited
US5959896A Cited
US6166401A Cited
US5852306A Cited
US5801401A Cited
US5740104A Cited
US5754477A Cited
US5856688A Cited
US6115281A Cited
US6143636A Cited
US5973356A Cited
US5936274A Cited
US6238976B1 Cited
US6072209A Cited
US6150687A Cited
US6249020B1 Cited
US6031263A Cited
US5886368A Cited
US6566699B2 Cited
US6552387B1 Cited
US6011725A Cited
WO1999007000A2 Cited
US6313518B1 Cited
US5828605A Cited
US6246606B1 Cited
US6545314B2 Cited
US6140181A Cited
US6351411B2 Cited
US6232643B1 Cited
US6252793B1 Cited
US5943262A Cited
US5991225A Cited
US6124729A Cited
US6153468A Cited
US6294813B1 Cited
US6125062A Cited
US6141260A Cited
US20020003252A1 Cited
US6185122B1 Cited
US6034882A Cited
US6504755B1 Cited
US6141237A Cited
US6212103B1 Cited
US20020027264A1 Cited

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